ZHCSJ71G april   2010  – june 2023 DLPA200

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Device Configurations Table
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics Control Logic
    6. 7.6  5-V Linear Regulator
    7. 7.7  Bias Voltage Boost Converter
    8. 7.8  Reset Voltage Buck-Boost Converter
    9. 7.9  VOFFSET/DMDVCC2 Regulator
    10. 7.10 Switching Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 5-V Linear Regulator
      2. 8.3.2 Bias Voltage Boost Converter
      3. 8.3.3 Reset Voltage Buck-Boost Converter
      4. 8.3.4 VOFFSET/DMDVCC2 Regulator
      5. 8.3.5 Serial Communications Port (SCP)
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Component Selection Guidelines
  11. 10Power Supply Recommendations
    1. 10.1 Power Supply Rail Guidelines
  12. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Grounding Guidelines
    2. 11.2 Thermal Considerations
  13. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Device Nomenclature
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 支持资源
    4. 12.4 Trademarks
    5. 12.5 静电放电警告
    6. 12.6 术语表
  14. 13Mechanical, Packaging, and Orderable Information

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12.5 静电放电警告

GUID-D6F43A01-4379-4BA1-8019-E75693455CED-low.gif 静电放电 (ESD) 会损坏这个集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序，可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级，大至整个器件故障。精密的集成电路可能更容易受到损坏，这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。