ZHCSNV5 October   2021 LM117HVQML-SP

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Related Products
  6. 6 Pin Configurations and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Parameter Drift
    7. 7.7 Quality Conformance Inspection
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
      1. 8.2.1 Simplified Device Schematic
    3. 8.3 Feature Description
      1. 8.3.1 Setting Output Voltage
      2. 8.3.2 Load Regulation
      3. 8.3.3 External Capacitors
      4. 8.3.4 Protection Diodes
  9. 9 Application and Implementation
    1. 9.1 Typical Applications
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 第三方产品免责声明
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 接收文档更新通知
    4. 12.4 支持资源
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 术语表
  13. 13Mechanical, Packaging, and Orderable Information

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订购信息

7.4 Thermal Information

THERMAL METRIC(1) LM117HVQML-SP UNIT
TO-39 (NDT) CFP (NAC)

3 PINS

(LM117H)

16 PINS

(LM117GW)
R θJA Junction-to-ambient thermal resistance Still air 186 130 °C/W
500 LF/min air flow 64 80
R θJC(bot) Junction-to-case (bottom) thermal resistance 21 7 °C/W
(1) For more information, see the Semiconductor and IC package thermal metrics application report.