ZHCSK16A October 2017 – July 2019 LMK04228
PRODUCTION DATA.
Power consumption of the LMK04228 of devices can be high enough to require attention to thermal management. For reliability and performance reasons the die temperature should be limited to a maximum of 125°C. That is, as an estimate, TA (ambient temperature) plus device power consumption times RθJA should not exceed 125°C.
The package of the device has an exposed pad that provides the primary heat removal path as well as excellent electrical grounding to a printed-circuit board. To maximize the removal of heat from the package, a thermal land pattern including multiple vias to a ground plane must be incorporated on the PCB within the footprint of the package. The exposed pad must be soldered down to ensure adequate heat conduction out of the package.