ZHCS227G June 2011 – April 2024 LP2951-Q1
PRODUCTION DATA
THERMAL METRIC(1) | LP2951-30-Q1, LP2951-50-Q1 | LP2951-50-Q1 | UNIT | |
---|---|---|---|---|
DRG (WSON) | D (SOIC) | |||
8 PINS | 8 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 55.7 | 121.6 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 66.5 | 69.8 | °C/W |
RθJB | Junction-to-board thermal resistance | 30.2 | 61.9 | °C/W |
ψJT | Junction-to-top characterization parameter | 1.1 | 22.2 | °C/W |
ψJB | Junction-to-board characterization parameter | 30.4 | 61.4 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 10 | n/a | °C/W |