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微控制器 (MCU) 和处理器
微处理器和 DSP
汽车驾驶辅助 SoC

TDA2E

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适用于 ADAS 应用且具有图形和视频加速功能的 SoC 处理器（23mm 封装）

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用户指南

TDA2E

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产品详情

CPU 1 Arm Cortex-A15 Frequency (MHz) 500, 800 Coprocessors 4 Arm Cortex-M4 Graphics acceleration 1 2D, 1 3D Display type 1 HDMI, 3 LCD Protocols Ethernet PCIe 2 PCIe Gen 3 Hardware accelerators Image video accelerator Features Vision Analytics Operating system Android, Linux, RTOS Security Cryptographic acceleration, Device attestation & anti-counterfeit, Hardware-enforced isolation, Secure boot, Secure debug, Secure storage, Software IP protection Rating Automotive Operating temperature range (°C) -40 to 125 Edge AI enabled No
CPU 1 Arm Cortex-A15 Frequency (MHz) 500, 800 Coprocessors 4 Arm Cortex-M4 Graphics acceleration 1 2D, 1 3D Display type 1 HDMI, 3 LCD Protocols Ethernet PCIe 2 PCIe Gen 3 Hardware accelerators Image video accelerator Features Vision Analytics Operating system Android, Linux, RTOS Security Cryptographic acceleration, Device attestation & anti-counterfeit, Hardware-enforced isolation, Secure boot, Secure debug, Secure storage, Software IP protection Rating Automotive Operating temperature range (°C) -40 to 125 Edge AI enabled No
FCBGA (ABC) 760 529 mm² (23 mm × 23 mm)
  • Architecture designed for ADAS applications
  • Video, image, and graphics processing support
    • Full-HD video (1920 × 1080p, 60 fps)
    • Multiple video inputs and video outputs
  • Arm® Cortex®-A15 microprocessor subsystem
  • C66x floating-point VLIW DSP cores
    • Fully object-code compatible with C67x and C64x+
    • Up to thirty-two 16 × 16-bit fixed-point multiplies per cycle
  • Up to 512KB of on-chip L3 RAM
  • Level 3 (L3) and level 4 (L4) interconnects
  • DDR3/DDR3L External Memory Interface (EMIF) module
    • Supports up to DDR3-1333 (667 MHz)
    • Up to 2GB across single chip select
  • Dual Arm® Cortex®-M4 Image Processing Units (IPU)
  • IVA-HD subsystem
  • Display subsystem
    • Display controller with DMA engine and up to three pipelines
    • HDMI™ encoder: HDMI 1.4a and DVI 1.0 compliant
  • Single-core PowerVR® SGX544 3D GPU
  • 2D-graphics accelerator (BB2D) subsystem
    • Vivante® GC320 core
  • Video Processing Engine (VPE)
  • One Video Input Port (VIP) module
    • Support for up to four multiplexed input ports
  • General-Purpose Memory Controller (GPMC)
  • Enhanced Direct Memory Access (EDMA) controller
  • 2-Port Gigabit Ethernet switch
    • Up to two external ports, one internal
  • Sixteen 32-bit general-purpose timers
  • 32-bit MPU watchdog timer
  • Six high speed Inter-Integrated Circuit (I2C™) ports
  • Ten configurable UART/IrDA/CIR modules
  • Four Multichannel Serial Peripheral Interfaces (McSPI)
  • Quad Serial Peripheral Interface (QSPI™)
  • SATA interface
  • Eight Multichannel Audio Serial Port (McASP) modules
  • SuperSpeed USB 3.0 dual-role device
  • High Speed USB 2.0 dual-role device
  • High Speed USB 2.0 on-the-go
  • Four MultiMedia Card/Secure Digital®/Secure Digital Input Output interfaces (MMC™/SD®/SDIO)
