ZHCSE07B
July 2015 – September 2024
INA226-Q1
PRODUCTION DATA
1
1
特性
2
应用
3
说明
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Recommended Operating Conditions
5.4
Thermal Information
5.5
Electrical Characteristics
5.6
Typical Characteristics
6
Detailed Description
6.1
Overview
6.2
Functional Block Diagram
6.3
Feature Description
6.3.1
Basic ADC Functions
6.3.1.1
Power Calculation
6.3.1.2
Alert Pin
6.4
Device Functional Modes
6.4.1
Averaging and Conversion Time Considerations
6.4.2
Filtering and Input Considerations
6.5
Programming
6.5.1
Programming the Calibration Register
6.5.2
Programming the Power Measurement Engine
6.5.2.1
Calibration Register and Scaling
6.5.3
Simple Current Shunt Monitor Usage (No Programming Necessary)
6.5.4
Default Settings
6.5.5
Bus Overview
6.5.5.1
Serial Bus Address
6.5.5.2
Serial Interface
6.5.5.3
Writing to and Reading From the INA226-Q1
6.5.5.3.1
High-Speed I2C Mode
6.5.5.4
SMBus Alert Response
7
Registers
7.1
Register Maps
7.1.1
Configuration Register (00h) (Read/Write)
7.1.2
Shunt Voltage Register (01h) (Read-Only)
7.1.3
Bus Voltage Register (02h) (Read-Only) #GUID-792F23A7-1E45-4FB9-9334-0BF769622DE4/SBOS5477597
7.1.4
Power Register (03h) (Read-Only)
7.1.5
Current Register (04h) (Read-Only)
7.1.6
Calibration Register (05h) (Read/Write)
7.1.7
Mask/Enable Register (06h) (Read/Write)
7.1.8
Alert Limit Register (07h) (Read/Write)
7.1.9
Manufacturer ID Register (FEh) (Read-Only)
7.1.10
Die ID Register (FFh) (Read-Only)
8
Application and Implementation
8.1
Application Information
8.2
Typical Applications
8.2.1
High-Side Sensing Circuit Application
8.2.1.1
Design Requirements
8.2.1.2
Detailed Design Procedure
8.2.1.3
Application Curves
8.3
Power Supply Recommendations
8.4
Layout
8.4.1
Layout Guidelines
8.4.2
Layout Example
9
Device and Documentation Support
9.1
Device Support
9.1.1
Development Support
9.2
接收文档更新通知
9.3
支持资源
9.4
Trademarks
9.5
静电放电警告
9.6
术语表
10
Revision History
11
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
DGS|10
MPDS035C
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcse07b_oa
zhcse07b_pm
9.5
静电放电警告
静电放电 (ESD) 会损坏这个集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序,可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级,大至整个器件故障。精密的集成电路可能更容易受到损坏,这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。