ZHCSBT2G November   2012  – October 2017 66AK2H06 , 66AK2H12 , 66AK2H14

PRODUCTION DATA.  

  1. 1 器件概述
    1. 1.1 特性
    2. 1.2 应用
    3. 1.3 说明
      1. 1.3.1 KeyStone II 的增强功能
    4. 1.4 功能方框图
  2. 2 修订历史记录
  3. 3 Device Comparison
    1. 3.1 Related Products
  4. 4 Terminal Configuration and Functions
    1. 4.1 Package Terminals
    2. 4.2 Pin Map
    3. 4.3 Terminal Functions
    4. 4.4 Pullup/Pulldown Resistors
  5. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Power Consumption Summary
    5. 5.5 Electrical Characteristics
    6. 5.6 Thermal Resistance Characteristics for PBGA Package [AAW]
    7. 5.7 Power Supply to Peripheral I/O Mapping
  6. 6 C66x CorePac
    1. 6.1 C66x DSP CorePac
    2. 6.2 Memory Architecture
      1. 6.2.1 L1P Memory
      2. 6.2.2 L1D Memory
      3. 6.2.3 L2 Memory
      4. 6.2.4 Multicore Shared Memory SRAM
      5. 6.2.5 L3 Memory
    3. 6.3 Memory Protection
    4. 6.4 Bandwidth Management
    5. 6.5 Power-Down Control
    6. 6.6 C66x CorePac Revision
      1. Table 6-2 CorePac Revision ID Register (MM_REVID) Field Descriptions
    7. 6.7 C66x CorePac Register Descriptions
  7. 7 ARM CorePac
    1. 7.1 Features
    2. 7.2 System Integration
    3. 7.3 ARM Cortex-A15 Processor
      1. 7.3.1 Overview
      2. 7.3.2 Features
      3. 7.3.3 ARM Interrupt Controller
      4. 7.3.4 Endianess
    4. 7.4 CFG Connection
    5. 7.5 Main TeraNet Connection
    6. 7.6 Clocking and Reset
      1. 7.6.1 Clocking
      2. 7.6.2 Reset
  8. 8 Memory, Interrupts, and EDMA for 66AK2Hxx
    1. 8.1 Memory Map Summary for 66AK2Hxx
    2. 8.2 Memory Protection Unit (MPU) for 66AK2Hxx
      1. 8.2.1 MPU Registers
        1. 8.2.1.1 MPU Register Map
        2. 8.2.1.2 Device-Specific MPU Registers
          1. 8.2.1.2.1 Configuration Register (CONFIG)
            1. Table 8-9 Configuration Register Field Descriptions
      2. 8.2.2 MPU Programmable Range Registers
        1. 8.2.2.1 Programmable Range n Start Address Register (PROGn_MPSAR)
          1. Table 8-10 Programmable Range n Start Address Register Field Descriptions
        2. 8.2.2.2 Programmable Range n - End Address Register (PROGn_MPEAR)
          1. Table 8-14 Programmable Range n End Address Register Field Descriptions
        3. 8.2.2.3 Programmable Range n Memory Protection Page Attribute Register (PROGn_MPPAR)
          1. Table 8-18 Programmable Range n Memory Protection Page Attribute Register Field Descriptions
    3. 8.3 Interrupts for 66AK2Hxx
      1. 8.3.1 Interrupt Sources and Interrupt Controller
      2. 8.3.2 CIC Registers
        1. 8.3.2.1 CIC0 Register Map
        2. 8.3.2.2 CIC1 Register Map
        3. 8.3.2.3 CIC2 Register Map
      3. 8.3.3 Inter-Processor Register Map
      4. 8.3.4 NMI and LRESET
    4. 8.4 Enhanced Direct Memory Access (EDMA3) Controller for 66AK2Hxx
      1. 8.4.1 EDMA3 Device-Specific Information
      2. 8.4.2 EDMA3 Channel Controller Configuration
      3. 8.4.3 EDMA3 Transfer Controller Configuration
      4. 8.4.4 EDMA3 Channel Synchronization Events
  9. 9 System Interconnect
    1. 9.1 Internal Buses and Switch Fabrics
    2. 9.2 Switch Fabric Connections Matrix - Data Space
    3. 9.3 TeraNet Switch Fabric Connections Matrix - Configuration Space
    4. 9.4 Bus Priorities
  10. 10Device Boot and Configuration
    1. 10.1 Device Boot
      1. 10.1.1 Boot Sequence
      2. 10.1.2 Boot Modes Supported
        1. 10.1.2.1 Boot Device Field
          1. Table 10-3 Boot Mode Pins: Boot Device Values
        2. 10.1.2.2 Device Configuration Field
          1. 10.1.2.2.1 Sleep Boot Mode Configuration
            1. Table 10-4 Sleep Boot Configuration Field Descriptions
