ZHCSEH3B December   2015  – September 2018 TAS5411-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      简化框图
      2.      效率
  4. 4 修订历史记录
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements for I2C Interface Signals
    7. 7.7 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Analog Audio Input and Preamplifier
      2. 9.3.2 Pulse-Width Modulator (PWM)
      3. 9.3.3 Gate Drive
      4. 9.3.4 Power FETs
      5. 9.3.5 Load Diagnostics
        1. 9.3.5.1 Load Diagnostics Sequence
        2. 9.3.5.2 Faults During Load Diagnostics
      6. 9.3.6 Protection and Monitoring
      7. 9.3.7 I2C Serial Communication Bus
        1. 9.3.7.1 I2C Bus Protocol
        2. 9.3.7.2 Random Write
        3. 9.3.7.3 Random Read
        4. 9.3.7.4 Sequential Read
    4. 9.4 Device Functional Modes
      1. 9.4.1 Hardware Control Pins
      2. 9.4.2 EMI Considerations
      3. 9.4.3 Operating Modes and Faults
    5. 9.5 Register Maps
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
        1. 10.2.1.1 Amplifier Output Filtering
        2. 10.2.1.2 Amplifier Output Snubbers
        3. 10.2.1.3 Bootstrap Capacitors
        4. 10.2.1.4 Analog Audio Input Filter
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Unused Pin Connections
          1. 10.2.2.1.1 MUTE Pin
          2. 10.2.2.1.2 STANDBY Pin
          3. 10.2.2.1.3 I2C Pins (SDA and SCL)
          4. 10.2.2.1.4 Terminating Unused Outputs
          5. 10.2.2.1.5 Using a Single-Ended Audio Input
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Examples
      1. 12.2.1 Top Layer
      2. 12.2.2 Second Layer – Signal Layer
      3. 12.2.3 Third Layer – Power Layer
      4. 12.2.4 Bottom Layer – Ground Layer
  13. 13器件和文档支持
    1. 13.1 器件支持
      1. 13.1.1 第三方产品免责声明
    2. 13.2 文档支持
      1. 13.2.1 相关文档
    3. 13.3 接收文档更新通知
    4. 13.4 社区资源
    5. 13.5 商标
    6. 13.6 静电放电警告
    7. 13.7 术语表
  14. 14机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.3 Recommended Operating Conditions

MIN NOM MAX UNIT
V(PVDD_OP) Supply voltage range relative to GND. Includes ac transients, requires proper decoupling.(1) 4-Ω ±20% load (or higher)
4.5 14.4 18 V
V(PVDD_RIPPLE) Maximum ripple on PVDD V(PVDD) < 8 V 1 Vpp
V(AIN)(2) Analog audio input-signal level AC-coupled input voltage 0 0.25–1(3) Vrms
V(IH_STANDBY) STANDBY pin input voltage for logic-level high 2 V
V(IL_STANDBY) STANDBY pin input voltage for logic-level low 0.7 V
V(IH_SCL) SCL pin input voltage for logic-level high R(PU_I2C) = 4.7-kΩ pullup, supply voltage = 3.3 V or 5 V 2.1 5.5 V
V(IH_SDA) SDA pin input voltage for logic-level high R(PU_I2C) = 4.7-kΩ pullup, supply voltage = 3.3 V or 5 V 2.1 5.5 V
V(IL_SCL) SCL pin input voltage for logic-level low R(PU_I2C) = 4.7-kΩ pullup, supply voltage = 3.3 V or 5 V –0.5 1.1 V
V(IL_SDA) SDA pin input voltage for logic-level low R(PU_I2C) = 4.7-kΩ pullup, supply voltage = 3.3 V or 5 V –0.5 1.1 V
R(L) Nominal speaker load impedance When using low-impedance loads, do not exceed overcurrent limit. 2 4 16 Ω
V(PU) Pullup voltage supply (for open-drain logic outputs) 3 3.3 3.6 V
R(PU_EXT) External pullup resistor on open-drain logic outputs Resistor connected between open-drain logic output and V(PU) supply. 10 50 kΩ
R(PU_I2C) I2C pullup resistance on SDA and SCL pins 1 4.7 10 kΩ
C(PVDD) External capacitor on the PVDD pin, typical value ± 20%(1) 10 μF
C(BYP) External capacitor on the BYP pin, typical value ± 10% 1 μF
C(OUT) External capacitance to GND on OUT_X pins 4 μF
C(IN) External capacitance to analog input pin in series with input signal 1 μF
C(BSTN), C(BSTP) External boostrap capacitor, typical value ± 20% 220 nF
TA Operating ambient temperature –40 125 °C
(1) See the Power Supply Recommendations section.
(2) Signal input for full unclipped output with gains of 36 dB, 32 dB, 26 dB, and 20 dB
(3) Maximum recommended input voltage is determined by the gain setting.