ZHCSJ99L December   1997  – August 2022 SN74CBTLV3126

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1. 8.4.1 Function Table (Each Bus Switch)
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Protocol and Signal Isolation
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 接收文档更新通知
    2. 12.2 支持资源
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 术语表
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • D|14
  • DBQ|16
  • RGY|14
  • PW|14
  • DGV|14
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.3 Recommended Operating Conditions

(1)
MINMAXUNIT
VCCSupply voltage2.33.6V
VIHHigh-level control input voltageVCC = 2.3 V to 2.7 V1.7VCCV
VCC = 2.7 V to 3.6 V2VCC
VILLow-level control input voltageVCC = 2.3 V to 2.7 V0.7V
VCC = 2.7 V to 3.6 V0.8
TAOperating free-air temperature–4085°C
(1) All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004.