          2. 10.1.2.2.2 I2C Boot Device Configuration
            1. 10.1.2.2.2.1 I2C Passive Mode
              1. Table 10-5 I2C Passive Mode Device Configuration Field Descriptions
            2. 10.1.2.2.2.2 I2C Master Mode
              1. Table 10-6 I2C Master Mode Device Configuration Field Descriptions
          3. 10.1.2.2.3 SPI Boot Device Configuration
            1. Table 10-7 SPI Device Configuration Field Descriptions
          4. 10.1.2.2.4 EMIF Boot Device Configuration
            1. Table 10-8 EMIF Boot Device Configuration Field Descriptions
          5. 10.1.2.2.5 NAND Boot Device Configuration
            1. Table 10-9 NAND Boot Device Configuration Field Descriptions
        3. 10.1.2.3 Serial Rapid I/O Boot Device Configuration
          1. Table 10-10 Serial Rapid I/O Boot Device Configuration Field Descriptions
        4. 10.1.2.4 Ethernet (SGMII) Boot Device Configuration
          1. Table 10-11 Ethernet (SGMII) Boot Device Configuration Field Descriptions
          2. 10.1.2.4.1   PCIe Boot Device Configuration
            1. Table 10-12 PCIe Boot Device Configuration Field Descriptions
          3. 10.1.2.4.2   HyperLink Boot Device Configuration
            1. Table 10-14 HyperLink Boot Device Configuration Field Descriptions
          4. 10.1.2.4.3   UART Boot Device Configuration
            1. Table 10-15 UART Boot Configuration Field Descriptions
        5. 10.1.2.5 Boot Parameter Table
          1. 10.1.2.5.1  EMIF16 Boot Parameter Table
          2. 10.1.2.5.2  SRIO Boot Parameter Table
          3. 10.1.2.5.3  Ethernet Boot Parameter Table
          4. 10.1.2.5.4  PCIe Boot Parameter Table
          5. 10.1.2.5.5  I2C Boot Parameter Table
          6. 10.1.2.5.6  SPI Boot Parameter Table
          7. 10.1.2.5.7  HyperLink Boot Parameter Table
          8. 10.1.2.5.8  UART Boot Parameter Table
          9. 10.1.2.5.9  NAND Boot Parameter Table
          10. 10.1.2.5.10 DDR3 Configuration Table
        6. 10.1.2.6 Second-Level Bootloaders
      3. 10.1.3 SoC Security
      4. 10.1.4 System PLL Settings
        1. 10.1.4.1 ARM CorePac System PLL Settings
    2. 10.2 Device Configuration
      1. 10.2.1 Device Configuration at Device Reset
      2. 10.2.2 Peripheral Selection After Device Reset
      3. 10.2.3 Device State Control Registers
        1. 10.2.3.1  Device Status (DEVSTAT) Register
          1. Table 10-31 Device Status Register Field Descriptions
        2. 10.2.3.2  Device Configuration Register
          1. Table 10-32 Device Configuration Register Field Descriptions
        3. 10.2.3.3  JTAG ID (JTAGID) Register Description
          1. Table 10-33 JTAG ID Register Field Descriptions
        4. 10.2.3.4  Kicker Mechanism (KICK0 and KICK1) Register
        5. 10.2.3.5  DSP Boot Address Register (DSP_BOOT_ADDRn)
          1. Table 10-1 DSP BOOT Address Register (DSP_BOOT_ADDRn)
        6. 10.2.3.6  LRESETNMI PIN Status (LRSTNMIPINSTAT) Register
          1. Table 10-35 LRESETNMI PIN Status Register Field Descriptions
        7. 10.2.3.7  LRESETNMI PIN Status Clear (LRSTNMIPINSTAT_CLR) Register
          1. Table 10-36 LRESETNMI PIN Status Clear Register Field Descriptions
        8. 10.2.3.8  Reset Status (RESET_STAT) Register
          1. Table 10-37 Reset Status Register Field Descriptions
        9. 10.2.3.9  Reset Status Clear (RESET_STAT_CLR) Register
          1. Table 10-38 Reset Status Clear Register Field Descriptions
        10. 10.2.3.10 Boot Complete (BOOTCOMPLETE) Register
          1. Table 10-39 Boot Complete Register Field Descriptions
        11. 10.2.3.11 Power State Control (PWRSTATECTL) Register
          1. Table 10-40 Power State Control Register Field Descriptions
