ZHCSCC6D May 2013 – March 2018 ADS7250 , ADS7850 , ADS8350
PRODUCTION DATA.
| PIN | I/O | DESCRIPTION | |
|---|---|---|---|
| NAME | NO. | ||
| AINM-A | 16 | Analog input | Negative analog input, ADC_A |
| AINM-B | 5 | Analog input | Negative analog input, ADC_B |
| AINP-A | 15 | Analog input | Positive analog input, ADC_A |
| AINP-B | 6 | Analog input | Positive analog input, ADC_B |
| AVDD | 14 | Supply | ADC supply voltage |
| CS | 9 | Digital input | Chip-select signal; active low |
| DVDD | 7 | Supply | Digital I/O supply |
| GND | 8, 13 | Supply | Device ground |
| REFGND-A | 2 | Supply | Reference ground potential, ADC_A |
| REFGND-B | 3 | Supply | Reference ground potential, ADC_B |
| REFIN-A | 1 | Analog input | Reference voltage input, ADC_A |
| REFIN-B | 4 | Analog input | Reference voltage input, ADC_B |
| SCLK | 10 | Digital input | Serial communication clock |
| SDO-A | 11 | Digital output | Data output for serial communication, ADC_A |
| SDO-B | 12 | Digital output | Data output for serial communication, ADC_B |
| Thermal pad | Supply | Exposed thermal pad. TI recommends connecting the thermal pad to the printed circuit board (PCB) ground. | |