ZHCSEH3B December   2015  – September 2018 TAS5411-Q1

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     Device Images
      1.      简化框图
      2.      效率
  4. 修订历史记录
  5. Device Comparison Table
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements for I2C Interface Signals
    7. 7.7 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Analog Audio Input and Preamplifier
      2. 9.3.2 Pulse-Width Modulator (PWM)
      3. 9.3.3 Gate Drive
      4. 9.3.4 Power FETs
      5. 9.3.5 Load Diagnostics
        1. 9.3.5.1 Load Diagnostics Sequence
        2. 9.3.5.2 Faults During Load Diagnostics
      6. 9.3.6 Protection and Monitoring
      7. 9.3.7 I2C Serial Communication Bus
        1. 9.3.7.1 I2C Bus Protocol
        2. 9.3.7.2 Random Write
        3. 9.3.7.3 Random Read
        4. 9.3.7.4 Sequential Read
    4. 9.4 Device Functional Modes
      1. 9.4.1 Hardware Control Pins
      2. 9.4.2 EMI Considerations
      3. 9.4.3 Operating Modes and Faults
    5. 9.5 Register Maps
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
        1. 10.2.1.1 Amplifier Output Filtering
        2. 10.2.1.2 Amplifier Output Snubbers
        3. 10.2.1.3 Bootstrap Capacitors
        4. 10.2.1.4 Analog Audio Input Filter
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Unused Pin Connections
          1. 10.2.2.1.1 MUTE Pin
          2. 10.2.2.1.2 STANDBY Pin
          3. 10.2.2.1.3 I2C Pins (SDA and SCL)
          4. 10.2.2.1.4 Terminating Unused Outputs
          5. 10.2.2.1.5 Using a Single-Ended Audio Input
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Examples
      1. 12.2.1 Top Layer
      2. 12.2.2 Second Layer – Signal Layer
      3. 12.2.3 Third Layer – Power Layer
      4. 12.2.4 Bottom Layer – Ground Layer
  13. 13器件和文档支持
    1. 13.1 器件支持
      1. 13.1.1 第三方产品免责声明
    2. 13.2 文档支持
      1. 13.2.1 相关文档
    3. 13.3 接收文档更新通知
    4. 13.4 社区资源
    5. 13.5 商标
    6. 13.6 静电放电警告
    7. 13.7 术语表
  14. 14机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Design Requirements

Use the following for the design requirements:

  • Power Supplies
  • The device needs only a single power supply compliant with the recommended operation range. The device is designed to work with either a vehicle battery or regulated power supply such as from a backup battery.

  • Communication
  • The device communicates with the system controller with both discrete hardware control pins and with I2C. The device is an I2C slave and thus requires a master. If a master I2C-compliant device is not present in the system, it is still possible to use the device, but only with the default settings. Diagnostic information is limited to the discrete reporting FAULT pin.

  • External Components
  • Table 9 lists the components required for the device.

    Table 9. Supporting Components

    EVM DESIGNATOR QUANTITY VALUE SIZE DESCRIPTION USE IN APPLICATION
    C7 1 10 μF ± 10% 1206 X7R ceramic capacitor, 25-V Power supply
    C8 1 330 μF ± 20% 10 mm Low-ESR aluminum capacitor, 25-V Power supply
    C9, C16, C20 3 1 μF ± 10% 0805 X7R ceramic capacitor, 25-V Analog audio input filter, bypass
    C10, C14 2 0.22 μF ± 10% 0603 X7R ceramic capacitor, 25-V Bootstrap capacitors
    C11, C17 2 2.2 μF ± 10% 0805 X7R ceramic capacitor, 25-V Amplifier output filtering
    C13, C15 2 470 pF ± 10% 0603 X7R ceramic capacitor, 250-V Amplifier output snubbers
    C6 1 0.1 μF ± 10% 0603 X7R ceramic capacitor, 25-V Power supply
    C2 1 2200 pF ± 10% 0603 X7R ceramic capacitor, 50-V Power supply
    C3 1 0.082 μF ± 10% 0603 X7R ceramic capacitor, 25-V Power supply
    C4, C5 2 4.7 μF ± 10% 1206 X7R ceramic capacitor, 25-V Power supply
    C12, C18 2 0.01 μF ± 10% 0603 X7R ceramic capacitor, 25-V Output EMI filtering
    L1 1 10 μH ± 20% 13.5 mm ×13.5 mm Shielded ferrite inductor Power supply
    L2, L3 1 15 μH ± 20% 7 mm × 7 mm Metal alloy inductor Amplifier output filtering
    R5, R6 2 49.9 kΩ ± 1% 0805 Resistors, 0.125-W Analog audio input filter
    R4, R7 2 5.6 Ω ± 5% 0805 Resistors, 0.125-W Output snubbers