        12. 10.2.3.12 NMI Event Generation to C66x CorePac (NMIGRx) Register
          1. Table 10-41 NMI Generation Register Field Descriptions
        13. 10.2.3.13 IPC Generation (IPCGRx) Registers
          1. Table 10-42 IPC Generation Registers Field Descriptions
        14. 10.2.3.14 IPC Acknowledgment (IPCARx) Registers
          1. Table 10-43 IPC Acknowledgment Registers Field Descriptions
        15. 10.2.3.15 IPC Generation Host (IPCGRH) Register
          1. Table 10-44 IPC Generation Registers Field Descriptions
        16. 10.2.3.16 IPC Acknowledgment Host (IPCARH) Register
          1. Table 10-45 IPC Acknowledgment Register Field Descriptions
        17. 10.2.3.17 Timer Input Selection Register (TINPSEL)
          1. Table 10-46 Timer Input Selection Field Description
        18. 10.2.3.18 Timer Output Selection Register (TOUTPSEL)
          1. Table 10-47 Timer Output Selection Register Field Descriptions
        19. 10.2.3.19 Reset Mux (RSTMUXx) Register
          1. Table 10-48 Reset Mux Register Field Descriptions
        20. 10.2.3.20 Device Speed (DEVSPEED) Register
          1. Table 10-49 Device Speed Register Field Descriptions
        21. 10.2.3.21 ARM Endian Configuration Register 0 (ARMENDIAN_CFGr_0), r=0..7
          1. Table 10-50 ARM Endian Configuration Register 0 Field Descriptions
        22. 10.2.3.22 ARM Endian Configuration Register 1 (ARMENDIAN_CFGr_1), r=0..7
          1. Table 10-51 ARM Endian Configuration Register 1 Field Descriptions
        23. 10.2.3.23 ARM Endian Configuration Register 2 (ARMENDIAN_CFGr_2), r=0..7
          1. Table 10-52 ARM Endian Configuration Register 2 Field Descriptions
        24. 10.2.3.24 Chip Miscellaneous Control (CHIP_MISC_CTL0) Register
          1. Table 10-53 Chip Miscellaneous Control Register Field Descriptions
        25. 10.2.3.25 Chip Miscellaneous Control (CHIP_MISC_CTL1) Register
          1. Table 10-54 Chip Miscellaneous Control Register Field Descriptions
        26. 10.2.3.26 System Endian Status Register (SYSENDSTAT)
          1. Table 10-55 System Endian Status Register Field Descriptions
        27. 10.2.3.27 SYNECLK_PINCTL Register
          1. Table 10-56 SYNECLK_PINCTL Register Field Descriptions
        28. 10.2.3.28 USB PHY Control (USB_PHY_CTLx) Registers
          1. Table 10-57 USB_PHY_CTL0 Register Field Descriptions
          2. Table 10-58 USB_PHY_CTL1 Register Field Descriptions
          3. Table 10-59 USB_PHY_CTL2 Register Field Descriptions
          4. Table 10-60 USB_PHY_CTL3 Register Field Descriptions
          5. Table 10-61 USB_PHY_CTL4 Register Field Descriptions
          6. Table 10-62 USB_PHY_CTL5 Register Field Descriptions
  11. 1166AK2Hxx Peripheral Information
    1. 11.1  Recommended Clock and Control Signal Transition Behavior
    2. 11.2  Power Supplies
      1. 11.2.1 Power-Up Sequencing
        1. 11.2.1.1 Core-Before-IO Power Sequencing
        2. 11.2.1.2 IO-Before-Core Power Sequencing
        3. 11.2.1.3 Prolonged Resets
        4. 11.2.1.4 Clocking During Power Sequencing
      2. 11.2.2 Power-Down Sequence
      3. 11.2.3 Power Supply Decoupling and Bulk Capacitor
      4. 11.2.4 SmartReflex
        1. Table 11-5 SmartReflex 4-Pin 6-bit VID Interface Switching Characteristics
    3. 11.3  Power Sleep Controller (PSC)
      1. 11.3.1 Power Domains
      2. 11.3.2 Clock Domains
      3. 11.3.3 PSC Register Memory Map
    4. 11.4  Reset Controller
      1. 11.4.1 Power-on Reset
      2. 11.4.2 Hard Reset
      3. 11.4.3 Soft Reset
      4. 11.4.4 Local Reset
      5. 11.4.5 ARM CorePac Reset
      6. 11.4.6 Reset Priority
      7. 11.4.7 Reset Controller Register
