ZHCS490B November   2011  – December 2018 TMP104

PRODUCTION DATA.  

  1. 1特性
  2. 2应用
  3. 3说明
    1.     Device Images
      1.      典型应用
  4. 4修订历史记录
  5. 5Pin Configuration and Functions
    1.     Pin Functions
  6. 6Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Thermal Information
    4. 6.4 Electrical Characteristics
    5. 6.5 Typical Characteristics
  7. 7Detailed Description
    1. 7.1 Overview
    2. 7.2 Feature Description
      1. 7.2.1 Timeout Function
      2. 7.2.2 Noise
      3. 7.2.3 SMAART Wire™ Interface Timing Specifications
    3. 7.3 Programming
      1. 7.3.1 Communication Protocol
      2. 7.3.2 Command Register
      3. 7.3.3 Global Initialization and Address Assignment Sequence
      4. 7.3.4 Global Read and Write
      5. 7.3.5 Global Clear Interrupt
      6. 7.3.6 Global Software Reset
      7. 7.3.7 Individual Read and Write
    4. 7.4 Register Maps
      1. 7.4.1 Temperature Register
      2. 7.4.2 Configuration Register
        1. 7.4.2.1 Temperature Watchdog Function (FH, FL)
        2. 7.4.2.2 Conversion Rate (CR1, CR0)
        3. 7.4.2.3 Conversion Modes
          1. 7.4.2.3.1 Shutdown Mode (M1 = 0, M0 = 0)
          2. 7.4.2.3.2 One-Shot Mode (M1 = 0, M0 = 1)
          3. 7.4.2.3.3 Continuous Conversion Mode (M1 = 1)
        4. 7.4.2.4 Interrupt Functionality (INT_EN)
      3. 7.4.3 Temperature Limit Registers
  8. 8器件和文档支持
    1. 8.1 接收文档更新通知
    2. 8.2 社区资源
    3. 8.3 商标
    4. 8.4 静电放电警告
    5. 8.5 术语表
  9. 9机械、封装和可订购信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • YFF|4
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.3 Thermal Information

THERMAL METRIC(1) TMP104 UNIT
YFF (DSBGA)
4 PINS
RθJA Junction-to-ambient thermal resistance 188.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 2.1 °C/W
RθJB Junction-to-board thermal resistance 35.1 °C/W
ψJT Junction-to-top characterization parameter 10.6 °C/W
ψJB Junction-to-board characterization parameter 35.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report (SPRA953).