ZHCSGZ7E March   2017  – May 2021 CC3220MOD , CC3220MODA

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 功能方框图
  5. 5 Revision History
  6. 6 Device Comparison
    1. 6.1 Related Products
  7. 7 Terminal Configuration and Functions
    1. 7.1 CC3220MODx and CC3220MODAx Pin Diagram
    2. 7.2 Pin Attributes
      1. 7.2.1 Module Pin Attributes
    3. 7.3 Connections for Unused Pins
    4. 7.4 Pin Attributes and Pin Multiplexing
    5. 7.5 Drive Strength and Reset States for Analog-Digital Multiplexed Pins
    6. 7.6 Pad State After Application of Power to Chip, but Before Reset Release
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Current Consumption (CC3220MODS and CC3220MODAS)
    5. 8.5  Current Consumption (CC3220MODSF and CC3220MODASF)
    6. 8.6  TX Power and IBAT Versus TX Power Level Settings
    7. 8.7  Brownout and Blackout Conditions
    8. 8.8  Electrical Characteristics
    9. 8.9  CC3220MODAx Antenna Characteristics
    10. 8.10 WLAN Receiver Characteristics
    11. 8.11 WLAN Transmitter Characteristics
    12. 8.12 Reset Requirement
    13. 8.13 Thermal Resistance Characteristics for MOB and MON Packages
    14. 8.14 Timing and Switching Characteristics
      1. 8.14.1 Power-Up Sequencing
      2. 8.14.2 Power-Down Sequencing
      3. 8.14.3 Device Reset
      4. 8.14.4 Wake Up From Hibernate Timing
      5. 8.14.5 Peripherals Timing
        1. 8.14.5.1  SPI
          1. 8.14.5.1.1 SPI Master
          2. 8.14.5.1.2 SPI Slave
        2. 8.14.5.2  I2S
          1. 8.14.5.2.1 I2S Transmit Mode
          2. 8.14.5.2.2 I2S Receive Mode
        3. 8.14.5.3  GPIOs
          1. 8.14.5.3.1 GPIO Input Transition Time Parameters
        4. 8.14.5.4  I2C
        5. 8.14.5.5  IEEE 1149.1 JTAG
        6. 8.14.5.6  ADC
        7. 8.14.5.7  Camera Parallel Port
        8. 8.14.5.8  UART
        9. 8.14.5.9  External Flash Interface
        10. 8.14.5.10 SD Host
        11. 8.14.5.11 Timers
  9. 9 Detailed Description
    1. 9.1  Overview
    2. 9.2  Arm® Cortex®-M4 处理器内核子系统
    3. 9.3  Wi-Fi® Network Processor Subsystem
      1. 9.3.1 WLAN
      2. 9.3.2 Network Stack
    4. 9.4  Security
    5. 9.5  Power-Management Subsystem
      1. 9.5.1 VBAT Wide-Voltage Connection
    6. 9.6  Low-Power Operating Mode
    7. 9.7  Memory
      1. 9.7.1 Internal Memory
        1. 9.7.1.1 SRAM
        2. 9.7.1.2 ROM
        3. 9.7.1.3 Flash Memory
        4. 9.7.1.4 Memory Map
    8. 9.8  Restoring Factory Default Configuration
    9. 9.9  Boot Modes
      1. 9.9.1 Boot Mode List
    10. 9.10 Device Certification and Qualification
      1. 9.10.1 FCC Certification and Statement
      2. 9.10.2 Industry Canada (IC) Certification and Statement
      3. 9.10.3 ETSI/CE Certification
      4. 9.10.4 MIC Certification
      5. 9.10.5 SRRC Certification and Statement
    11. 9.11 Module Markings
    12. 9.12 End Product Labeling
    13. 9.13 Manual Information to the End User
  10. 10Applications, Implementation, and Layout
    1. 10.1 Typical Application
    2. 10.2 Device Connection and Layout Fundamentals
      1. 10.2.1 Power Supply Decoupling and Bulk Capacitors
      2. 10.2.2 Reset
      3. 10.2.3 Unused Pins
    3. 10.3 PCB Layout Guidelines
      1. 10.3.1 General Layout Recommendations
      2. 10.3.2 CC3220MODx RF Layout Recommendations
        1. 10.3.2.1 Antenna Placement and Routing
        2. 10.3.2.2 Transmission Line Considerations
      3. 10.3.3 CC3220MODAx RF Layout Recommendations
  11. 11Environmental Requirements and Specifications
    1. 11.1 PCB Bending
    2. 11.2 Handling Environment
      1. 11.2.1 Terminals
      2. 11.2.2 Falling
    3. 11.3 Storage Condition
      1. 11.3.1 Moisture Barrier Bag Before Opened
      2. 11.3.2 Moisture Barrier Bag Open
    4. 11.4 Baking Conditions
    5. 11.5 Soldering and Reflow Condition
  12. 12Device and Documentation Support
    1. 12.1 Development Tools and Software
    2. 12.2 Firmware Updates
    3. 12.3 Device Nomenclature
    4. 12.4 Documentation Support
    5. 12.5 Trademarks
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Mechanical, Land, and Solder Paste Drawings
    2. 13.2 Package Option Addendum
      1. 13.2.1 Packaging Information
      2. 13.2.2 Tape and Reel Information
        1. 13.2.2.1 CC3220MODx Tape Specifications
        2. 13.2.2.2 CC3220MODAx Tape Specifications

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • MON|63
散热焊盘机械数据 (封装 | 引脚)

12.4 Documentation Support

To receive notification of documentation updates — including silicon errata — go to the CC3220MOD product folder on ti.com. In the upper-right corner, click on Alert me to receive a weekly digest of any product information that has changed. For change details, check the revision history of any revised document.