      8. 11.4.8 Reset Electrical Data and Timing
        1. Table 11-10 Reset Timing Requirements
        2. Table 11-11 Reset Switching Characteristics
        3. Table 11-12 Boot Configuration Timing Requirements
    5. 11.5  Main PLL, ARM PLL, DDR3A PLL, DDR3B PLL, PASS PLL and the PLL Controllers
      1. 11.5.1 Main PLL Controller Device-Specific Information
        1. 11.5.1.1 Internal Clocks and Maximum Operating Frequencies
        2. 11.5.1.2 Local Clock Dividers
        3. 11.5.1.3 Module Clock Input
        4. 11.5.1.4 Main PLL Controller Operating Modes
        5. 11.5.1.5 Main PLL Stabilization, Lock, and Reset Times
      2. 11.5.2 PLL Controller Memory Map
        1. 11.5.2.1 PLL Secondary Control Register (SECCTL)
          1. Table 11-16 PLL Secondary Control Register Field Descriptions
        2. 11.5.2.2 PLL Controller Divider Register (PLLDIV3 and PLLDIV4)
          1. Table 11-17 PLL Controller Divider Register Field Descriptions
        3. 11.5.2.3 PLL Controller Clock Align Control Register (ALNCTL)
          1. Table 11-18 PLL Controller Clock Align Control Register Field Descriptions
        4. 11.5.2.4 PLLDIV Divider Ratio Change Status Register (DCHANGE)
          1. Table 11-19 PLLDIV Divider Ratio Change Status Register Field Descriptions
        5. 11.5.2.5 SYSCLK Status Register (SYSTAT)
          1. Table 11-20 SYSCLK Status Register Field Descriptions
        6. 11.5.2.6 Reset Type Status Register (RSTYPE)
          1. Table 11-21 Reset Type Status Register Field Descriptions
        7. 11.5.2.7 Reset Control Register (RSTCTRL)
          1. Table 11-22 Reset Control Register Field Descriptions
        8. 11.5.2.8 Reset Configuration Register (RSTCFG)
          1. Table 11-23 Reset Configuration Register Field Descriptions
        9. 11.5.2.9 Reset Isolation Register (RSISO)
          1. Table 11-24 Reset Isolation Register Field Descriptions
      3. 11.5.3 Main PLL Control Registers
        1. Table 11-25 Main PLL Control Register 0 (MAINPLLCTL0) Field Descriptions
        2. Table 11-26 Main PLL Control Register 1 (MAINPLLCTL1) Field Descriptions
      4. 11.5.4 ARM PLL Control Registers
        1. Table 11-27 ARM PLL Control Register 0 Field Descriptions
        2. Table 11-28 ARM PLL Control Register 1 Field Descriptions
      5. 11.5.5 Main PLL Controller, ARM, SRIO, HyperLink, PCIe, USB Clock Input Electrical Data and Timing
        1. Table 11-29 Main PLL Controller, ARM, SRIO, HyperLink, PCIe, USB Clock Input Timing Requirements
    6. 11.6  DDR3A PLL and DDR3B PLL
      1. 11.6.1 DDR3A PLL and DDR3B PLL Control Registers
        1. Table 11-30 DDR3A PLL and DDR3B PLL Control Register 0 Field Descriptions
        2. Table 11-31 DDR3A PLL and DDR3B PLL Control Register 1 Field Descriptions
      2. 11.6.2 DDR3A PLL and DDR3B PLL Device-Specific Information
      3. 11.6.3 DDR3 PLL Input Clock Electrical Data and Timing
        1. Table 11-32 DDR3 PLL DDRCLK(N|P) Timing Requirements
    7. 11.7  PASS PLL
      1. 11.7.1 PASS PLL Local Clock Dividers
      2. 11.7.2 PASS PLL Control Registers
        1. Table 11-33 PASS PLL Control Register 0 Field Descriptions (PASSPLLCTL0)
        2. Table 11-34 PASS PLL Control Register 1 Field Descriptions (PASSPLLCTL1)
      3. 11.7.3 PASS PLL Device-Specific Information
      4. 11.7.4 PASS PLL Input Clock Electrical Data and Timing
        1. Table 11-35 PASS PLL Timing Requirements
    8. 11.8  External Interrupts
      1. 11.8.1 External Interrupts Electrical Data and Timing
        1. Table 11-36 NMI and LRESET Timing Requirements
    9. 11.9  DDR3A and DDR3B Memory Controllers
