ZHCS181G August   2011  – April 2021 TPS53355

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings (1)
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Infomation
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 5-V LDO and VREG Start-Up
      2. 7.3.2 Adaptive On-Time D-CAP Control and Frequency Selection
      3. 7.3.3 Ramp Signal
      4. 7.3.4 Adaptive Zero Crossing
      5. 7.3.5 Power-Good
      6. 7.3.6 Current Sense, Overcurrent and Short Circuit Protection
      7. 7.3.7 Overvoltage and Undervoltage Protection
      8. 7.3.8 UVLO Protection
      9. 7.3.9 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Enable, Soft Start, and Mode Selection
      2. 7.4.2 Auto-Skip Eco-mode™ Light Load Operation
      3. 7.4.3 Forced Continuous Conduction Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Small Signal Model
    2. 8.2 Typical Applications
      1. 8.2.1 Typical Application Circuit Diagram with Ceramic Output Capacitors
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Custom Design With WEBENCH® Tools
          2. 8.2.1.2.2 External Component Selection
          3. 8.2.1.2.3 External Component Selection Using All Ceramic Output Capacitors
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Typical Application Circuit
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 External Component Selection
        3. 8.2.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 第三方产品免责声明
      2. 11.1.2 Development Support
        1. 11.1.2.1 Custom Design With WEBENCH® Tools
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 静电放电警告
    6. 11.6 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DQP|22
散热焊盘机械数据 (封装 | 引脚)
订购信息
8.2.2.2.1 External Component Selection

Refer to Section 8.2.1.2.3 for guidelines for this design with all ceramic output capacitors.

The external components selection is a simple process when using organic semiconductors or special polymer output capacitors.

  1. Select operation mode and soft-start time

    Select operation mode and soft-start time using Table 7-3.

  2. Select switching frequency

    Select the switching frequency from 250 kHz to 1 MHz using Table 7-1.

  3. Choose the inductor

    The inductance value should be determined to give the ripple current of approximately 1/4 to 1/2 of maximum output current. Larger ripple current increases output ripple voltage and improves signal-to-noise ratio and helps ensure stable operation, but increases inductor core loss. Using 1/3 ripple current to maximum output current ratio, the inductance can be determined by Equation 17.

    Equation 17. GUID-7E551C0E-A525-41CF-B36F-C28CF71C78D4-low.gif

    The inductor requires a low DCR to achieve good efficiency. It also requires enough room above peak inductor current before saturation. The peak inductor current can be estimated in Equation 9.

    Equation 18. GUID-FE7E353D-EF71-4B72-8591-4A3C0C29106E-low.gif
  4. Choose the output capacitors

    When organic semiconductor capacitor(s) or specialty polymer capacitor(s) are used, for loop stability, capacitance and ESR should satisfy Equation 7. For jitter performance, Equation 19 is a good starting point to determine ESR.

    Equation 19. GUID-40641A7E-09A3-4B77-A20F-358086EF930B-low.gif

    where

    • D is the duty factor.
    • The required output ripple slope is approximately 10 mV per tSW (switching period) in terms of VFB terminal voltage.
  5. Determine the value of R1 and R2

    The output voltage is programmed by the voltage-divider resistor, R1 and R2 shown in Figure 8-1. R1 is connected between VFB pin and the output, and R2 is connected between the VFB pin and GND. Recommended R2 value is from 1 kΩ to 20 kΩ. Determine R1 using Equation 20.

    Equation 20. GUID-919387A0-EDA1-4DF4-8AAF-AE7E4AC5B97C-low.gif
  6. Choose the overcurrent setting resistor

    The overcurrent setting resistor, RTRIP, can be determined by Equation 10.

    Equation 21. GUID-35491B50-EB90-4F7D-A163-D73A5786C484-low.gif

    where

    • ITRIP is the TRIP pin sourcing current (10 µA)
    • RDS(on) is the thermally compensated on-time resistance value of the low-side MOSFET

    Use an RDS(on) value of 1.5 mΩ for an overcurrent level of approximately 30 A. Use an RDS(on) value of 1.7 mΩ for overcurrent level of approximately 10 A.