ZHCSM59B November   2014  – September 2020 CC3100MOD

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 功能方框图
  5. 5 功能方框图
  6. 6 Revision History
  7. 7 Terminal Configuration and Functions
    1. 7.1 CC3100MOD Pin Diagram
    2. 7.2 Pin Attributes
      1.      10
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Power-On Hours (POH)
    4. 8.4  Recommended Operating Conditions
    5. 8.5  Power Consumption Summary
    6. 8.6  TX Power and IBAT versus TX Power Level Settings
    7. 8.7  Brownout and Blackout Conditions
    8. 8.8  Electrical Characteristics (3.3 V, 25°C)
    9. 8.9  WLAN RF Characteristics
      1. 8.9.1 WLAN Receiver Characteristics
      2. 8.9.2 WLAN Transmitter Characteristics
    10. 8.10 Reset Requirement
    11. 8.11 Thermal Resistance Characteristics for MOB Package
    12. 8.12 Timing and Switching Characteristics
      1. 8.12.1 Wake-Up Sequence
      2. 8.12.2 Wake Up From Hibernate
        1. 8.12.2.1 nHIB Timing Requirements (1)
      3. 8.12.3 Interfaces
        1. 8.12.3.1 Host SPI Interface Timing
        2. 8.12.3.2 SPI Host Interface
    13. 8.13 Host UART
      1. 8.13.1 5-Wire UART Topology
      2. 8.13.2 4-Wire UART Topology
      3. 8.13.3 3-Wire UART Topology
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Module Features
      1. 9.2.1 WLAN
      2. 9.2.2 Network Stack
      3. 9.2.3 Host Interface and Driver
      4. 9.2.4 System
    3. 9.3 Functional Block Diagram
    4. 9.4 Wi-Fi Network Processor Subsystem
    5. 9.5 Power-Management Subsystem
      1. 9.5.1 VBAT Wide-Voltage Connection
    6. 9.6 Low-Power Operating Modes
      1. 9.6.1 Low-Power Deep Sleep
      2. 9.6.2 Hibernate
  10. 10Applications, Implementation, and Layout
    1. 10.1 Reference Schematics
    2. 10.2 Design Requirements
    3. 10.3 Layout Recommendations
      1. 10.3.1 RF Section (Placement and Routing)
      2. 10.3.2 Antenna Placement and Routing
      3. 10.3.3 Transmission Line Considerations
  11. 11Environmental Requirements and Specifications
    1. 11.1 Temperature
      1. 11.1.1 PCB Bending
    2. 11.2 Handling Environment
      1. 11.2.1 Terminals
      2. 11.2.2 Falling
    3. 11.3 Storage Condition
      1. 11.3.1 Moisture Barrier Bag Before Opened
      2. 11.3.2 Moisture Barrier Bag Open
    4. 11.4 Baking Conditions
    5. 11.5 Soldering and Reflow Condition
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
        1. 12.1.1.1 Firmware Updates
      2. 12.1.2 Device Nomenclature
    2. 12.2 Documentation Support
    3. 12.3 Trademarks
    4. 12.4 静电放电警告
    5. 12.5 术语表
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Mechanical Drawing
    2. 13.2 Package Option
      1. 13.2.1 Packaging Information
      2. 13.2.2 Tape and Reel Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • MOB|63
散热焊盘机械数据 (封装 | 引脚)
订购信息

Table 7-1 Module Pin Attributes
PIN#SWRS1668435 DEFAULT FUNCTION TYPE DESCRIPTION
1 GND – Ground
2 GND – Ground
3 NC – Reserved. Do not connect.
4 nHIB I Hibernate signal, active low. Refer to GUID-439BCE92-DE2E-470E-8558-5F6A2FA301C9.html#SWAS0318564.
5 HOST_SPI_CLK I Host interface SPI clock
6 HOST_SPI_DIN I Host interface SPI data input
7 HOST_SPI_DOUT O Host interface SPI data output
8 HOST_SPI_nCS I Host interface SPI chip select (active low)
9 NC – Reserved. Do not connect.
10 NC – Reserved. Do not connect.
11 HOST_INTR O Interrupt output
12 NC – Reserved. Do not connect.
13 FLASH_SPI_MISO I Serial flash interface: SPI data in (active high)
14 FLASH_SPI_nCS_IN O Serial flash interface: SPI chip select (active low)
15 FLASH_SPI_CLK O Serial flash interface: SPI clock
16 GND – Ground
17 FLASH_SPI_MOSI O Serial flash interface: SPI data out
18 NC – Reserved. Do not connect.
19 RESERVED – Reserved. Do not connect.
20 NC – Unused. Do not connect.
21 RESERVED – Add 100-kΩ external pulldown resistor. Not adding this resistor can lead to higher current in LPDS mode.
22
23 SOP2/TCXO_EN – Add 10-kΩ pulldown to ground.
24 SOP1 – Add 100k pulldown to ground.
25 NC – Reserved. Do not connect.
26 NC – Reserved. Do not connect.
27, 28 GND – Ground
29 NC – Do not connect.
30 GND – Ground. Reference for RF signal.
31 RF_BG I/O 2.4-GHz RF input/output
32 GND – Ground. Reference for RF signal.
33 NC – Reserved. Do not connect.
34 SOP0 – Add 100k pulldown to ground.
35 nRESET I Power on reset. Does not require external RC circuit.
36 VBAT_RESET – Power supply to internal pull-up resistor on nRESET pin (2.3 V to 3.6 V)
37 VBAT1 – Power supply for the module, can be connected to battery (2.3 V to 3.6 V).
38 GND – Ground
39 NC – To be left unconnected. Used for prototype samples only.
40 VBAT2 – Power supply for the module, can be connected to battery (2.3 V to 3.6 V).
41, 42 NC – Reserved. Do not connect.
43 GND – Ground
44 UART1_nRTS O UART request to send, connect to external test point. Used for on-module flash reprogramming. Add 100-kΩ pulldown to ground when using UART for host interface.
45 NC – Reserved. Do not connect.
46 UART1_TX O UART transmit, connect to external test point. Used for on-module flash reprogramming.
47 UART1_RX I UART receive, connect to external test point. Used for on-module flash reprogramming. TI recommends using a 100-kΩ pullup resistor to save a few tens of µA in hibernate state.
48 TEST_58 O Connect to external test point.
49 TEST_59 I Connect to external test point.
50 TEST_60 O Connect to external test point.
51 UART1_nCTS I UART clear to send, connect to external test point. Used for on-module flash reprogramming.
52 TEST_62 O Connect to external test point.
53, 54 NC – Reserved. Do not connect.
55, 56, 57, 58, 59, 60, 61, 62, 63 GND – Thermal Ground
(1) Using a configuration file stored on flash, the vendor can optionally block any possibility of bringing up AP using the FORCE_AP pin.