ZHCSUG9
January 2024
LMG3100R017
ADVANCE INFORMATION
1
1
特性
2
应用
3
说明
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Recommended Operating Conditions
5.4
Thermal Information
5.5
Electrical Characteristics
6
Typical Characteristics
7
Parameter Measurement Information
7.1
Propagation Delay and Mismatch Measurement
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Control Inputs
8.3.2
Start-up and UVLO
8.3.3
Bootstrap Supply Voltage Clamping
8.3.4
Level Shift
8.4
Device Functional Modes
Application and Implementation
9.1
Application Information
9.2
Typical Application
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.2.1
VCC Bypass Capacitor
9.2.2.2
Bootstrap Capacitor
9.2.2.3
Slew Rate Control
9.2.2.4
Use With Analog Controllers
9.2.2.5
Power Dissipation
Power Supply Recommendations
9.3
Layout
9.3.1
Layout Guidelines
9.3.2
Layout Examples
9
Device and Documentation Support
9.1
Documentation Support
9.1.1
Related Documentation
9.2
接收文档更新通知
9.3
支持资源
9.4
Trademarks
9.5
静电放电警告
9.6
术语表
10
Revision History
11
Mechanical, Packaging, and Orderable Information
11.1
Package Information
11.2
Tape and Reel Information
封装选项
机械数据 (封装 | 引脚)
VBE|15
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsug9_oa
9.5
静电放电警告
静电放电 (ESD) 会损坏这个集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序,可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级,大至整个器件故障。精密的集成电路可能更容易受到损坏,这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。