ZHCSE07B July   2015  – September 2024 INA226-Q1

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Basic ADC Functions
        1. 6.3.1.1 Power Calculation
        2. 6.3.1.2 Alert Pin
    4. 6.4 Device Functional Modes
      1. 6.4.1 Averaging and Conversion Time Considerations
      2. 6.4.2 Filtering and Input Considerations
    5. 6.5 Programming
      1. 6.5.1 Programming the Calibration Register
      2. 6.5.2 Programming the Power Measurement Engine
        1. 6.5.2.1 Calibration Register and Scaling
      3. 6.5.3 Simple Current Shunt Monitor Usage (No Programming Necessary)
      4. 6.5.4 Default Settings
      5. 6.5.5 Bus Overview
        1. 6.5.5.1 Serial Bus Address
        2. 6.5.5.2 Serial Interface
        3. 6.5.5.3 Writing to and Reading From the INA226-Q1
          1. 6.5.5.3.1 High-Speed I2C Mode
        4. 6.5.5.4 SMBus Alert Response
  8. Registers
    1. 7.1 Register Maps
      1. 7.1.1  Configuration Register (00h) (Read/Write)
      2. 7.1.2  Shunt Voltage Register (01h) (Read-Only)
      3. 7.1.3  Bus Voltage Register (02h) (Read-Only) #GUID-792F23A7-1E45-4FB9-9334-0BF769622DE4/SBOS5477597
      4. 7.1.4  Power Register (03h) (Read-Only)
      5. 7.1.5  Current Register (04h) (Read-Only)
      6. 7.1.6  Calibration Register (05h) (Read/Write)
      7. 7.1.7  Mask/Enable Register (06h) (Read/Write)
      8. 7.1.8  Alert Limit Register (07h) (Read/Write)
      9. 7.1.9  Manufacturer ID Register (FEh) (Read-Only)
      10. 7.1.10 Die ID Register (FFh) (Read-Only)
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 High-Side Sensing Circuit Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 Trademarks
    5. 9.5 静电放电警告
    6. 9.6 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

特性

  • 具有符合 AEC-Q100 标准的下列特性:
    • 器件温度等级 1:-40°C 至 125°C
    • 器件 HBM ESD 分类等级 2
    • 器件 CDM ESD 分类等级 C4B
  • 功能安全型
  • 感测的总线电压范围:0V 至 36V
  • 高侧或低侧检测
  • 报告电流、电压和功率
  • 高精度:
    • 增益误差:0.1%(最大值)
    • 失调电压:10μV(最大值)
  • 可配置均值计算选项
  • 16 个可编程地址
  • 由 2.7V 至 5.5V 电源供电
  • 10 引脚 DGS (VSSOP) 封装