ZHCSV54B July   2006  – March 2024 SN65MLVD047A

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Pin Configuration
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Package Dissipation Ratings
    5. 5.5 Thermal Information
    6. 5.6 Device Electrical Characteristics
    7. 5.7 Device Electrical Characteristics
    8. 5.8 Switching Characteristics
    9. 5.9 Typical Characteristics
  7. Parameter Measurement Information
  8. Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Synchroization Clock in AdvancedTCA
      2. 8.1.2 Multipoint Configuration
      3. 8.1.3 Multidrop Configuration
      4. 8.1.4 Unused Channel
  10. Device and Documentation Support
    1. 9.1 接收文档更新通知
    2. 9.2 支持资源
    3. 9.3 Trademarks
    4. 9.4 静电放电警告
    5. 9.5 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Typical Characteristics

GUID-4EA89998-0C6F-45A9-A640-2BC20E7E88DA-low.gifFigure 5-1 RMS Supply Current vs Input Frequency
GUID-DE6454B1-4B31-47F3-B438-638F624A4CE9-low.gifFigure 5-3 Differential Output Voltage Magnitude vs Input Frequency
GUID-7FC45103-52F9-41D9-8CF8-BE7B434D0550-low.gifFigure 5-5 Driver Transition Time vs Free-Air Temperature
GUID-ADEE9E77-3040-4ABF-ADEB-417F13784311-low.gifFigure 5-7 Period Jitter vs Clock Frequency
GUID-EA6F5D56-4CB2-42E4-AD69-2434AF86B4E4-low.gifFigure 5-2 RMS Supply Current vs Free-Air Temperature
GUID-06509E03-18DF-44A5-B802-5DAA80E41FCB-low.gifFigure 5-4 Driver Propagation Delay Time vs Free-Air Temperature
GUID-94980C12-5B7D-451E-967D-FCA3431E91A0-low.gifFigure 5-6 Peak-to-Peak Jitter vs Data Rate
GUID-48841FDB-436F-4D88-BF62-D6D4C7081F28-low.gifFigure 5-8 Cycle-to-Cycle Jitter vs Clock Frequency