TDA3LA
- Architecture designed for ADAS applications
- Video and
image processing support
- Full-HD video (1920 × 1080p, 60 fps)
- Video input and video output
- Up to 2 C66x floating-point VLIW
DSP
- Fully object-code compatible with C67x and C64x+
- Up to thirty-two 16 × 16-bit fixed-point multiplies per cycle
- Up to 512kB of on-chip L3 RAM
- Level 3 (L3) and Level 4 (L4) interconnects
- Memory Interface (EMIF) module
- Supports DDR3/DDR3L up to DDR-1066
- Supports DDR2 up to DDR-800
- Supports LPDDR2 up to DDR-667
- Up to 2GB supported
- Dual Arm® Cortex®-M4 Image Processor Unit (IPU)
- Vision accelerationPac
- Embedded Vision Engine (EVE)
- Display
subsystem
- Display controller with DMA engine
- CVIDEO / SD-DAC TV analog composite output
- Video Input Port (VIP) module
- Support for up to 4 multiplexed input ports
- On-chip temperature sensor that is capable of generating temperature alerts
- General-Purpose Memory Controller (GPMC)
- Enhanced Direct Memory Access (EDMA) controller
- 3-port (2 external) Gigabit Ethernet (GMAC) switch
- Controller Area Network (DCAN) module
- CAN 2.0B protocol
- Modular Controller Area
Network (MCAN) module
- CAN 2.0B protocol
- Eight 32-bit general-purpose timers
- Three configurable UART modules
- Four Multichannel Serial Peripheral Interfaces (McSPI)
- Quad SPI interface
- Two Inter-Integrated Circuit (I2C™) ports
- Three Multichannel Audio Serial Port (McASP) modules
- Secure Digital Input Output Interface (SDIO)
- Up to 126 General-Purpose I/O (GPIO) pins
- Power, reset, and clock management
- On-chip debug with CTools technology
- Automotive AEC-Q100 qualified
- 15 × 15 mm, 0.65-mm pitch, 367-pin PBGA (ABF)
- Seven Dual Clock Comparators (DCC)
- Memory Cyclic Redundancy Check (CRC)
- TESOC (LBIST/PBIST) that enables field testing of logic and on-chip memory
- Error Signaling Module (ESM)
- Five instances of Real-Time Interrupt (RTI) modules that can be used as watch dog timers
- 8-channel 10-bit ADC
- MIPI® Camera Serial Interface 2 (CSI-2)
- PWMSS
- Full HW image pipe: DPC, CFA, 3D-NF,
RGB-YUV
- WDR, HW LDC and perspective
TI’s TDA3x System-on-Chip (SoC) is a highly optimized and scalable family of devices designed to meet the requirements of leading Advanced Driver Assistance Systems (ADAS). The TDA3x family enables broad ADAS applications in automobiles by integrating an optimal mix of performance, low power, smaller form factor and ADAS vision analytics processing that aims to facilitate a more autonomous and collision-free driving experience.
The TDA3x SoC enables sophisticated embedded vision technology in today’s automobile by enabling the industry’s broadest range of ADAS applications including front camera, rear camera, surround view, radar, and fusion on a single architecture.
The TDA3x SoC incorporates a heterogeneous, scalable architecture that includes a mix of Texas Instruments (TI)’s fixed and floating-point TMS320C66x digital signal processor (DSP) generation cores, Vision AccelerationPac (EVE), and dual-Cortex-M4 processors. The device allows low power profile in different package options (including Package-On-Package) to enable small form factor designs. TDA3x SoC also integrates a host of peripherals including multi-camera interfaces (both parallel and serial) for LVDS-based surround view systems, displays, CAN and GigB Ethernet AVB.
The Vision AccelerationPac for this family of products includes embedded vision engine (EVE) offloading the vision analytics functionality from the application processor while also reducing the power footprint. The Vision AccelerationPac is optimized for vision processing with a 32-bit RISC core for efficient program execution and a vector coprocessor for specialized vision processing.
Additionally, TI provides a complete set of development tools for the Arm, DSP, and EVE coprocessor, including C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a debugging interface for visibility into source code execution.
The TDA3x ADAS processor is qualified according to AEC-Q100 standard.
