ZHCSC07E December   2013  – March 2019 DLPC2607

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用范围
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Typical Current and Power Dissipation
    6. 6.6  I/O Characteristics
    7. 6.7  Internal Pullup and Pulldown Characteristics
    8. 6.8  Parallel I/F Frame Timing Requirements
    9. 6.9  Parallel I/F General Timing Requirements
    10. 6.10 Parallel I/F Maximum Parallel Interface Horizontal Line Rate
    11. 6.11 BT.656 I/F General Timing Requirements
    12. 6.12 100- to 120-Hz Operational Limitations
    13. 6.13 Flash Interface Timing Requirements
    14. 6.14 DMD Interface Timing Requirements
    15. 6.15 mDDR Memory Interface Timing Requirements
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Parallel Bus Interface
      2. 7.3.2 100- to 120-Hz 3-D Display Operation
    4. 7.4 Programming
      1. 7.4.1 Serial Flash Interface
      2. 7.4.2 Serial Flash Programming
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 System Functional Modes
      2. 8.2.2 Design Requirements
        1. 8.2.2.1 Reference Clock
        2. 8.2.2.2 mDDR DRAM Compatibility
      3. 8.2.3 Detailed Design Procedure
        1. 8.2.3.1 Hot-Plug Usage
        2. 8.2.3.2 Maximum Signal Transition Time
        3. 8.2.3.3 Configuration Control
        4. 8.2.3.4 White Point Correction Light Sensor
      4. 8.2.4 Application Curve
  9. 9 Power Supply Recommendations
    1. 9.1 System Power Considerations
    2. 9.2 System Power-Up and Power-Down Sequence
    3. 9.3 System Power I/O State Considerations
    4. 9.4 Power-Up Initialization Sequence
    5. 9.5 Power-Good (PARK) Support
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1  Internal ASIC PLL Power
      2. 10.1.2  General Handling Guidelines for Unused CMOS-Type Pins
      3. 10.1.3  SPI Signal Routing
      4. 10.1.4  mDDR Memory and DMD Interface Considerations
      5. 10.1.5  PCB Design
      6. 10.1.6  General PCB Routing (Applies to All Corresponding PCB Signals)
      7. 10.1.7  Maximum, Pin-to-Pin, PCB Interconnects Etch Lengths
      8. 10.1.8  I/F Specific PCB Routing
      9. 10.1.9  Number of Layer Changes
      10. 10.1.10 Stubs
      11. 10.1.11 Termination Requirements:
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 第三方产品免责声明
      2. 11.1.2 器件命名规则
        1. 11.1.2.1 器件标记
    2. 11.2 社区资源
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 术语表
  12. 12机械、封装和可订购信息
    1. 12.1 封装选项附录
      1. 12.1.1 封装信息

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • ZVB|176
散热焊盘机械数据 (封装 | 引脚)

10.1.3 SPI Signal Routing

The DLPC2607 device is designed to support two SPI slave devices, specifically, a serial flash and the PMD1000. Given this requires routing associated SPI signals to two locations while attempting to operate at 33.3 MHz, ensure that reflections do not compromise signal integrity. TI recommends the following:

  • Split the SPICLK PCB signal trace from the DLPC2607 source to each slave device into separate routes as close to the DLPC2607 device as possible. Make the SPICLK trace length to each device equal in total length.
  • Split the SPIDOUT PCB signal trace from the DLPC2607 source to each slave device into separate routes as close to the DLPC2607 device as possible. Make the SPIDOUT trace length to each device equal in total length (that is, use the same strategy as SPICLK).
  • Make the SPIDIN PCB signal trace from each slave device to the point where they intersect on the return to the DLPC2607 device equal in length and as short as possible. Make sure they share a common trace back to the DLPC2607 device.
  • SPICSZ0 and SPICSZ1 do not require special treatment because they are dedicated signals which drive only one device.