ZHCSNU9F april 2021 – january 2023 AM2431 , AM2432 , AM2434
PRODUCTION DATA
请参考 PDF 数据表获取器件具体的封装图。
The Thermal Design Guide for DSP and ARM Application Processors provides guidance for successful implementation of a thermal solution for system designs containing this device. This document provides background information on common terms and methods related to thermal solutions. TI only supports designs that follow system design guidelines contained in the application note.