  • PCI-Express® (PCIe®) revision 3.0 Port with integrated PHY
    • One 2-lane gen2-compliant port
    • or Two 1-lane gen2-compliant ports
  • Dual Controller Area Network (DCAN) modules
    • CAN 2.0B protocol
  • MIPI® Camera Serial Interface 2 (CSI-2)
  • Up to 215 General-Purpose I/O (GPIO) pins
  • Real-Time Clock subsystem (RTCSS)
  • Device Security Features
    • Hardware crypto accelerators and DMA
    • Firewalls
    • JTAG lock
    • Secure keys
    • Secure ROM and boot
    • Customer programmable keys (Silicon Revision 2.1)
  • Power, reset, and clock management
  • On-chip debug with CTools technology
  • 28-nm CMOS technology
  • 23 mm × 23 mm, 0.8-mm Pitch, 760-Pin BGA (ABC)
  • Architecture designed for ADAS applications
  • Video, image, and graphics processing support
    • Full-HD video (1920 × 1080p, 60 fps)
    • Multiple video inputs and video outputs
  • Arm® Cortex®-A15 microprocessor subsystem
  • C66x floating-point VLIW DSP cores
    • Fully object-code compatible with C67x and C64x+
    • Up to thirty-two 16 × 16-bit fixed-point multiplies per cycle
  • Up to 512KB of on-chip L3 RAM
  • Level 3 (L3) and level 4 (L4) interconnects
  • DDR3/DDR3L External Memory Interface (EMIF) module
    • Supports up to DDR3-1333 (667 MHz)
    • Up to 2GB across single chip select
  • Dual Arm® Cortex®-M4 Image Processing Units (IPU)
  • IVA-HD subsystem
  • Display subsystem
    • Display controller with DMA engine and up to three pipelines
    • HDMI™ encoder: HDMI 1.4a and DVI 1.0 compliant
  • Single-core PowerVR® SGX544 3D GPU
  • 2D-graphics accelerator (BB2D) subsystem
    • Vivante® GC320 core
  • Video Processing Engine (VPE)
  • One Video Input Port (VIP) module
    • Support for up to four multiplexed input ports
  • General-Purpose Memory Controller (GPMC)
  • Enhanced Direct Memory Access (EDMA) controller
  • 2-Port Gigabit Ethernet switch
    • Up to two external ports, one internal
  • Sixteen 32-bit general-purpose timers
  • 32-bit MPU watchdog timer
  • Six high speed Inter-Integrated Circuit (I2C™) ports
  • Ten configurable UART/IrDA/CIR modules
  • Four Multichannel Serial Peripheral Interfaces (McSPI)
  • Quad Serial Peripheral Interface (QSPI™)
  • SATA interface
  • Eight Multichannel Audio Serial Port (McASP) modules
  • SuperSpeed USB 3.0 dual-role device
  • High Speed USB 2.0 dual-role device
  • High Speed USB 2.0 on-the-go
  • Four MultiMedia Card/Secure Digital®/Secure Digital Input Output interfaces (MMC™/SD®/SDIO)
  • PCI-Express® (PCIe®) revision 3.0 Port with integrated PHY
    • One 2-lane gen2-compliant port
    • or Two 1-lane gen2-compliant ports
  • Dual Controller Area Network (DCAN) modules
    • CAN 2.0B protocol
  • MIPI® Camera Serial Interface 2 (CSI-2)
  • Up to 215 General-Purpose I/O (GPIO) pins
  • Real-Time Clock subsystem (RTCSS)
  • Device Security Features
    • Hardware crypto accelerators and DMA
    • Firewalls
    • JTAG lock
    • Secure keys
    • Secure ROM and boot
    • Customer programmable keys (Silicon Revision 2.1)
  • Power, reset, and clock management
  • On-chip debug with CTools technology
  • 28-nm CMOS technology
  • 23 mm × 23 mm, 0.8-mm Pitch, 760-Pin BGA (ABC)