      1. 11.9.1 DDR3 Memory Controller Device-Specific Information
      2. 11.9.2 DDR3 Slew Rate Control
      3. 11.9.3 DDR3 Memory Controller Electrical Data and Timing
    10. 11.10 I2C Peripheral
      1. 11.10.1 I2C Device-Specific Information
      2. 11.10.2 I2C Peripheral Register Description
      3. 11.10.3 I2C Electrical Data and Timing
        1. Table 11-38 I2C Timing Requirements
        2. Table 11-39 I2C Switching Characteristics
    11. 11.11 SPI Peripheral
      1. 11.11.1 SPI Electrical Data and Timing
        1. Table 11-40 SPI Timing Requirements
        2. Table 11-41 SPI Switching Characteristics
    12. 11.12 HyperLink Peripheral
      1. Table 11-42 HyperLink Peripheral Timing Requirements
      2. Table 11-43 HyperLink Peripheral Switching Characteristics
    13. 11.13 UART Peripheral
      1. Table 11-44 UART Timing Requirements
      2. Table 11-45 UART Switching Characteristics
    14. 11.14 PCIe Peripheral
    15. 11.15 Packet Accelerator
    16. 11.16 Security Accelerator
    17. 11.17 Network Coprocessor Gigabit Ethernet (GbE) Switch Subsystem
      1. Table 11-46 MACID1 Register Field Descriptions
      2. Table 11-47 MACID2 Register Field Descriptions
      3. Table 11-48 RFTCLK Select Register Field Descriptions
    18. 11.18 SGMII and XFI Management Data Input/Output (MDIO)
      1. Table 11-49 MDIO Timing Requirements
      2. Table 11-50 MDIO Switching Characteristics
    19. 11.19 Ten-Gigabit Ethernet (10GbE) Switch Subsystem
      1. 11.19.1 10GbE Supported Features
    20. 11.20 Timers
      1. 11.20.1 Timers Device-Specific Information
      2. 11.20.2 Timers Electrical Data and Timing
        1. Table 11-51 Timer Input Timing Requirements
        2. Table 11-52 Timer Output Switching Characteristics
    21. 11.21 Serial RapidIO (SRIO) Port
      1. 11.21.1 Serial RapidIO Device-Specific Information
    22. 11.22 General-Purpose Input/Output (GPIO)
      1. 11.22.1 GPIO Device-Specific Information
      2. 11.22.2 GPIO Peripheral Register Description
      3. 11.22.3 GPIO Electrical Data and Timing
        1. Table 11-54 GPIO Input Timing Requirements
        2. Table 11-55 GPIO Output Switching Characteristics
    23. 11.23 Semaphore2
    24. 11.24 Universal Serial Bus 3.0 (USB 3.0)
    25. 11.25 EMIF16 Peripheral
      1. 11.25.1 EMIF16 Electrical Data and Timing
        1. Table 11-56 EMIF16 Asynchronous Memory Timing Requirements
    26. 11.26 Emulation Features and Capability
      1. 11.26.1 Chip-Level Features
        1. 11.26.1.1 ARM Subsystem Features
        2. 11.26.1.2 DSP Features
      2. 11.26.2 ICEPick Module
        1. 11.26.2.1 ICEPick Dynamic Tap Insertion
    27. 11.27 Debug Port (EMUx)
      1. 11.27.1 Concurrent Use of Debug Port
      2. 11.27.2 Master ID for Hardware and Software Messages
      3. 11.27.3 SoC Cross-Triggering Connection
      4. 11.27.4 Peripherals-Related Debug Requirement
      5. 11.27.5 Advanced Event Triggering (AET)
      6. 11.27.6 Trace
        1. 11.27.6.1 Trace Electrical Data and Timing
          1. Table 11-66 Trace Switching Characteristics
      7. 11.27.7 IEEE 1149.1 JTAG
        1. 11.27.7.1 IEEE 1149.1 JTAG Compatibility Statement
        2. 11.27.7.2 JTAG Electrical Data and Timing
          1. Table 11-67 JTAG Test Port Timing Requirements
          2. Table 11-68 JTAG Test Port Switching Characteristics
  12. 12Device and Documentation Support
    1. 12.1 Device Nomenclature
    2. 12.2 Tools and Software
    3. 12.3 Documentation Support
    4. 12.4 Related Links
    5. 12.5 Community Resources
    6. 12.6 商标
    7. 12.7 静电放电警告
    8. 12.8 术语表
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Packaging Information

