ZHCSKF4C March   2017  – October 2019 LMH1228

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     简化方框图
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Recommended SMBus Interface Timing Specifications
    7. 6.7 Serial Parallel Interface (SPI) Timing Specifications
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 4-Level Input Pins and Thresholds
      2. 7.3.2 OUT0_SEL and SDI_OUT2_SEL Control
      3. 7.3.3 Input Signal Detect
      4. 7.3.4 Continuous Time Linear Equalizer (CTLE)
      5. 7.3.5 Clock and Data (CDR) Recovery
      6. 7.3.6 Internal Eye Opening Monitor (EOM)
      7. 7.3.7 Output Function Control
      8. 7.3.8 Output Driver Control
        1. 7.3.8.1 Line-Side Output Cable Driver (SDI_OUT1+, SDI_OUT2+)
          1. 7.3.8.1.1 Output Amplitude (VOD)
          2. 7.3.8.1.2 Output Pre-Emphasis
          3. 7.3.8.1.3 Output Slew Rate
          4. 7.3.8.1.4 Output Polarity Inversion
        2. 7.3.8.2 Host-Side 100-Ω Output Driver (OUT0±)
      9. 7.3.9 Status Indicators and Interrupts
        1. 7.3.9.1 LOCK_N (Lock Indicator)
        2. 7.3.9.2 SD_N (Signal Detect)
        3. 7.3.9.3 INT_N (Interrupt)
    4. 7.4 Device Functional Modes
      1. 7.4.1 System Management Bus (SMBus) Mode
        1. 7.4.1.1 SMBus Read and Write Transaction
          1. 7.4.1.1.1 SMBus Write Operation Format
          2. 7.4.1.1.2 SMBus Read Operation Format
      2. 7.4.2 Serial Peripheral Interface (SPI) Mode
        1. 7.4.2.1 SPI Read and Write Transactions
        2. 7.4.2.2 SPI Write Transaction Format
        3. 7.4.2.3 SPI Read Transaction Format
        4. 7.4.2.4 SPI Daisy Chain
    5. 7.5 Register Maps
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 SMPTE Requirements and Specifications
      2. 8.1.2 Low-Power Optimization
      3. 8.1.3 Optimized Loop Bandwidth Settings for Arria 10 FPGA Applications
    2. 8.2 Typical Applications
      1. 8.2.1 Dual Cable Driver
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Distribution Amplifier
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Board Stack-Up and Ground References
      2. 10.1.2 High-Speed PCB Trace Routing and Coupling
        1. 10.1.2.1 SDI_OUT1± and SDI_OUT2±:
        2. 10.1.2.2 IN0± and OUT0±:
      3. 10.1.3 Anti-Pads
      4. 10.1.4 BNC Connector Layout and Routing
      5. 10.1.5 Power Supply and Ground Connections
      6. 10.1.6 Footprint Recommendations
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 文档支持
      1. 11.1.1 相关文档
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 出口管制提示
    7. 11.7 Glossary
  12. 12机械、封装和可订购信息
    1. 12.1 Package Option Addendum
      1. 12.1.1 Packaging Information
      2. 12.1.2 Tape and Reel Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

8.2.1.2 Detailed Design Procedure

The design procedure for dual cable driver applications is as follows:

  1. Select a power supply that meets the DC and AC requirements in Recommended Operating Conditions.
  2. Choose a small 0402 surface mount ceramic capacitor for AC-coupling capacitors to maintain characteristic impedance.
  3. Choose a high-quality, 75-Ω BNC connector that is capable of supporting 11.88-Gbps applications. Consult a BNC supplier regarding insertion loss, impedance specifications, and recommended footprint for meeting SMPTE return loss.
  4. Follow detailed high-speed layout recommendations provided in Layout Guidelines to ensure optimal signal quality when interconnecting 75-Ω and 100-Ω signals to the LMH1228.
  5. Determine whether SPI or SMBus communication is necessary. If the LMH1228 must be programmed with settings other than what is offered by pin control, users must use SPI or SMBus Mode for additional programming.
  6. Configure OUT0_SEL and SDI_OUT2_SEL pins according to the desired default use case.
  7. Tune the SDI_VOD output amplitude control pin for optimal signal quality depending on the cable length attached at SDI_OUT1+ and SDI_OUT2+. Use register control for more tuning options if necessary.