SWRS166 December   2014 CC3200MOD

PRODUCTION DATA.  

  1. 1Module Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Terminal Configuration and Functions
    1. 3.1 CC3200MOD Pin Diagram
    2. 3.2 Pin Attributes
    3. 3.3 Pin Attributes and Pin Multiplexing
    4. 3.4 Recommended Pin Multiplexing Configurations
    5. 3.5 Drive Strength and Reset States for Analog-Digital Multiplexed Pins
    6. 3.6 Pad State After Application of Power To Chip But Prior To Reset Release
  4. 4Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  Handling Ratings
    3. 4.3  Power-On Hours
    4. 4.4  Recommended Operating Conditions
    5. 4.5  Brown-Out and Black-Outbrown-out and black-out section
    6. 4.6  Electrical Characteristics (3.3 V, 25°C)
    7. 4.7  Thermal Resistance Characteristics for MOB Package
    8. 4.8  Reset Requirement
    9. 4.9  Current Consumption
    10. 4.10 WLAN RF Characteristics
      1. 4.10.1 WLAN Transmitter Characteristics
    11. 4.11 Timing Characteristics
      1. 4.11.1 Reset Timing
        1. 4.11.1.1 nRESET (32K XTAL)
        2. 4.11.1.2 nRESET (External 32K)
        3. 4.11.1.3 Wakeup from Hibernate
      2. 4.11.2 Peripherals
        1. 4.11.2.1 SPI
          1. 4.11.2.1.1 SPI Master
          2. 4.11.2.1.2 SPI Slave
        2. 4.11.2.2 McASP
          1. 4.11.2.2.1 I2S Transmit Mode
          2. 4.11.2.2.2 I2S Receive Mode
        3. 4.11.2.3 GPIO
          1. 4.11.2.3.1 GPIO Output Transition Time Parameters (Vsupply = 3.3 V)
          2. 4.11.2.3.2 GPIO Output Transition Time Parameters (Vsupply = 1.8 V)
          3. 4.11.2.3.3 GPIO Input Transition Time Parameters
        4. 4.11.2.4 I2C
        5. 4.11.2.5 IEEE 1149.1 JTAG
        6. 4.11.2.6 ADC
        7. 4.11.2.7 Camera Parallel Port
        8. 4.11.2.8 UART
  5. 5Detailed Description
    1. 5.1 Overview
      1. 5.1.1 Module Features
    2. 5.2 Functional Block Diagram
    3. 5.3 ARM Cortex-M4 Processor Core Subsystem
    4. 5.4 CC3200 Device Encryption
    5. 5.5 Wi-Fi Network Processor Subsystem
    6. 5.6 Power-Management Subsystem
      1. 5.6.1 VBAT Wide-Voltage Connection
    7. 5.7 Low-Power Operating Mode
    8. 5.8 Memory
      1. 5.8.1 Internal Memory
        1. 5.8.1.1 SRAM
        2. 5.8.1.2 ROM
        3. 5.8.1.3 Memory Map
    9. 5.9 Boot Modes
      1. 5.9.1 Overview
      2. 5.9.2 Invocation Sequence/Boot Mode Selection
      3. 5.9.3 Boot Mode List
  6. 6Applications, Implementation, and Layout
    1. 6.1 Reference Schematics
    2. 6.2 Bill of Materialsbill of materials
    3. 6.3 Layout Recommendations
      1. 6.3.1 RF Section (Placement and Routing)
      2. 6.3.2 Antenna Placement and Routing
      3. 6.3.3 Transmission Line
      4. 6.3.4 General Layout Recommendation
  7. 7Environmental Requirements and Specifications
    1. 7.1 Temperature
      1. 7.1.1 PCB Bending
    2. 7.2 Handling Environment
      1. 7.2.1 Terminals
      2. 7.2.2 Falling
    3. 7.3 Storage Condition
      1. 7.3.1 Moisture Barrier Bag Before Opened
      2. 7.3.2 Moisture Barrier Bag Open
    4. 7.4 Baking Conditions
    5. 7.5 Soldering and Reflow Condition
  8. 8Product and Documentation Support
    1. 8.1 Development Support
      1. 8.1.1 Firmware Updates
    2. 8.2 Device Nomenclature
    3. 8.3 Community Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Export Control Notice
    7. 8.7 Glossary
  9. 9Mechanical Packaging and Orderable Information
    1. 9.1 Mechanical Drawing
    2. 9.2 Package Option
      1. 9.2.1 Packaging Information
        1. 9.2.2 Tape and Reel Information
      2. 9.2.2 Tape and Reel Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • MOB|63
散热焊盘机械数据 (封装 | 引脚)
订购信息