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机械数据 (封装 | 引脚)
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8.2 Memory Protection Unit (MPU) for 66AK2Hxx

CFG (configuration) space of all slave devices on the TeraNet is protected by the MPU. The 66AK2Hxx contains 15 MPUs:

  • MPU0 is used for main TeraNet_3P_B (SCR_3P (B)) CFG.
  • MPU1/2/5 are used for QM_SS (one for VBUSM port and one each for the two configuration VBUSP ports).
  • MPU3/4/6 are reserved.
  • MPU7 is used for DDR3_B.
  • MPU8 is used for EMIF16.
  • MPU9 is used for interrupt controllers connected to TeraNet_3P (SCR_3P).
  • MPU10 is used for semaphore.
  • MPU11 is used to protect TeraNet_6P_B (SCR_6P (B)) CPU/6 CFG TeraNet.
  • MPU12/13/14 are used for SPI0/1/2.

This section contains MPU register map and details of device-specific MPU registers only. For MPU features and details of generic MPU registers, see the KeyStone Architecture Memory Protection Unit (MPU) User's Guide.

Table 8-2, Table 8-3, and Table 8-4 show the configuration of each MPU and the memory regions protected by each MPU.

Table 8-2 MPU0-MPU5 Default Configuration

SETTING MPU0 MAIN SCR_3P (B) MPU1 (QM_SS DATA PORT) MPU2 (QM_SS CFG1 PORT) MPU3 MPU4 MPU5 (QM_SS CFG2 PORT)
Default permission Assume allowed Assume allowed Assume allowed Reserved Reserved Assume allowed
Number of allowed IDs supported 16 16 16 16
Number of programmable ranges supported 16 16 16 16
Compare width 1KB granularity 1KB granularity 1KB granularity 1KB granularity

