ZHCSV54B July   2006  – March 2024 SN65MLVD047A

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Pin Configuration
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Package Dissipation Ratings
    5. 5.5 Thermal Information
    6. 5.6 Device Electrical Characteristics
    7. 5.7 Device Electrical Characteristics
    8. 5.8 Switching Characteristics
    9. 5.9 Typical Characteristics
  7. Parameter Measurement Information
  8. Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Synchroization Clock in AdvancedTCA
      2. 8.1.2 Multipoint Configuration
      3. 8.1.3 Multidrop Configuration
      4. 8.1.4 Unused Channel
  10. Device and Documentation Support
    1. 9.1 接收文档更新通知
    2. 9.2 支持资源
    3. 9.3 Trademarks
    4. 9.4 静电放电警告
    5. 9.5 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

ESD Ratings

VALUEUNIT
V (ESD)Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)Y and Z±9000V
All pins±4000
Charged device model (CDM), per AEC Q100-011(2)All pins±1500
Machine ModelAll pins±200
JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.