The current documentation that describes the processor, related peripherals, and other technical collateral is as follows.

Application Reports

    SimpleLink™ CC3x20 Wi-Fi® Internet-on-a chip™ Solution Built-In Security FeaturesThe SimpleLink Wi-Fi CC3120 and CC3220 Internet-on-a chip™ family of devices from Texas Instruments offers a wide range of built-in security features to help developers address a variety of security needs, which is achieved without any processing burden on the main microcontroller (MCU). This document describes these security-related features and provides recommendations for leveraging each in the context of practical system implementation.
    Using Serial Flash on SimpleLink™ CC3x20 Wi-Fi® and Internet-of-Things DevicesThis application note is divided into two parts. The first part provides important guidelines and best- practice design techniques to consider when choosing and embedding a serial flash paired with the CC3120 and CC3220 (CC3x20) devices. The second part describes the file system, along with guidelines and considerations for system designers working with the CC3x20 devices.

More Literature

User's Guides

    Simplelink™ CC3x20 Wi-Fi® Embedded ProgrammingThis application note describes in details additional options that leverage all the features UniFlash has to offer, but without the necessary connected PC. This option is referred to as Embedded Programming. To achieve embedded programming, bootloader protocol implemented over UART is described in detail.
    SimpleLink™ CC3x20 Wi-Fi® and Internet-of-Things Network ProcessorThis document provides software (SW) programmers with all of the required knowledge for working with the networking subsystem of the SimpleLink Wi-Fi devices. This guide provides basic guidelines for writing robust, optimized networking host applications, and describes the capabilities of the networking subsystem. The guide contains some example code snapshots, to give users an idea of how to work with the host driver. More comprehensive code examples can be found in the formal software development kit (SDK). This guide does not provide a detailed description of the host driver APIs.
    SimpleLink™ CC3x20 Wi-Fi® Provisioning for Mobile ApplicationsThis guide describes TI’s SimpleLink™ Wi-Fi® provisioning solution for mobile applications, specifically on the use of the Android®™ and iOS® building blocks for UI requirements, networking, and provisioning APIs required for building the mobile application.
    SimpleLink™ CC3220 Wi-Fi® and Internet-of-Things TRMThis manual describes the modules and peripherals of the SimpleLink CC32xx wireless MCU. Each description presents the module or peripheral in a general sense. Not all features and functions of all modules or peripherals may be present on all devices. Pin functions, internal signal connections, and operational parameters differ from device to device. The user should consult the device-specific data sheet for these details.
    SimpleLink™ CC3x20 Wi-Fi® and Internet-on-a chip™ Solution Radio ToolThe Radio Tool serves as a control panel for direct access to the radio, and can be used for both the radio frequency (RF) evaluation and for certification purposes. This guide describes how to have the tool work seamlessly on Texas Instruments ™ evaluation platforms such as the BoosterPack™ plus FTDI emulation board for CC3120 devices, and the LaunchPad™ for CC3220 devices.
    SimpleLink™ CC3220 Wi-Fi® and Internet-of-Things Solution, a Single-Chip Wireless MCUThis guide is intended to assist users in the initial setup and demonstration of running their first sample application for the CC3220, CC3220S, CC3220SF, CC3220MODx, and CC3220MODAx SimpleLink™ Wi-Fi® and Internet-of-Things Solution, a Single-Chip Wireless MCU from Texas Instruments™. The guide explains how to install the software development kit (SDK) and various other tools required to get started with the first application.
    SimpleLink™ CC3220MOD Wi-Fi® LaunchPad™ Development Kit HardwareThe CC3220MOD SimpleLink LaunchPad™ Development Kit (LAUNCHCC3220MODASF) is a low-cost evaluation platform for Arm®Cortex®-M4-based MCUs. The LaunchPad design highlights the CC3220MOD Internet-on-a chip™ solution and Wi-Fi capabilities. The CC3220MOD LaunchPad also features temperature and accelerometer sensors, programmable user buttons, three LEDs for custom applications, and onboard emulation for debugging. The stackable headers of the CC3220MOD LaunchPad XL interface demonstrate how easy it is to expand the functionality of the LaunchPad when interfacing with other peripherals on many existing BoosterPack™ Plug-in Module add-on boards, such as graphical displays, audio codecs, antenna selection, environmental sensing, and more.
    SimpleLink™ CC3220 Wi-Fi® and Internet of ThingsThis document introduces the user to the environment setup for the CC3220x device, along with some reference examples from the software development kit (SDK). This document explains both the platform and the framework available to enable further application development.