Table 8-3 MPU6-MPU11 Default Configuration

SETTING MPU6 MPU7 DDR3B MPU8 EMIF16 MPU9 INTC MPU10 SM MPU11 SCR_6P (B)
Default permission Reserved Assume allowed Assume allowed Assume allowed Assume allowed Assume allowed
Number of allowed IDs supported 16 16 16 16 16
Number of programmable ranges supported 16 8 4 2 16
Compare width 1KB granularity 1KB granularity 1KB granularity 1KB granularity 1KB granularity

Table 8-4 MPU12-MPU14 Default Configuration

SETTING MPU12 SPI0 MPU13 SPI1 MPU14 SPI2
Default permission Assume allowed Assume allowed Assume allowed
Number of allowed IDs supported 16 16 16
Number of programmable ranges supported 2 2 2
Compare width 1KB granularity 1KB granularity 1KB granularity

Table 8-5 MPU Memory Regions

MEMORY PROTECTION START ADDRESS END ADDRESS
MPU0 Main CFG SCR 0x01D0_0000 0x01E7_FFFF
MPU1 QM_SS DATA PORT 0x23A0_0000 0x23BF_FFFF
MPU2 QM_SS CFG1 PORT 0x02A0_0000 0x02AF_FFFF
MPU3 Reserved 0x027C_0000 0x027C_03FF
MPU4 Reserved 0x0210_0000 0x0215_FFFF
MPU5 QM_SS CFG2 PORT 0x02A0_4000 0x02BF_FFFF
MPU6 Reserved 0x02C0_0000 0x02CD_FFFF
MPU7 DDR3B 0x2101_0000 0xFFFF_FFFF
MPU8 SPIROM/EMIF16 0x20B0_0000 0x3FFF_FFFF
MPU9 INTC/AINTC 0x0264_0000 0x0264_07FF
MPU10 Semaphore 0x0260_0000 0x0260_9FFF
MPU11 SCR_6 and CPU/6 CFG SCR 0x0220_0000 0x03FF_FFFF
MPU12 SPI0 0x2100_0400 0x2100_07FF
MPU13 SPI1 0x2100_0400 0x2100_07FF
MPU14 SPI2 0x2100_0800 0x2100_0AFF

Table 8-6 shows the unique Master ID assigned to each CorePac and peripherals on the device.

