ZHCSEI7B December 2015 – December 2017 CSD95377Q4M
PRODUCTION DATA.
The CSD95377Q4M has the ability to use the PGND planes as the primary thermal path. As such, the use of thermal vias is an effective way to pull away heat from the device and into the system board. Concerns of solder voids and manufacturability problems can be addressed by the use of three basic tactics to minimize the amount of solder attach that will wick down the via barrel:
The number and drill size of the thermal vias should align with the end user’s PCB design rules and manufacturing capabilities.