ZHCS227G
June 2011 – April 2024
LP2951-Q1
PRODUCTION DATA
1
1
特性
2
应用
3
说明
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Recommended Operating Conditions
5.4
Thermal Information
5.5
Electrical Characteristics
5.6
Typical Characteristics
6
Detailed Description
6.1
Overview
6.2
Functional Block Diagram
6.3
Feature Description
6.3.1
ERROR Function
6.3.2
Programming Output Voltage
6.4
Device Functional Modes
6.4.1
Shutdown Mode
7
Application and Implementation
7.1
Application Information
7.2
Typical Application
7.2.1
Design Requirements
7.2.1.1
Input Capacitor (CIN)
7.2.1.2
Output Capacitor (COUT)
7.2.2
Detailed Design Procedure
7.2.2.1
Capacitance Value
7.2.2.2
Capacitor Types
7.2.2.3
CBYPASS: Noise and Stability Improvement
7.2.2.4
ESR Range
7.2.3
Application Curves
7.3
Power Supply Recommendations
7.4
Layout
7.4.1
Layout Guidelines
7.4.2
Layout Example
8
Device and Documentation Support
8.1
接收文档更新通知
8.2
支持资源
8.3
Trademarks
8.4
静电放电警告
8.5
术语表
9
Revision History
10
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
D|8
MSOI002K
DRG|8
MPDS151B
散热焊盘机械数据 (封装 | 引脚)
DRG|8
QFND084H
订购信息
zhcs227g_oa
zhcs227g_pm
8.4
静电放电警告
静电放电 (ESD) 会损坏这个集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序,可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级,大至整个器件故障。精密的集成电路可能更容易受到损坏,这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。