TI’s new TDA2Ex System-on-Chip (SoC) is a highly optimized and scalable family of devices designed to meet the requirements of leading Advanced Driver Assistance Systems (ADAS). The TDA2Ex family enables broad ADAS applications in today’s automobile by integrating an optimal mix of performance, low power, and ADAS vision analytics processing that aims to facilitate a more autonomous and collision-free driving experience.

The TDA2Ex SoC enables sophisticated embedded vision technology in today’s automobile by enabling a board range of ADAS applications including park assist, surround view and sensor fusion on a single architecture.

The TDA2Ex SoC incorporates a heterogeneous, scalable architecture that includes a mix of TI’s fixed and floating-point TMS320C66x digital signal processor (DSP) generation core, Arm® Cortex®-A15 MPCore™ and dual-Arm® Cortex®-M4 processors. The integration of a video accelerator for decoding multiple video streams over an Ethernet AVB network, along with graphics accelerator for rendering virtual views, enable a 3D viewing experience. The TDA2Ex SoC also integrates a host of peripherals including multicamera interfaces (both parallel and serial, including CSI-2) to enable Ethernet or LVDS-based surround view systems, displays and GigB Ethernet AVB.

Additionally, TI provides a complete set of development tools for the Arm® and DSP, including C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a debugging interface for visibility into source code execution.

Cryptographic acceleration is available in all devices. All other supported security features, including support for secure boot, debug security and support for trusted execution environment is available on High-Security (HS) devices. For more information about HS devices, contact your TI representative.

The TDA2Ex ADAS processor is qualified according to the AEC-Q100 standard.

TI’s new TDA2Ex System-on-Chip (SoC) is a highly optimized and scalable family of devices designed to meet the requirements of leading Advanced Driver Assistance Systems (ADAS). The TDA2Ex family enables broad ADAS applications in today’s automobile by integrating an optimal mix of performance, low power, and ADAS vision analytics processing that aims to facilitate a more autonomous and collision-free driving experience.

The TDA2Ex SoC enables sophisticated embedded vision technology in today’s automobile by enabling a board range of ADAS applications including park assist, surround view and sensor fusion on a single architecture.

The TDA2Ex SoC incorporates a heterogeneous, scalable architecture that includes a mix of TI’s fixed and floating-point TMS320C66x digital signal processor (DSP) generation core, Arm® Cortex®-A15 MPCore™ and dual-Arm® Cortex®-M4 processors. The integration of a video accelerator for decoding multiple video streams over an Ethernet AVB network, along with graphics accelerator for rendering virtual views, enable a 3D viewing experience. The TDA2Ex SoC also integrates a host of peripherals including multicamera interfaces (both parallel and serial, including CSI-2) to enable Ethernet or LVDS-based surround view systems, displays and GigB Ethernet AVB.

Additionally, TI provides a complete set of development tools for the Arm® and DSP, including C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a debugging interface for visibility into source code execution.

Cryptographic acceleration is available in all devices. All other supported security features, including support for secure boot, debug security and support for trusted execution environment is available on High-Security (HS) devices. For more information about HS devices, contact your TI representative.

The TDA2Ex ADAS processor is qualified according to the AEC-Q100 standard.
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该产品系列可供大批量汽车制造商使用。有关详细信息，请与 TI 销售代表联系。