Table 8-6 Master ID Settings

MASTER ID 66AK2H12/14 66AK2H06
0 C66x CorePac0 Data
1 C66x CorePac1 Data
2 C66x CorePac2 Data
3 C66x CorePac3 Data
4 C66x CorePac4 Data Reserved
5 C66x CorePac5 Data Reserved
6 C66x CorePac6 Data Reserved
7 C66x CorePac7 Data Reserved
8 ARM CorePac 0 noncache accesses and cache accesses for all ARM cores
9 ARM CorePac 1 noncache accesses
10 ARM CorePac 2 noncache accesses Reserved
11 ARM CorePac 3 noncache accesses Reserved
12 Reserved
13 Reserved
14 Reserved
15 Reserved
16 C66x CorePac0 CFG
17 C66x CorePac1 CFG
18 C66x CorePac2 CFG
19 C66x CorePac3 CFG
20 C66x CorePac4 CFG Reserved
21 C66x CorePac5 CFG Reserved
22 C66x CorePac6 CFG Reserved
23 C66x CorePac7 CFG Reserved
24 Reserved
25 EDMA0_TC0 read
26 EDMA0_TC0 write
27 EDMA0_TC1 read
28 Hyperlink0
29 Hyperlink1
30 SRIO
31 PCIE
32 EDMA0_TC1 write
33 EDMA1_TC0 read
34 EDMA1_TC0 write
35 EDMA1_TC1 read
36 EDMA1_TC1write
37 EDMA1_TC2 read
38 EDMA1_TC2 write
39 EDMA1_TC3 read
40 EDMA1_TC3 write
41 EDMA2_TC0 read
42 EDMA2_TC0 write
43 EDMA2_TC1 read
44 EDMA2_TC1 write
45 EDMA2_TC2 read
46 EDMA2_TC2 write
47 EDMA2_TC3 read
48 EDMA2_TC3 write
49 EDMA3_TC0 read
50 EDMA3_TC0 write
51 EDMA3_TC1 read
52 MSMC(1)
53 EDMA3_TC1 write
54 to 55 SRIO PKTDMA
56 Reserved
57 Reserved
58 Reserved
59 Reserved
60 Reserved
61 Reserved
62 EDMA3CC0
63 EDMA3CC1
64 EDMA3CC2
65 Reserved
66 Reserved
67 Reserved
68 to 71 Queue Manager
72 to 79 Reserved
80 Reserved
81 Reserved
82 Reserved
83 EDMA3_CC_TR
84 to 87 10GbE (66AK2H14 only)
88 to 91 Reserved
92 to 95 Packet Coprocessor MST2
96 to 99 Packet Coprocessor MST1
100 to 101 Reserved
102 Reserved
103 Reserved
104 Reserved
105 Reserved
106 Reserved
107 DBG_DAP
108-139 Reserved
140 CPT_L2_0
141 CPT_L2_1
142 CPT_L2_2
143 CPT_L2_3
144 CPT_L2_4
145 CPT_L2_5
146 CPT_L2_6
147 CPT_L2_7
148 CPT_MSMC0
149 CPT_MSMC1
150 CPT_MSMC2
151 CPT_MSMC3
152 CPT_DDR3A
153 CPT_SM
154 CPT_QM_CFG1
155 CPT_QM_M
156 CPT_CFG
157 Reserved
158 Reserved
159 Reserved
160 CPT_QM_CFG2
161 CPT_DDR3B
162 Reserved
163 Reserved
164 CPT_EDMA3CC0_4
165 CPT_EDMA3CC1_2_3
166 CPT_INTC
167 CPT_SPI_ROM_EMIP16
168 USB
169 EDMA4_TC0 read
170 EDMA4_TC0 write
171 EDMA4_TC1 read
172 EDMA4_TC1 write
173 EDMA4_CC_TR
174 CPT_MSMC5
175 CPT_MSMC6
176 CPT_MSMC7
177 CPT_MSMC4
178 Reserved
179 Reserved
180-183 NETCP
184-255 Reserved
(1) The master ID for MSMC is for the transaction initiated by MSMC internally and sent to the DDR.

NOTE

There are two master ID values assigned to the Queue Manager_second master port, one master ID for external linking RAM and the other one for the PDSP/MCDM accesses.

Table 8-7 shows the privilege ID of each C66x CorePac and every mastering peripheral. The table also shows the privilege level (supervisor vs. user), security level (secure vs. nonsecure), and access type (instruction read vs. data/DMA read or write) of each master on the device. In some cases, a particular setting depends on software being executed at the time of the access or the configuration of the master peripheral.

Table 8-7 Privilege ID Settings

PRIVILEGE ID MASTER PRIVILEGE LEVEL SECURITY LEVEL ACCESS TYPE
0 C66x CorePac0 SW dependant, driven by MSMC Nonsecure DMA
1 C66x CorePac1 SW dependant, driven by MSMC Nonsecure DMA
2 C66x CorePac2 SW dependant, driven by MSMC Nonsecure DMA
3 C66x CorePac3 SW dependant, driven by MSMC Nonsecure DMA
4 C66x CorePac4 SW dependant, driven by MSMC Nonsecure DMA
5 C66x CorePac5 SW dependant, driven by MSMC Nonsecure DMA
6 C66x CorePac6 SW dependant, driven by MSMC Nonsecure DMA
7 C66x CorePac7 SW dependant, driven by MSMC Nonsecure DMA
8 ARM CorePac SW dependent Nonsecure DMA
9 SRIO_M and all Packet DMA masters (NetCP, Both QM_CDMA, SRIO_CDMA, 10GbE(1)), USB User/driven by SRIO block, user mode and supervisor mode is determined by per transaction basis. Only the transaction with source ID matching the value in SupervisorID register is granted supervisor mode. Nonsecure DMA
10 QM_Second(2) User Nonsecure DMA
11 PCIe Supervisor Nonsecure DMA
12 DAP Driven by Emulation SW Nonsecure DMA
13 Reserved
14 HyperLink Supervisor Nonsecure DMA
15 Reserved
(1) 66AK2H14 only.
(2) QM_Second provides a path that PDSP uses to access the system memory.