ZHCSEH3B
December 2015 – September 2018
TAS5411-Q1
PRODUCTION DATA.
1
特性
2
应用
3
说明
Device Images
简化框图
效率
4
修订历史记录
5
Device Comparison Table
6
Pin Configuration and Functions
Pin Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
Electrical Characteristics
7.6
Timing Requirements for I2C Interface Signals
7.7
Typical Characteristics
8
Parameter Measurement Information
9
Detailed Description
9.1
Overview
9.2
Functional Block Diagram
9.3
Feature Description
9.3.1
Analog Audio Input and Preamplifier
9.3.2
Pulse-Width Modulator (PWM)
9.3.3
Gate Drive
9.3.4
Power FETs
9.3.5
Load Diagnostics
9.3.5.1
Load Diagnostics Sequence
9.3.5.2
Faults During Load Diagnostics
9.3.6
Protection and Monitoring
9.3.7
I2C Serial Communication Bus
9.3.7.1
I2C Bus Protocol
9.3.7.2
Random Write
9.3.7.3
Random Read
9.3.7.4
Sequential Read
9.4
Device Functional Modes
9.4.1
Hardware Control Pins
9.4.2
EMI Considerations
9.4.3
Operating Modes and Faults
9.5
Register Maps
10
Application and Implementation
10.1
Application Information
10.2
Typical Application
10.2.1
Design Requirements
10.2.1.1
Amplifier Output Filtering
10.2.1.2
Amplifier Output Snubbers
10.2.1.3
Bootstrap Capacitors
10.2.1.4
Analog Audio Input Filter
10.2.2
Detailed Design Procedure
10.2.2.1
Unused Pin Connections
10.2.2.1.1
MUTE Pin
10.2.2.1.2
STANDBY Pin
10.2.2.1.3
I2C Pins (SDA and SCL)
10.2.2.1.4
Terminating Unused Outputs
10.2.2.1.5
Using a Single-Ended Audio Input
10.2.3
Application Curves
11
Power Supply Recommendations
12
Layout
12.1
Layout Guidelines
12.2
Layout Examples
12.2.1
Top Layer
12.2.2
Second Layer – Signal Layer
12.2.3
Third Layer – Power Layer
12.2.4
Bottom Layer – Ground Layer
13
器件和文档支持
13.1
器件支持
13.1.1
第三方产品免责声明
13.2
文档支持
13.2.1
相关文档
13.3
接收文档更新通知
13.4
社区资源
13.5
商标
13.6
静电放电警告
13.7
术语表
14
机械、封装和可订购信息
封装选项
机械数据 (封装 | 引脚)
PWP|16
MPDS371A
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcseh3b_oa
zhcseh3b_pm
13.1
器件支持