SNOSDI2 March   2024 LMG3425R050

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. Parameter Measurement Information
    1. 6.1 Switching Parameters
      1. 6.1.1 Turn-On Times
      2. 6.1.2 Turn-Off Times
      3. 6.1.3 Drain-Source Turn-On Slew Rate
      4. 6.1.4 Turn-On and Turn-Off Switching Energy
    2. 6.2 Safe Operation Area (SOA)
      1. 6.2.1 Repetitive SOA
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  GaN FET Operation Definitions
      2. 7.3.2  Direct-Drive GaN Architecture
      3. 7.3.3  Drain-Source Voltage Capability
      4. 7.3.4  Internal Buck-Boost DC-DC Converter
      5. 7.3.5  VDD Bias Supply
      6. 7.3.6  Auxiliary LDO
      7. 7.3.7  Fault Protection
        1. 7.3.7.1 Overcurrent Protection and Short-Circuit Protection
        2. 7.3.7.2 Overtemperature Shutdown Protection
        3. 7.3.7.3 UVLO Protection
        4. 7.3.7.4 High-Impedance RDRV Pin Protection
        5. 7.3.7.5 Fault Reporting
      8. 7.3.8  Drive-Strength Adjustment
      9. 7.3.9  Temperature-Sensing Output
      10. 7.3.10 Ideal-Diode Mode Operation
        1. 7.3.10.1 Operational Ideal-Diode Mode
        2. 7.3.10.2 Overtemperature-Shutdown Ideal-Diode Mode
    4. 7.4 Start-Up Sequence
    5. 7.5 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Slew Rate Selection
        2. 8.2.2.2 Signal Level-Shifting
        3. 8.2.2.3 Buck-Boost Converter Design
      3. 8.2.3 Application Curves
    3. 8.3 Do's and Don'ts
    4. 8.4 Power Supply Recommendations
      1. 8.4.1 Using an Isolated Power Supply
      2. 8.4.2 Using a Bootstrap Diode
        1. 8.4.2.1 Diode Selection
        2. 8.4.2.2 Managing the Bootstrap Voltage
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
        1. 8.5.1.1 Solder-Joint Reliability
        2. 8.5.1.2 Power-Loop Inductance
        3. 8.5.1.3 Signal-Ground Connection
        4. 8.5.1.4 Bypass Capacitors
        5. 8.5.1.5 Switch-Node Capacitance
        6. 8.5.1.6 Signal Integrity
        7. 8.5.1.7 High-Voltage Spacing
        8. 8.5.1.8 Thermal Recommendations
      2. 8.5.2 Layout Examples
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Export Control Notice
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
  • RQZ|54
散热焊盘机械数据 (封装 | 引脚)
订购信息

Typical Characteristics

GUID-20220428-SS0I-SHTD-CJLZ-HMXZF9CMVLBC-low.svgFigure 5-1 Drain-Current Turn-On Delay Time vs Drive-Strength Resistance
GUID-20220428-SS0I-1ZZH-LCVJ-6HWWVWPXT2B2-low.svgFigure 5-3 Turn-On Rise Time vs Drive-Strength Resistance
GUID-20220503-SS0I-PLR4-JV3S-MQJ7XNKCJTCL-low.svg
 
Figure 5-5 Drain Current vs Drain-Source Voltage
GUID-20220428-SS0I-SDJK-6KKJ-49SJWWVLRCVW-low.svgFigure 5-7 Normalized On-Resistance vs Junction Temperature
GUID-20220505-SS0I-BTDF-NRJV-3C5DLWCB48WH-low.svg
VDD = 12V TJ = 25°C
Figure 5-9 VDD Supply Current vs IN Switching Frequency
GUID-20220429-SS0I-WBVH-W9VP-RL5F32FXRDH7-low.svgFigure 5-11 Half-Bridge Switching Energy vs Inductive Load Current
GUID-20220428-SS0I-F1PC-XWLF-02LGQZZ7FQFQ-low.svgFigure 5-2 Turn-On Delay Time vs Drive-Strength Resistance
GUID-20220428-SS0I-NFKV-7TBK-SZL73HDVKC0K-low.svgFigure 5-4 Turn-On Slew Rate vs Drive-Strength Resistance
GUID-20220428-SS0I-ZL4G-NRJX-CSSN3SD8V1PJ-low.svg
IN = 0V
Figure 5-6 Off-State Source-Drain Voltage vs Source Current
GUID-20220429-SS0I-FPZQ-FNFH-T0TKTCL575MK-low.svgFigure 5-8 Output Capacitance vs Drain-Source Voltage
GUID-20220505-SS0I-G3GK-JFTN-HCXLNTFN8VVK-low.svg
VDD = 12V TJ = 125°C
Figure 5-10 VDD Supply Current vs IN Switching Frequency
GUID-20220505-SS0I-GPCQ-GVF6-X9JTGJZZ9HGF-low.svgFigure 5-12 Repetitive Safe Operation Area