产品详细信息

Vin (Min) (V) 3 Vin (Max) (V) 7 Vout (Min) (V) 0.604 Vout (Max) (V) 6.65 Iout (Max) (A) 18 Iq (Typ) (uA) 4000 Switching frequency (Min) (kHz) 100 Switching frequency (Max) (kHz) 1000 Features Enable, Frequency Synchronization, Over Current Protection, Power Good, Pre-Bias Start-Up, Soft Start Adjustable, Synchronous Rectification, Tracking, UVLO Adjustable Operating temperature range (C) -55 to 125, 25 to 25 Rating Space Regulated outputs (#) 1
Vin (Min) (V) 3 Vin (Max) (V) 7 Vout (Min) (V) 0.604 Vout (Max) (V) 6.65 Iout (Max) (A) 18 Iq (Typ) (uA) 4000 Switching frequency (Min) (kHz) 100 Switching frequency (Max) (kHz) 1000 Features Enable, Frequency Synchronization, Over Current Protection, Power Good, Pre-Bias Start-Up, Soft Start Adjustable, Synchronous Rectification, Tracking, UVLO Adjustable Operating temperature range (C) -55 to 125, 25 to 25 Rating Space Regulated outputs (#) 1
CFP (HKY) 34 164 mm² 21.49 x 7.62
  • Radiation performance:
    • Radiation-hardness-assured up to TID 100 krad(Si)
    • SEL, SEB, and SEGR immune to LET = 75 MeV-cm2/mg
    • SET and SEFI characterized up to LET = 75 MeV-cm2/mg
  • Peak efficiency: 95.5% (VO = 1 V at 100 kHz)
  • Integrated 22-mΩ and 17-mΩ MOSFETs
  • Power rail: 3 V to 7 V on VIN
  • Flexible switching frequency options:
    • 100-kHz to 1-MHz adjustable internal oscillator
    • External sync capability: 100-kHz to 1-MHz
    • SYNC pins can be configured as 500-kHz clocks at 90° out of phase to parallel up to 4 devices
  • 0.6-V ±1.5% voltage reference over temperature, radiation, and line and load regulation
  • Monotonic start-up into prebiased outputs
  • Adjustable slope compensation and soft-start
  • Adjustable input enable and power-good output for power sequencing
  • Power-good output monitor for undervoltage and overvoltage
  • 34-pin, thermally-enhanced ceramic flatpack package (HKY) for space applications
  • Radiation performance:
    • Radiation-hardness-assured up to TID 100 krad(Si)
    • SEL, SEB, and SEGR immune to LET = 75 MeV-cm2/mg
    • SET and SEFI characterized up to LET = 75 MeV-cm2/mg
  • Peak efficiency: 95.5% (VO = 1 V at 100 kHz)
  • Integrated 22-mΩ and 17-mΩ MOSFETs
  • Power rail: 3 V to 7 V on VIN
  • Flexible switching frequency options:
    • 100-kHz to 1-MHz adjustable internal oscillator
    • External sync capability: 100-kHz to 1-MHz
    • SYNC pins can be configured as 500-kHz clocks at 90° out of phase to parallel up to 4 devices
  • 0.6-V ±1.5% voltage reference over temperature, radiation, and line and load regulation
  • Monotonic start-up into prebiased outputs
  • Adjustable slope compensation and soft-start
  • Adjustable input enable and power-good output for power sequencing
  • Power-good output monitor for undervoltage and overvoltage
  • 34-pin, thermally-enhanced ceramic flatpack package (HKY) for space applications

The TPS7H4001-SP is a radiation-hardness-assured, 7-V, 18-A synchronous buck converter with integrated low-resistance high-side and low-side MOSFETs in a thermally enhanced 34-pin ceramic flatpack package. High efficiency and reduced component count are achieved through current mode control.

The output voltage start-up ramp is controlled by the SS/TR pin which allows operation as either a stand alone power supply or in tracking situations. Power sequencing is possible by correctly configuring the enable and the power good pins. The TPS7H4001-SP can be configured in primary-secondary mode and with the SYNC2 pin, four devices can be configured in parallel without an external clock.

Cycle-by-cycle current limiting on the high-side FET protects the device in overload situations and is enhanced by a low-side sourcing current protection which prevents current runaway. There is also a low-side sinking current protection which turns off the low-side MOSFET to prevent excessive reverse current. Thermal shutdown disables the part when die temperature exceeds thermal limit.

The TPS7H4001-SP is a radiation-hardness-assured, 7-V, 18-A synchronous buck converter with integrated low-resistance high-side and low-side MOSFETs in a thermally enhanced 34-pin ceramic flatpack package. High efficiency and reduced component count are achieved through current mode control.

The output voltage start-up ramp is controlled by the SS/TR pin which allows operation as either a stand alone power supply or in tracking situations. Power sequencing is possible by correctly configuring the enable and the power good pins. The TPS7H4001-SP can be configured in primary-secondary mode and with the SYNC2 pin, four devices can be configured in parallel without an external clock.

Cycle-by-cycle current limiting on the high-side FET protects the device in overload situations and is enhanced by a low-side sourcing current protection which prevents current runaway. There is also a low-side sinking current protection which turns off the low-side MOSFET to prevent excessive reverse current. Thermal shutdown disables the part when die temperature exceeds thermal limit.

