ZHCSN15B June   2020  – June 2021 LMK05318B

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 说明（续）
  6. 6 Pin Configuration and Functions
    1. 6.1 Device Start-Up Modes
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information: 4-Layer JEDEC Standard PCB
    5. 7.5 Thermal Information: 10-Layer Custom PCB
    6. 7.6 Electrical Characteristics
    7. 7.7 Timing Diagrams
    8. 7.8 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Output Clock Test Configurations
  9. 9 Detailed Description
    1. 9.1 Overview
      1. 9.1.1 ITU-T G.8262 (SyncE) Standards Compliance
    2. 9.2 Functional Block Diagram
      1. 9.2.1 PLL Architecture Overview
      2. 9.2.2 DPLL Mode
      3. 9.2.3 APLL-Only Mode
    3. 9.3 Feature Description
      1. 9.3.1  Oscillator Input (XO_P/N)
      2. 9.3.2  Reference Inputs (PRIREF_P/N and SECREF_P/N)
        1. 9.3.2.1 Programmable Input Hysteresis
      3. 9.3.3  Clock Input Interfacing and Termination
      4. 9.3.4  Reference Input Mux Selection
        1. 9.3.4.1 Automatic Input Selection
        2. 9.3.4.2 Manual Input Selection
      5. 9.3.5  Hitless Switching
        1. 9.3.5.1 Hitless Switching With 1-PPS Inputs
      6. 9.3.6  Gapped Clock Support on Reference Inputs
      7. 9.3.7  Input Clock and PLL Monitoring, Status, and Interrupts
        1. 9.3.7.1 XO Input Monitoring
        2. 9.3.7.2 Reference Input Monitoring
          1. 9.3.7.2.1 Reference Validation Timer
          2. 9.3.7.2.2 Amplitude Monitor
          3. 9.3.7.2.3 Frequency Monitoring
          4. 9.3.7.2.4 Missing Pulse Monitor (Late Detect)
          5. 9.3.7.2.5 Runt Pulse Monitor (Early Detect)
          6. 9.3.7.2.6 Phase Valid Monitor for 1-PPS Inputs
        3. 9.3.7.3 PLL Lock Detectors
        4. 9.3.7.4 Tuning Word History
        5. 9.3.7.5 Status Outputs
        6. 9.3.7.6 Interrupt
      8. 9.3.8  PLL Relationships
        1. 9.3.8.1  PLL Frequency Relationships
        2. 9.3.8.2  Analog PLLs (APLL1, APLL2)
        3. 9.3.8.3  APLL Reference Paths
          1. 9.3.8.3.1 APLL XO Doubler
          2. 9.3.8.3.2 APLL1 XO Reference (R) Divider
          3. 9.3.8.3.3 APLL2 Reference (R) Dividers
        4. 9.3.8.4  APLL Phase Frequency Detector (PFD) and Charge Pump
        5. 9.3.8.5  APLL Feedback Divider Paths
          1. 9.3.8.5.1 APLL1 N Divider With SDM
          2. 9.3.8.5.2 APLL2 N Divider With SDM
        6. 9.3.8.6  APLL Loop Filters (LF1, LF2)
        7. 9.3.8.7  APLL Voltage Controlled Oscillators (VCO1, VCO2)
          1. 9.3.8.7.1 VCO Calibration
        8. 9.3.8.8  APLL VCO Clock Distribution Paths (P1, P2)
        9. 9.3.8.9  DPLL Reference (R) Divider Paths
        10. 9.3.8.10 DPLL Time-to-Digital Converter (TDC)
        11. 9.3.8.11 DPLL Loop Filter (DLF)
        12. 9.3.8.12 DPLL Feedback (FB) Divider Path
      9. 9.3.9  Output Clock Distribution
      10. 9.3.10 Output Channel Muxes
      11. 9.3.11 Output Dividers (OD)
      12. 9.3.12 Clock Outputs (OUTx_P/N)
        1. 9.3.12.1 AC-Differential Output (AC-DIFF)
        2. 9.3.12.2 HCSL Output
        3. 9.3.12.3 1.8-V LVCMOS Output
        4. 9.3.12.4 Output Auto-Mute During LOL
      13. 9.3.13 Glitchless Output Clock Start-Up
      14. 9.3.14 Clock Output Interfacing and Termination
      15. 9.3.15 Output Synchronization (SYNC)
      16. 9.3.16 Zero-Delay Mode (ZDM) Synchronization for 1-PPS Input and Output
    4. 9.4 Device Functional Modes
      1. 9.4.1 Device Start-Up Modes
        1. 9.4.1.1 EEPROM Mode
        2. 9.4.1.2 ROM Mode
      2. 9.4.2 PLL Operating Modes
        1. 9.4.2.1 Free-Run Mode
        2. 9.4.2.2 Lock Acquisition
        3. 9.4.2.3 Locked Mode
        4. 9.4.2.4 Holdover Mode
      3. 9.4.3 PLL Start-Up Sequence
