ZHCSM61C November   2014  – September 2020 CC3200MOD

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Functional Block Diagrams
  5. 5 Revision History
  6. 6 Device Comparison
    1. 6.1 Related Products
  7. 7 Terminal Configuration and Functions
    1. 7.1 CC3200MOD Pin Diagram
    2. 7.2 Pin Attributes
      1. 7.2.1 Module Pin Attributes
    3. 7.3 Pin Attributes and Pin Multiplexing
    4. 7.4 Recommended Pin Multiplexing Configurations
      1. 7.4.1 ADC Reference Accuracy Specifications
    5. 7.5 Drive Strength and Reset States for Analog-Digital Multiplexed Pins
    6. 7.6 Pad State After Application of Power to Chip, but Before Reset Release
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Power-On Hours (POH)
    4. 8.4  Recommended Operating Conditions
    5. 8.5  Power Consumption Summary
      1. 8.5.1 Current Consumption
    6. 8.6  Brownout and Blackout Conditions
    7. 8.7  WLAN RF Characteristics
      1. 8.7.1 WLAN Receiver Characteristics
      2. 8.7.2 WLAN Transmitter Characteristics
    8. 8.8  Reset Requirement
    9. 8.9  Thermal Resistance Characteristics for MOB and MON Packages
    10. 8.10 Timing and Switching Characteristics
      1. 8.10.1 nRESET
      2. 8.10.2 Wake Up From Hibernate Timing
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Arm® Cortex®-M4 处理器内核子系统
    4. 9.4 CC3200 Device Encryption
    5. 9.5 Wi-Fi® Network Processor Subsystem
    6. 9.6 Power-Management Subsystem
      1. 9.6.1 VBAT Wide-Voltage Connection
    7. 9.7 Low-Power Operating Mode
    8. 9.8 Memory
      1. 9.8.1 External Memory Requirements
      2. 9.8.2 Internal Memory
        1. 9.8.2.1 SRAM
        2. 9.8.2.2 ROM
        3. 9.8.2.3 Memory Map
    9. 9.9 Boot Modes
      1. 9.9.1 Overview
      2. 9.9.2 Invocation Sequence and Boot Mode Selection
      3. 9.9.3 Boot Mode List
  10. 10Applications, Implementation, and Layout
    1. 10.1 Device Connection and Layout Fundamentals
      1. 10.1.1 Power Supply Decoupling and Bulk Capacitors
      2. 10.1.2 Reset
      3. 10.1.3 Unused Pins
      4. 10.1.4 General Layout Recommendations
      5. 10.1.5 Do's and Don'ts
    2. 10.2 Reference Schematics
    3. 10.3 Design Requirements
    4. 10.4 Detailed Design Procedure
    5. 10.5 Layout Recommendations
      1. 10.5.1 RF Section (Placement and Routing)
      2. 10.5.2 Antenna Placement and Routing
      3. 10.5.3 Transmission Line
  11. 11Environmental Requirements and Specifications
    1. 11.1 PCB Bending
    2. 11.2 Handling Environment
      1. 11.2.1 Terminals
      2. 11.2.2 Falling
    3. 11.3 Storage Condition
      1. 11.3.1 Moisture Barrier Bag Before Opened
      2. 11.3.2 Moisture Barrier Bag Open
    4. 11.4 Baking Conditions
    5. 11.5 Soldering and Reflow Condition
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
      2. 12.1.2 Firmware Updates
    2. 12.2 Device Nomenclature
    3. 12.3 Documentation Support
    4. 12.4 Trademarks
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Mechanical Drawing
    2. 13.2 Package Option
      1. 13.2.1 Packaging Information
      2. 13.2.2 Tape and Reel Information

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • MOB|63
散热焊盘机械数据 (封装 | 引脚)

6 Device Comparison

Table 6-1 shows the features supported across different CC3x20 modules.