详细了解适用于高级驾驶辅助系统 (ADAS) 的 TDA2E SoC。

技术文档

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顶层文档 类型 标题 格式选项 下载最新的英语版本 日期
* 数据表 TDA2Ex SoC for Advanced Driver Assistance Systems (ADAS) 23mm Package (ABC Package) Silicon Revision 2.0 and 2.1 数据表 (Rev. H) PDF | HTML 2019-7-24
* 用户指南 TDA2Ex SoC for Advanced Driver Assistance Systems (ADAS) TRM (Rev. D) 2019-5-21
* 勘误表 TDA2Ex SoC for Advanced Driver Assistance Systems (ADAS) Silicon Errata (Rev. E) PDF | HTML 2024-9-8
应用手册 Jacinto6屏幕旋转显示解决方案 2022-5-6
白皮书 立体视觉 - 迎接挑战并发现机遇，适用于 ADAS (Rev. A) PDF | HTML 英语版 (Rev.A) 2021-6-8
白皮书 借助 ADAS 为自动驾驶汽车铺平道路 (Rev. A) PDF | HTML 英语版 (Rev.A) 2021-6-3
应用手册 AM57x, DRA7x, and TDA2x EMIF Tools (Rev. E) 2020-1-6
应用手册 TDA2x/TDA2E Performance (Rev. A) PDF | HTML 2019-6-10
应用手册 The Implementation of YUV422 Output for SRV 2018-8-2
应用手册 MMC DLL Tuning (Rev. B) 2018-7-31
应用手册 Integrating AUTOSAR on TI SoC: Fundamentals 2018-6-18
应用手册 ECC/EDC on TDAxx (Rev. B) 2018-6-13
用户指南 TPS65917-Q1 User’s Guide to Power DRA7xx and TDA2x/TDA2Ex (Rev. F) 2018-5-7
用户指南 TPS65919-Q1 and TPS65917-Q1 User's Guide to Power DRA71x, DRA79x, and TDA2E-17 (Rev. E) 2018-5-7
应用手册 Sharing VPE Between VISIONSDK and PSDKLA 2018-5-4
应用手册 TMS320C66x XMC Memory Protection 2018-1-31
应用手册 DSS Bit Exact Output (Rev. A) 2018-1-12
应用手册 Flashing Utility - mflash 2018-1-9
应用手册 Optimizing DRA7xx and TDA2xx Processors for use with Video Display SERDES (Rev. B) 2017-11-7
应用手册 A Guide to Debugging With CCS on the DRA75x, DRA74x, TDA2x and TDA3x Family of D (Rev. B) 2017-11-3
应用手册 DSS BT656 Workaround for TDA2x (Rev. A) 2017-11-3
功能安全信息 Safety Features on VisionSDK 2017-10-26
应用手册 Optimization of GPU-Based Surround View on TI’s TDA2x SoC 2017-9-12
白皮书 Step into next-gen architectures for multi-camera operations in automobiles 2017-6-16
白皮书 Making Cars Safer Through Technology Innovation (Rev. A) 2017-6-7
应用手册 Quality of Service (QoS) Knobs for DRA74x, DRA75x & TDA2x Family of Devices (Rev. A) 2016-12-15
应用手册 Quad Channel Camera Application for Surround View and CMS Camera Systems (Rev. A) 2016-8-23
应用手册 ADAS Power Management 2016-3-7
白皮书 Multicore SoCs stay a step ahead of SoC FPGAs 2016-2-23
用户指南 Vision Application Board User's Guide 2016-2-9
技术文章 If seeing is believing… Surround Viewing is experiencing! PDF | HTML 2015-10-26
白皮书 Surround view camera systems for ADAS (Rev. A) 2015-10-20
产品概述 TDA2Eco ADAS System-on-chip Family 2015-10-12
应用手册 Guide to fix Perf Issues Using QoS Knobs for DRA74x, DRA75x, TDA2x & TD3x Device 2014-8-13
白皮书 TI Vision SDK, Optimized Vision Libraries for ADAS Systems 2014-4-14
白皮书 TI Gives Sight to Vision-Enabled Automotive Technologies 2013-10-16

设计与开发

电源解决方案

查找适用于 TDA2E 的电源解决方案。TI 提供适用于 TI 和非 TI 片上系统 (SoC)、处理器、微控制器、传感器和现场可编程门阵列 (FPGA) 的电源解决方案。

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开发套件

D3-3P-DEV — D3 Embedded 支持 AI 摄像头、硬件、驱动程序和固件

D3 Embedded 是一家总部位于美国的公司，专注于为高性能应用提供集成视觉和毫米波雷达传感、连接、嵌入式处理和 AI 的端到端解决方案。凭借超过 25 年的开发经验，D3 Embedded 可提供针对定制软件和硬件的开发服务、基于 ISP 的图像调优、AI 和算法，以及复杂的 DSP 处理链开发服务。它们的专业雷达和 DSP 团队专注于开发适用于德州仪器 (TI) 应用特定处理器的定制软件，包括功能强大的新型 C7x DSP。

来源：D3 Embedded
支持的产品和硬件
开发套件

D3-3P-RVP-TDA2X — 适用于 TDA2 处理器的 D3 Embedded DesignCore® RVP-TDA2x 开发套件

RVP-TDA2x 是一个适用于高端 ADAS 系统的多摄像头平台。它包含两个 ARM A15 应用处理器、多达四个视觉加速包 (EVE) 协处理器和一个硬件加速 H.264 编码器。该开发套件支持八个摄像头输入，但可以根据需要进行定制。套件购买包括软件分发和单次使用许可。

来源：D3 Embedded
支持的产品和硬件
软件开发套件 (SDK)