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该产品系列可供大批量汽车制造商使用。有关详细信息，请与 TI 销售代表联系。
技术文档
设计与开发
电源解决方案
查找适用于 TDA3LA 的电源解决方案。TI 提供适用于 TI 和非 TI 片上系统 (SoC)、处理器、微控制器、传感器和现场可编程门阵列 (FPGA) 的电源解决方案。
D3-3P-RVP-TDA3X — 适用于 TDA3 处理器的 D3 Embedded RVP-TDA3x 开发套件
RVP-TDA3x 是一款适用于低成本高级驾驶辅助系统 (ADAS) 的多摄像头平台。它包含视觉加速包 (EVE) 并采用板载 ISP（图像信号处理器）。它不包括 ARM 内核或编解码器。该开发套件支持四个摄像头输入，但可以根据需要进行定制。套件购买包括软件分发和单次使用许可。应用包括前置或后置摄像头、2D/3D 环视、雷达、驾驶员监控、摄像头监控系统 (CMS)/视镜更换。
D3-3P-TDA3X-SK — 适用于 TDA3 处理器的 D3 Embedded DesignCore® TDA3x 汽车级入门套件
借助台式入门套件，您可以在用于生产的电子平台上评估嵌入式 ADAS 技术。它基于德州仪器 (TI) TDA3x 高级视觉处理器，可以同步获取四个 FPD-Link III HD 数据流（视频、雷达、激光雷达等）进行实时视觉处理和分析。套件购买包含软件分发以及 TI Vision SDK 和 D3 Embedded 高级视觉软件框架的单次使用许可。
LB-3P-TRACE32-DSP — 适用于数字信号处理器 (DSP) 的 Lauterbach TRACE32 调试和跟踪系统
Lauterbach‘s TRACE32® tools are a suite of leading-edge hardware and software components that enables developers to analyze, optimize and certify all kinds of single- or multi-core Digital Signal processors (DSPs) which are a popular choice for audio and video processing as well as radar data (...)
PROCESSOR-SDK-RADAR — 适用于雷达的 RTOS 处理器 SDK
Processor SDK-Vision (Vision SDK) 和 Processor SDK-Radar (Radar SDK) 是适用于 TDAx 处理器的多处理器软件开发套件。利用该软件框架，用户可以创建不同的 ADAS 应用数据流，其中涉及雷达采集、雷达处理、视频采集、视频预处理、视频分析算法和视频显示。 . 该版本还集成了 Processor SDK Linux，可支持需要 Linux 和 GPU 的汽车 ADAS 功能和演示。该 SDK 具有适用于 EVE 和 DSP 的基础驱动程序以及计算和视觉内核。它还具有使用 TI 样例算法的演示使用案例，可以针对 ADAS SoC (...)
PROCESSOR-SDK-VISION — 适用于视觉应用的 Linux 和 RTOS 处理器 SDK
Processor SDK-Vision (Vision SDK) 和 Processor SDK-Radar (Radar SDK) 是适用于 TDAx 处理器的多处理器软件开发套件。利用该软件框架，用户可以创建不同的 ADAS 应用数据流，其中涉及雷达采集、雷达处理、视频采集、视频预处理、视频分析算法和视频显示。 . 该版本还集成了 Processor SDK Linux，可支持需要 Linux 和 GPU 的汽车 ADAS 功能和演示。该 SDK 具有适用于 EVE 和 DSP 的基础驱动程序以及计算和视觉内核。它还具有使用 TI 样例算法的演示使用案例，可以针对 ADAS SoC (...)
CCSTUDIO — Code Composer Studio™ integrated development environment (IDE)
CCStudio™ IDE is part of TI's extensive CCStudio™ development ecosystem and is an integrated development environment for TI's microcontrollers, processors, wireless connectivity devices, and radar sensors. CCStudio IDE is available as desktop or cloud-based applications. The cloud version (...)
SYSCONFIG — Standalone desktop version of SysConfig
CCStudio™ SysConfig is part of TI's extensive CCStudio™ development ecosystem and is a configuration tool that simplifies hardware and software configuration challenges to accelerate software development.
SysConfig provides an intuitive graphical user interface for configuring pins, peripherals, (...)
QNX-3P-NEUTRINO-RTOS — QNX Neutrino® 实时操作系统 (RTOS)
CLOCKTREETOOL — Clock Tree Tool for Sitara™ ARM® Processors
The Clock Tree Tool (CTT) for Sitara™ ARM®, Automotive, and Digital Signal Processors is an interactive clock tree configuration software that provides information about the clocks and modules in these TI devices. It allows the user to:
- Visualize the device clock tree
- Interact with clock tree (...)
| 封装 | 引脚 | CAD 符号、封装和 3D 模型 |
|---|---|---|
| FCBGA (ABF) | 367 | Ultra Librarian |