ZHCSV54B July   2006  – March 2024 SN65MLVD047A

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Package Dissipation Ratings
    5. 5.5 Thermal Information
    6. 5.6 Device Electrical Characteristics
    7. 5.7 Device Electrical Characteristics
    8. 5.8 Switching Characteristics
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Synchroization Clock in AdvancedTCA
      2. 8.1.2 Multipoint Configuration
      3. 8.1.3 Multidrop Configuration
      4. 8.1.4 Unused Channel
  10. 9 Device and Documentation Support
    1. 9.1 接收文档更新通知
    2. 9.2 支持资源
    3. 9.3 Trademarks
    4. 9.4 静电放电警告
    5. 9.5 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.5 Thermal Information

PARAMETERTEST CONDITIONSVALUEUNIT
θJAJunction-to-ambient thermal resistanceLow-K board(1), no airflowD128°C/W
Low-K board(1), no airflowPW194.2
Low-K board(1), 150 LFM146.8
Low-K board(1), 250 LFM133.1
High-K board(2), no airflow121.6
θJBJunction-to-board thermal resistanceHigh-K board(2)D51.1°C/W
PW85.3
θJCJunction-to-case thermal resistanceD45.4°C/W
PW34.7
(1) In accordance with the Low-K thermal metric definitions of EIA/JESD51-3.
(2) In accordance with the High-K thermal metric definitions of EIA/JESD51-7.