ZHCSIE3B June   2018  – May 2019 LMZM33606

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
    1.     简化电路原理图
  3. 3 说明
    1.     最小解决方案尺寸
    2.     典型效率（自动模式）
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics (VIN = 12 V)
    8. 6.8 Typical Characteristics (VIN = 24 V)
    9. 6.9 Typical Characteristics (VIN = 36 V)
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Adjusting the Output Voltage
      2. 7.3.2  Input Capacitor Selection
      3. 7.3.3  Output Capacitor Selection
      4. 7.3.4  Transient Response
      5. 7.3.5  Feed-Forward Capacitor
      6. 7.3.6  Switching Frequency (RT)
      7. 7.3.7  Synchronization (SYNC/MODE)
      8. 7.3.8  Output Enable (EN)
      9. 7.3.9  Programmable System UVLO (EN)
      10. 7.3.10 Internal LDO and BIAS_SEL
      11. 7.3.11 Power Good (PGOOD) and Power Good Pull-Up (PGOOD_PU)
      12. 7.3.12 Mode Select (Auto or FPWM)
      13. 7.3.13 Soft Start and Voltage Tracking
      14. 7.3.14 Voltage Dropout
      15. 7.3.15 Overcurrent Protection (OCP)
      16. 7.3.16 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Active Mode
      2. 7.4.2 Auto Mode
      3. 7.4.3 FPWM Mode
      4. 7.4.4 Shutdown Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Output Voltage Setpoint
        2. 8.2.2.2 Setting the Switching Frequency
        3. 8.2.2.3 Input Capacitors
        4. 8.2.2.4 Output Capacitor Selection
        5. 8.2.2.5 Feed-Forward Capacitor (CFF)
        6. 8.2.2.6 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Theta JA vs PCB Area
    4. 10.4 Package Specifications
    5. 10.5 EMI
      1. 10.5.1 EMI Plots
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 第三方产品免责声明
    2. 11.2 接收文档更新通知
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 Glossary
  12. 12机械、封装和可订购信息
    1. 12.1 Tape and Reel Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RLX|41
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.9 Typical Characteristics (VIN = 36 V)

The typical characteristic data has been developed from actual products tested at 25°C. This data is considered typical for the device.
LMZM33606 D028_36VeffFPWMLin2.gif
FPWM Mode Linear Scale
Figure 21. Efficiency vs Output Current
LMZM33606 D029_36VeffFPWMLog.gif
FPWM Mode Log Scale
Figure 23. Efficiency vs Output Current
LMZM33606 D034_36VRippleFPWM.gif
FPWM Mode COUT = 4 × 47 µF ceramic
Figure 25. Voltage Ripple vs Output Current
LMZM33606 D033_36VPdis.gif
Figure 27. Power Dissipation vs Output Current
LMZM33606 D036_36Vto12VSOA.gif
VOUT = 12 V fSW = 800 kHz
PCB = 75 mm × 75 mm, 4-layer, 2 oz. copper
Figure 29. Safe Operating Area
LMZM33606 D030_36VeffAutoLin2.gif
Auto Mode Linear Scale
Figure 22. Efficiency vs Output Current
LMZM33606 D031_36VeffAutoLog.gif
Auto Mode Log Scale
Figure 24. Efficiency vs Output Current
LMZM33606 D032_36VRippleAuto.gif
Auto Mode COUT = 4 × 47 µF ceramic
Figure 26. Voltage Ripple vs Output Current
LMZM33606 D037_36Vto5VSOA.gif
VOUT = 5 V fSW = 500 kHz
PCB = 75 mm × 75 mm, 4-layer, 2 oz. copper
Figure 28. Safe Operating Area
LMZM33606 D035_36Vto20VSOA.gif
VOUT = 20 V fSW = 1 MHz
PCB = 75 mm × 75 mm, 4-layer, 2 oz. copper
Figure 30. Safe Operating Area