1 Module Overview

1.1 Features

  • The CC3200MOD is a Wi-Fi Module that Consists of the CC3200R1M2RGC Single-Chip Wireless MCU. This Fully Integrated Module Includes all Required Clocks, SPI Flash, and Passives.
  • Modular FCC, IC, and CE Certifications Save Customer Effort, Time, and Money
  • Wi-Fi CERTIFIED™ Modules, With Ability to Request Certificate Transfer for Wi-Fi Alliance Members
  • 1.27-mm Pitch LGA Package for Easy Assembly and Low-Cost PCB Design
  • Applications Microcontroller Subsystem
    • ARM Cortex-M4 Core at 80 MHz
    • Embedded Memory Options
      • Integrated Serial
      • RAM (up to 256KB)
      • Peripheral Drivers in ROM
    • Hardware Crypto Engine for Advanced Hardware Security Including
      • AES, DES, and 3DES
      • SHA and MD5
      • CRC and Checksum
    • 8-Bit, Fast, Parallel Camera Interface
    • 1 Multichannel Audio Serial Port (McASP) Interface With Support for I2S Format
    • 1 SD (MMC) Interface
    • 32-Channel Micro Direct Memory Access (μDMA)
    • 2 Universal Asynchronous Receivers/Transmitters (UARTs)
    • 2 Serial Peripheral Interfaces (SPIs)
    • 1 Inter-integrated Circuit (I2C)
    • 4 General-Purpose Timers (GPTs)
    • 16-Bit Pulse-Width Modulation (PWM) Mode
    • 1 Watchdog Timer Module
    • 4-Channel 12-Bit Analog-to-Digital Converters (ADCs)
    • Up to 25 Individually Programmable GPIO Pins
  • Wi-Fi Network Processor Subsystem
    • 802.11b/g/n Radio, Baseband, and Medium Access Control
    • TCP/IP Stack
      • 8 Simultaneous TCP, UDP, or RAW Sockets
      • 2 Simultaneous TLS v1.2 or SSL 3.0 Sockets
    • Powerful Crypto Engine for Fast, Secured WLAN Connections With 256-Bit Encryption
    • Station, Access Point, and Wi-Fi Direct™ Modes
    • WPA2 Personal and Enterprise Security
    • SimpleLink Connection Manager for Managing Wi-Fi Security States
    • TX Power
      • 17 dBm at 1 DSSS
      • 17.25 dBm at 11 CCK
      • 13.5 dBm at 54 OFDM
    • RX Sensitivity
      • –94.7 dBm at 1 DSSS
      • –87 dBm at 11 CCK
      • –73 dBm at 54 OFDM
    • Application Throughput
      • UDP: 16 Mbps
      • TCP: 13 Mbps
  • Power-Management Subsystem
    • Integrated DC-DC Converter With a Wide-Supply Voltage:
      • VBAT: 2.3 to 3.6 V
    • Low-Power Consumption at 3.6 V
      • Hibernate With Real-Time Clock (RTC):
        7 μA
      • Low-Power Deep Sleep: <275 μA
      • RX Traffic: 59 mA at 54 OFDM
      • TX Traffic: 229 mA at 54 OFDM
    • Additional Integrated Components
      • 40.0-MHz Crystal
      • 32.768-kHz Crystal (RTC)
      • 8-Mbit SPI Serial Flash RF Filter and Passive Components
    • Package and Operating Conditions
      • 1.27-mm Pitch, 63-Pin, 20.5-mm ×
        17.5 mm LGA Package for Easy Assembly and Low-Cost PCB Design
      • Operating Temperature Range: –20°C to 70°C

1.2 Applications

  • Internet of Things (IoT)
  • Cloud Connectivity
  • Home Automation
  • Home Appliances
  • Access Control
  • Security Systems
  • Smart Energy
  • Internet Gateway
  • Industrial Control
  • Smart Plug and Metering
  • Wireless Audio
  • IP Network Sensor Nodes
  • Wearables

1.3 Description

Start your design with the industry’s first programmable FCC, IC, CE, and Wi-Fi Certified Wireless microcontroller (MCU) module with built-in Wi-Fi connectivity. Created for the Internet of Things (IoT), the SimpleLink CC3200MOD is a wireless MCU module that integrates an ARM Cortex-M4 MCU, allowing customers to develop an entire application with a single device. With on-chip Wi-Fi, Internet, and robust security protocols, no prior Wi-Fi experience is required for faster development. The CC3200MOD integrates all required system-level hardware components including clocks, SPI flash, RF switch, and passives into an LGA package for easy assembly and low-cost PCB design. The CC3200MOD is provided as a complete platform solution including software, sample applications, tools, user and programming guides, reference designs, and the TI E2E™ support community

The applications MCU subsystem contains an industry-standard ARM Cortex-M4 core running at 80 MHz.

The device includes a wide variety of peripherals, including a fast parallel camera interface, I2S, SD/MMC, UART, SPI, I2C, and four-channel ADC. The CC3200 family includes flexible embedded RAM for code and data; ROM with external serial flash bootloader and peripheral drivers; and SPI flash for Wi-Fi network processor service packs, Wi-Fi certificates, and credentials.

The Wi-Fi network processor subsystem features a Wi-Fi Internet-on-a-chip™ and contains an additional dedicated ARM MCU that completely off-loads the applications MCU. This subsystem includes an 802.11 b/g/n radio, baseband, and MAC with a powerful crypto engine for fast, secure Internet connections with 256-bit encryption. The CC3200MOD supports station, access point, and Wi-Fi Direct™ modes. The device also supports WPA2 personal and enterprise security and WPS 2.0. The Wi-Fi Internet-on-a-chip includes embedded TCP/IP and TLS/SSL stacks, HTTP server, and multiple Internet protocols. The power-management subsystem includes integrated DC-DC converters supporting a wide range of supply voltages. This subsystem enables low-power consumption modes, such as the hibernate with RTC mode requiring less than 7 μA of current.

Table 1-1 Module Information(1)

PART NUMBER PACKAGE BODY SIZE
CC3200MODR1M2AMOB MOB (63) 20.5 mm × 17.5 mm
(1) For more information, see Section 9, Mechanical Packaging and Orderable Information.

1.4 Functional Block Diagram

Figure 1-1 shows the functional block diagram of the CC3200MOD module.

fbd_swrs166.gif
1. For 3200MOD module pin multiplexing details, refer to CC3200R device datasheet (literature number: SWAS032)
Figure 1-1 CC3200MOD Module Functional Block Diagram
scr_HW_overview_swas032.gifFigure 1-2 CC3200 Hardware Overview
scr_system_overview_swas032.gifFigure 1-3 CC3200 Software Overview