ZHCSA85F August   2012  – February 2019 DLPC410

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      简化应用
  4. 4 修订历史记录
  5. 5 说明 （续）
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Electrical Characteristics
    5. 7.5 Timing Requirements
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 DLPC410 Binary Pattern Data Path
        1. 8.3.1.1  DIN_A, DIN_B, DIN_C, DIN_D Input Data Buses
        2. 8.3.1.2  DCLKIN Input Clocks
        3. 8.3.1.3  DVALID Input Signals
        4. 8.3.1.4  DOUT_A, DOUT_B, DOUT_C, DOUT_D Output Data Buses
        5. 8.3.1.5  DCLKOUT Output Clocks
        6. 8.3.1.6  SCTRL Output Signals
        7. 8.3.1.7  Supported DMD Bus Sizes
        8. 8.3.1.8  Row Cycle definition
        9. 8.3.1.9  DLP9500 and DLP9500UV Input Data Formatting
        10. 8.3.1.10 DLP7000 and DLP7000UV Input Data Bus
        11. 8.3.1.11 DLP650LNIR Input Data Bus
      2. 8.3.2 Data Bus Operations
        1. 8.3.2.1 Row Addressing
        2. 8.3.2.2 Single Row Write Operation
        3. 8.3.2.3 No-Op Row Cycle Description
      3. 8.3.3 DMD Block Operations
        1. 8.3.3.1 Mirror Clocking Pulse (MCP)
        2. 8.3.3.2 Reset Active (RST_ACTIVE)
        3. 8.3.3.3 DMD Block Control Signals
          1. 8.3.3.3.1 Block Mode - BLK_MD1:0)
          2. 8.3.3.3.2 Block Address - BLK_AD(3:0)
          3. 8.3.3.3.3 Reset 2 Blocks - RST2BLK
        4. 8.3.3.4 DMD Block Operations
          1. 8.3.3.4.1 Global Reset (MCP) Consideration
      4. 8.3.4 Other Data Control Inputs
        1. 8.3.4.1 Complement Data
        2. 8.3.4.2 North/South Flip
      5. 8.3.5 Miscellaneous Control Inputs
        1. 8.3.5.1 ARST
        2. 8.3.5.2 CLKIN_R
        3. 8.3.5.3 DMD_A_RESET
        4. 8.3.5.4 Watchdog Timer Enable (WDT_ENABLE)
      6. 8.3.6 Miscellaneous Status Outputs
        1. 8.3.6.1 INIT_ACTIVE
        2. 8.3.6.2 DMD_Type(3:0)
        3. 8.3.6.3 DDC_VERSION(3:0)
        4. 8.3.6.4 LED0
        5. 8.3.6.5 LED1
        6. 8.3.6.6 DLPA200 Control Signals
        7. 8.3.6.7 ECM2M_TP_ (31:0)
    4. 8.4 Device Functional Modes
      1. 8.4.1 DLPC410 Initialization and Training
        1. 8.4.1.1 Initialization
        2. 8.4.1.2 input Data Interface (DIN) Training Pattern
      2. 8.4.2 DLPC410 Operational Modes
        1. 8.4.2.1 Single Block Mode
        2. 8.4.2.2 Single Block Phased Mode
        3. 8.4.2.3 Dual Block Mode
        4. 8.4.2.4 Quad Block Mode
        5. 8.4.2.5 Global Mode
        6. 8.4.2.6 DMD Park Mode
        7. 8.4.2.7 DMD Idle Mode
      3. 8.4.3 LOAD4 Functionality (enabled with DLPR410A)
        1. 8.4.3.1 Enabling LOAD4
        2. 8.4.3.2 Loading Data with LOAD4
        3. 8.4.3.3 Row Mapping with LOAD4
        4. 8.4.3.4 Using Block Clear with LOAD4
        5. 8.4.3.5 Timing Requirements for LOAD4
        6. 8.4.3.6 Global Binary Pattern Rate increases using LOAD4
        7. 8.4.3.7 Special LOAD4 considerations
    5. 8.5 Programming
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Device Description
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Initialization Setup
      1. 9.3.1 Debugging Guidelines
      2. 9.3.2 Initialization
        1. 9.3.2.1 Calibration
        2. 9.3.2.2 DLPA200 Number 1 Initialization
        3. 9.3.2.3 DMD Initialization
          1. 9.3.2.3.1 DMD Device ID Check
          2. 9.3.2.3.2 DMD Device OK
        4. 9.3.2.4 DLPA200 Number 2 Initialization
        5. 9.3.2.5 Command Sequence Initialization
      3. 9.3.3 Image Display Issues
        1. 9.3.3.1 Present Data to DLPC410
        2. 9.3.3.2 Load Data to DMD
        3. 9.3.3.3 Mirror Clocking Pulse
  10. 10Power Supply Recommendations
    1. 10.1 Power Down Operation
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Impedance Requirements
      2. 11.1.2 PCB Signal Routing
      3. 11.1.3 Fiducials
      4. 11.1.4 PCB Layout Guidelines
        1. 11.1.4.1 DMD Interface
          1. 11.1.4.1.1 Trace Length Matching
        2. 11.1.4.2 DLPC410 DMD Decoupling
          1. 11.1.4.2.1 Decoupling Capacitors
        3. 11.1.4.3 VCC and VCC2
        4. 11.1.4.4 DMD Layout
        5. 11.1.4.5 DLPA200
    2. 11.2 Layout Example
    3. 11.3 DLPC410 Chipset Connections
  12. 12器件和文档支持
    1. 12.1 器件支持
      1. 12.1.1 器件标记
      2. 12.1.2 器件命名规则
    2. 12.2 文档支持
      1. 12.2.1 相关文档
    3. 12.3 社区资源
    4. 12.4 商标
    5. 12.5 静电放电警告
    6. 12.6 术语表
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
  • DLP|676
散热焊盘机械数据 (封装 | 引脚)
订购信息

1 特性

  • 操作以下 DLP®芯片：
    • DLP650LNIR、DLP7000、DLP7000UV、DLP9500 和 DLP9500UV DMD
    • DLPA200 DMD 微镜驱动器
    • DLPR410 配置 PROM
  • 支持高速 DMD 图形速率
    • 1 位二进制模式速率高达 32kHz
    • 8 位单色图形速率高达 4kHz
  • 400MHz 输入数据时钟速率
  • 64 位 2xLVDS 数据总线接口输入/输出
  • 支持随机行和 LOAD4 DMD 寻址
  • 与多种用户定义的处理器或现场可编程门阵列 (FPGA) 兼容