ZHCSH26E March 2017 – May 2021 CC3120MOD
PRODUCTION DATA
请参考 PDF 数据表获取器件具体的封装图。
TI does not recommend the use of conformal coating or similar material on the SimpleLink module. This coating can lead to localized stress on the WCSP solder connections inside the module and impact the device reliability. Use caution during the module assembly process to the final PCB to avoid the presence of foreign material inside the module.