      4. 9.4.4 Digitally-Controlled Oscillator (DCO) Mode
        1. 9.4.4.1 DCO Frequency Step Size
        2. 9.4.4.2 DCO Direct-Write Mode
      5. 9.4.5 Zero-Delay Mode Synchronization
    5. 9.5 Programming
      1. 9.5.1 Interface and Control
      2. 9.5.2 I2C Serial Interface
        1. 9.5.2.1 I2C Block Register Transfers
      3. 9.5.3 SPI Serial Interface
        1. 9.5.3.1 SPI Block Register Transfer
      4. 9.5.4 Register Map and EEPROM Map Generation
      5. 9.5.5 General Register Programming Sequence
      6. 9.5.6 EEPROM Programming Flow
        1. 9.5.6.1 EEPROM Programming Using Method #1 (Register Commit)
          1. 9.5.6.1.1 Write SRAM Using Register Commit
          2. 9.5.6.1.2 Program EEPROM
        2. 9.5.6.2 EEPROM Programming Using Method #2 (Direct Writes)
          1. 9.5.6.2.1 Write SRAM Using Direct Writes
          2. 9.5.6.2.2 User-Programmable Fields In EEPROM
      7. 9.5.7 Read SRAM
      8. 9.5.8 Read EEPROM
      9. 9.5.9 EEPROM Start-Up Mode Default Configuration
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Device Start-Up Sequence
      2. 10.1.2 Power Down (PDN) Pin
      3. 10.1.3 Power Rail Sequencing, Power Supply Ramp Rate, and Mixing Supply Domains
        1. 10.1.3.1 Mixing Supplies
        2. 10.1.3.2 Power-On Reset (POR) Circuit
        3. 10.1.3.3 Powering Up From a Single-Supply Rail
        4. 10.1.3.4 Power Up From Split-Supply Rails
        5. 10.1.3.5 Non-Monotonic or Slow Power-Up Supply Ramp
      4. 10.1.4 Slow or Delayed XO Start-Up
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
    3. 10.3 Do's and Don'ts
  11. 11Power Supply Recommendations
    1. 11.1 Power Supply Bypassing
    2. 11.2 Device Current and Power Consumption
      1. 11.2.1 Current Consumption Calculations
      2. 11.2.2 Power Consumption Calculations
      3. 11.2.3 Example
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 Thermal Reliability
      1. 12.3.1 Support for PCB Temperature up to 105 °C
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 TICS Pro
      2. 13.1.2 Related Documentation
    2. 13.2 接收文档更新通知
    3. 13.3 支持资源
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 术语表
  14. 14Mechanical, Packaging, and Orderable Information

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9.3.11 Output Dividers (OD)

Each of the six output channels has an output divider after the output mux. The OUT[0:1] channel has a single output divider that is similar to the OUT[2:3] channel output divider. Each OUT[4:7] channel has an individual output divider. The output divider is used to generate the final clock output frequency from the source selected by the output mux.

Each OUT[0:6] channel has an 8-bit divider (OD) that can support output frequencies from 10 to 800 MHz (or up to the maximum frequency supported by the configured output driver type). It is possible to configure the PLL post-divider and output divider to achieve higher clock frequencies, but the output swing of the driver may fall out of specification.

The OUT7 channel has cascaded 8-bit (OD) and 24-bit (OD2) output dividers to support output frequencies from 1 Hz (1 PPS) to 800 MHz. The total OUT7 divide value is the product of the cascaded divider values (OD × OD2).

Each output divider is powered from the same VDDO_x supply used for the clock output drivers. The output divider can be powered down if not used to save power. For either OUT[0:1] or OUT[2:3] channel, the output divider is automatically powered down when both output drivers are disabled. For any OUT[4:7] channel, the output divider is automatically powered down when its output driver is disabled. For proper functioning of the output divider, clock frequency to the output divider should be under 3 GHz.