ZHCSC07E
December 2013 – March 2019
DLPC2607
PRODUCTION DATA.
1
特性
2
应用范围
3
说明
4
修订历史记录
5
Pin Configuration and Functions
Pin Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Typical Current and Power Dissipation
6.6
I/O Characteristics
6.7
Internal Pullup and Pulldown Characteristics
6.8
Parallel I/F Frame Timing Requirements
6.9
Parallel I/F General Timing Requirements
6.10
Parallel I/F Maximum Parallel Interface Horizontal Line Rate
6.11
BT.656 I/F General Timing Requirements
6.12
100- to 120-Hz Operational Limitations
6.13
Flash Interface Timing Requirements
6.14
DMD Interface Timing Requirements
6.15
mDDR Memory Interface Timing Requirements
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Parallel Bus Interface
7.3.2
100- to 120-Hz 3-D Display Operation
7.4
Programming
7.4.1
Serial Flash Interface
7.4.2
Serial Flash Programming
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
System Functional Modes
8.2.2
Design Requirements
8.2.2.1
Reference Clock
8.2.2.2
mDDR DRAM Compatibility
8.2.3
Detailed Design Procedure
8.2.3.1
Hot-Plug Usage
8.2.3.2
Maximum Signal Transition Time
8.2.3.3
Configuration Control
8.2.3.4
White Point Correction Light Sensor
8.2.4
Application Curve
9
Power Supply Recommendations
9.1
System Power Considerations
9.2
System Power-Up and Power-Down Sequence
9.3
System Power I/O State Considerations
9.4
Power-Up Initialization Sequence
9.5
Power-Good (PARK) Support
10
Layout
10.1
Layout Guidelines
10.1.1
Internal ASIC PLL Power
10.1.2
General Handling Guidelines for Unused CMOS-Type Pins
10.1.3
SPI Signal Routing
10.1.4
mDDR Memory and DMD Interface Considerations
10.1.5
PCB Design
10.1.6
General PCB Routing (Applies to All Corresponding PCB Signals)
10.1.7
Maximum, Pin-to-Pin, PCB Interconnects Etch Lengths
10.1.8
I/F Specific PCB Routing
10.1.9
Number of Layer Changes
10.1.10
Stubs
10.1.11
Termination Requirements:
10.2
Layout Example
11
器件和文档支持
11.1
器件支持
11.1.1
第三方产品免责声明
11.1.2
器件命名规则
11.1.2.1
器件标记
11.2
社区资源
11.3
商标
11.4
静电放电警告
11.5
术语表
12
机械、封装和可订购信息
12.1
封装选项附录
12.1.1
封装信息
请参考 PDF 数据表获取器件具体的封装图。
机械数据 (封装 | 引脚)
ZVB|176
散热焊盘机械数据 (封装 | 引脚)
11.1
器件支持