Table 6-1 Device Features Comparison
FEATURE DEVICE
CC3120MOD CC3220MODS CC3220MODSF CC3220MODAS CC3220MODASF
On-board chip CC3120 CC3220S CC3220SF CC3220S CC3220SF
On-board ANT No No No Yes Yes
sFlash 32-Mbit 32-Mbit 32-Mbit 32-Mbit 32-Mbit
Regulatory certifications FCC, IC, CE, MIC, SRRC FCC, IC, CE, MIC, SRRC FCC, IC, CE, MIC, SRRC FCC, IC, CE, MIC, SRRC FCC, IC, CE, MIC, SRRC
Wi-Fi Alliance® Certification Yes Yes Yes Yes Yes
Input voltage 2.3 V to 3.6 V 2.3 V to 3.6 V 2.3 V to 3.6 V 2.3 V to 3.6 V 2.3 V to 3.6 V
Package 17.5 mm × 20.5 mm QFM 17.5 mm × 20.5 mm QFM 17.5 mm × 20.5 mm QFM 25.0 mm × 20.5 mm QFM 25.0 mm × 20.5 mm QFM
Operating temperature range –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C
Classification Wi-Fi Network Processor Wireless Microcontroller Wireless Microcontroller Wireless Microcontroller Wireless Microcontroller
Standard 802.11 b/g/n 802.11 b/g/n 802.11 b/g/n 802.11 b/g/n 802.11 b/g/n
Frequency 2.4 GHz 2.4 GHz 2.4 GHz 2.4 GHz 2.4 GHz
TCP/IP Stack IPv4, IPv6 IPv4, IPv6 IPv4, IPv6 IPv4, IPv6 IPv4, IPv6
Sockets 16 16 16 16 16
Integrated MCU – Arm® Cortex®-M4 at 80 MHz Arm® Cortex®-M4 at 80 MHz Arm® Cortex®-M4 at 80 MHz Arm® Cortex®-M4 at 80 MHz
ON-CHIP APPLICATION MEMORY
RAM – 256KB 256KB 256KB 256KB
Flash – – 1MB – 1MB
PERIPHERALS AND INTERFACES
Universal Asynchronous
Receiver/Transmitter (UART)		 1 2 2 2 2
Serial Port Interface (SPI) 1 1 1 1 1
Multichannel Audio Serial Port (McASP)- I2S or PCM – 2-ch 2-ch 2-ch 2-ch
Inter-Integrated Circuit (I2C) – 1 1 1 1
Analog-to-digital converter (ADC) – 4-ch, 12-bit 4-ch, 12-bit 4-ch, 12-bit 4-ch, 12-bit
Parallel interface (8-bit PI) – 1 1 1 1
General-purpose timers – 4 4 4 4
Multimedia card (MMC / SD) – 1 1 1 1
SECURITY FEATURES
Wi-Fi level of security WEP, WPS, WPA / WPA2 PSK WPA2 (802.1x) WEP, WPS, WPA / WPA2 PSK WPA2 (802.1x) WEP, WPS, WPA / WPA2 PSK WPA2 (802.1x) WEP, WPS, WPA / WPA2 PSK WPA2 (802.1x) WEP, WPS, WPA / WPA2 PSK WPA2 (802.1x)
Secure sockets (SSL v3 or TLS 1.0 /1.1/ 1.2) 6 6 6 6 6
Additional networking security Unique Device Identity
Trusted Root-Certificate Catalog
TI Root-of-Trust Public key		 Unique Device Identity
Trusted Root-Certificate Catalog
TI Root-of-Trust Public key		 Unique Device Identity
Trusted Root-Certificate Catalog
TI Root-of-Trust Public key		 Unique Device Identity
Trusted Root-Certificate Catalog
TI Root-of-Trust Public key		 Unique Device Identity
Trusted Root-Certificate Catalog
TI Root-of-Trust Public key
Hardware acceleration Hardware Crypto Engines Hardware Crypto Engines Hardware Crypto Engines Hardware Crypto Engines Hardware Crypto Engines
Secure boot – Yes Yes Yes Yes
Enhanced Application Level Security – File system security
Secure key storage
Software tamper detection
Cloning protection
Initial secure programming		 File system security
Secure key storage
Software tamper detection
Cloning protection
Initial secure programming		 File system security
Secure key storage
Software tamper detection
Cloning protection
Initial secure programming		 File system security
Secure key storage
Software tamper detection
Cloning protection
Initial secure programming