PROCESSOR-SDK-RADAR — 适用于雷达的 RTOS 处理器 SDK

Processor SDK-Vision (Vision SDK) 和 Processor SDK-Radar (Radar SDK) 是适用于 TDAx 处理器的多处理器软件开发套件。利用该软件框架，用户可以创建不同的 ADAS 应用数据流，其中涉及雷达采集、雷达处理、视频采集、视频预处理、视频分析算法和视频显示。 . 该版本还集成了 Processor SDK Linux，可支持需要 Linux 和 GPU 的汽车 ADAS 功能和演示。该 SDK 具有适用于 EVE 和 DSP 的基础驱动程序以及计算和视觉内核。它还具有使用 TI 样例算法的演示使用案例，可以针对 ADAS SoC (...)

支持的产品和硬件
软件开发套件 (SDK)

PROCESSOR-SDK-VISION — 适用于视觉应用的 Linux 和 RTOS 处理器 SDK

Processor SDK-Vision (Vision SDK) 和 Processor SDK-Radar (Radar SDK) 是适用于 TDAx 处理器的多处理器软件开发套件。利用该软件框架，用户可以创建不同的 ADAS 应用数据流，其中涉及雷达采集、雷达处理、视频采集、视频预处理、视频分析算法和视频显示。 . 该版本还集成了 Processor SDK Linux，可支持需要 Linux 和 GPU 的汽车 ADAS 功能和演示。该 SDK 具有适用于 EVE 和 DSP 的基础驱动程序以及计算和视觉内核。它还具有使用 TI 样例算法的演示使用案例，可以针对 ADAS SoC (...)

支持的产品和硬件
IDE、配置、编译器或调试器

CCSTUDIO — Code Composer Studio™ integrated development environment (IDE)

CCStudio™ IDE is part of TI's extensive CCStudio™ development ecosystem and is an integrated development environment for TI's microcontrollers, processors, wireless connectivity devices, and radar sensors. CCStudio IDE is available as desktop or cloud-based applications. The cloud version (...)

支持的产品和硬件
IDE、配置、编译器或调试器

SYSCONFIG — Standalone desktop version of SysConfig

CCStudio™ SysConfig is part of TI's extensive CCStudio™ development ecosystem and is a configuration tool that simplifies hardware and software configuration challenges to accelerate software development.

SysConfig provides an intuitive graphical user interface for configuring pins, peripherals, (...)

支持的产品和硬件
操作系统 (OS)

GHS-INTEGRITY-RTOS — Green Hills INTEGRITY RTOS

The flagship of Green Hills Software operating systems—the INTEGRITY RTOS—is built around a partitioning architecture to provide embedded systems with total reliability, absolute security, and maximum real-time performance. With its leadership pedigree underscored by certifications in a (...)
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仿真模型

TDA2Ex BSDL

SPRM686.ZIP (13 KB) - BSDL 模型
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仿真模型

TDA2Ex IBIS

SPRM685.ZIP (12619 KB) - IBIS 模型
支持的产品和硬件
仿真模型

TDA2Ex Thermal Model

SPRM682.ZIP (1 KB) - 热模型
支持的产品和硬件
仿真模型

TDA2Ex-17 BSDL Model (Rev. A)

SPRM698A.ZIP (15 KB) - BSDL 模型
支持的产品和硬件
仿真模型

TDA2Ex-17 IBIS Model

SPRM700.ZIP (9618 KB) - IBIS 模型
支持的产品和硬件
仿真模型

TDA2Ex-17 Thermal Model

SPRM699.ZIP (2 KB) - 热模型
支持的产品和硬件
计算工具

CLOCKTREETOOL — Clock Tree Tool for Sitara™ ARM® Processors

The Clock Tree Tool (CTT) for Sitara™ ARM®, Automotive, and Digital Signal Processors is an interactive clock tree configuration software that provides information about the clocks and modules in these TI devices. It allows the user to:

  • Visualize the device clock tree
  • Interact with clock tree (...)
支持的产品和硬件
封装 引脚 CAD 符号、封装和 3D 模型
FCBGA (ABC) 760 Ultra Librarian
适用于评估类项目的 TI 标准条款与条件。

订购和质量

支持和培训

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