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技术文档

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类型 项目标题 下载最新的英语版本 日期
* 数据表 TPS7H4001-SP Radiation-Hardness-Assured 3-V to 7-V Input 18-A Synchronous Buck Converter 数据表 (Rev. A) PDF | HTML 13 Nov 2020
* 辐射与可靠性报告 Single-Event Effects Test Report of the TPS7H4001-SP (Rev. B) PDF | HTML 08 Dec 2021
* SMD TPS7H4001-SP SMD 5962-18205 08 Dec 2020
* 辐射与可靠性报告 TPS7H4001-SP Total Ionizing Dose (TID) Radiation Report 25 Nov 2020
* 辐射与可靠性报告 TPS7H4001-SP Neutron Displacement Damage Characterization 27 Apr 2020
电子书 电子产品辐射手册 (Rev. B) 07 May 2022
选择指南 TI Space Products (Rev. I) 03 Mar 2022
应用手册 Why Radiation Hardness Matters for Point-of-Load Converters PDF | HTML 13 Jan 2022
白皮书 为新时代高性能 航天级 Xilinx FPGA 供电 下载英文版本 PDF | HTML 06 Dec 2021
更多文献资料 Radiation Evaluation of the TPS7H4001-SP 18 Amps Buck Converte 18 Jul 2021
用户指南 TPS7H4001-SP Worst Case Analysis Model User Guide PDF | HTML 03 Mar 2021
应用手册 TPS7H3301-SP DLA Standard Microcircuit Drawings (SMD) and JAN Part Numbers FAQ 21 Aug 2020
应用手册 How to Modify a 4-Channel TPS7H4001QEVM-CVAL into a 3-Channel EVM PDF | HTML 30 Jun 2020
应用手册 How to Modify a 4-Channel TPS7H4001QEVM-CVAL into a 2-Channel EVM (Rev. A) PDF | HTML 22 Jun 2020
应用手册 Hermetic Package Reflow Profiles, Termination Finishes, and Lead Trim & Form PDF | HTML 18 May 2020
应用手册 Heavy Ion Orbital Environment Single-Event Effects Estimations 18 May 2020
应用手册 How to Modify a 4-Channel TPS7H4001QEVM-CVAL into a 1-Channel EVM PDF | HTML 14 May 2020
用户指南 TPS7H4001-SP Model User Guide 30 Apr 2020
EVM 用户指南 TPS7H4001EVM-CVAL evaluation module (EVM) User's Guide 22 Apr 2020
应用手册 Single-Event Effects Confidence Interval Calculations 14 Jan 2020
更多文献资料 TI Engineering Evaluation Units vs. MIL-PRF-38535 QML Class V Processing 17 Jun 2019
电子书 电子产品辐射手册 (Rev. A) 21 May 2019
技术文章 Minimize the impact of the MLCC shortage on your power application 29 Mar 2019

设计和开发

如需其他信息或资源,请查看下方列表,点击标题即可进入详情页面。

评估板

TPS7H4001EVM-CVAL — 单通道 18A、3V 至 7V 输入、同步降压转换器评估模块

TPS7H4001EVM-CVAL 评估模块 (EVM) 演示了 TPS7H4001-SP 降压转换器如何为调节容差严苛的应用提供高达 18A 的负载点 (POL) 电流,如为 ASIC 和 FPGA 供电。

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评估板

TPS7H4001QEVM-CVAL — 4 通道、72A、3V 至 7V 输入、同步降压转换器评估模块

TPS7H4001QEVM-CVAL 评估模块 (EVM) 演示了如何在主/从模式下配置四个 TPS7H4001-SP 降压转换器,从而提供一个负载电流可高达 72A 的稳压电源轨,实现对 ASIC 和 FPGA 典型应用的支持。

TI.com 無法提供
开发套件

ALPHA-XILINX-KU060-SPACE — 适用于 Xilinx Kintex® Ultrascale™ KU060 和 TI 电源的 Alpha Data Systems 航空级 FPGA 开发套件

这是一款适用于 Xilinx® XQRKU060 FPGA(工业 -1 速度级)的开发套件。ADA-SDEV-KIT2 采用模块化电路板设计,具有 XRTC 兼容配置模块、两个 FMC 连接器、DDR3 DRAM、系统监控、航空级 TI 电源管理和温度感应解决方案。
发件人: Alpha Data Parallel Systems Ltd.
仿真模型

TPS7H4001-SP TINA Average Reference Design (Rev. A)

SLVMD56A.ZIP (144 KB) - TINA-TI Reference Design
仿真模型

TPS7H4001-SP TINA Transient Reference Design (Rev. A)

SLVMD57A.ZIP (168 KB) - TINA-TI Reference Design
仿真模型

TPS7H4001-SP PSpice Model (Rev. B)

SLVMD62B.ZIP (27 KB) - PSpice Model
仿真模型

TPS7H4001-SP PSpice Transient Model (Rev. B)

SLVMD63B.ZIP (37 KB) - PSpice Model
仿真模型

TPS7H4001-SP PSpice Worst-Case Analysis (WCA) Model (Rev. A)

SLVMDJ2A.ZIP (21 KB) - PSpice Model
模拟工具

PSPICE-FOR-TI — 适用于 TI 设计和模拟工具的 PSpice®

PSpice® for TI 可提供帮助评估模拟电路功能的设计和仿真环境。此功能齐全的设计和仿真套件使用 Cadence® 的模拟分析引擎。PSpice for TI 可免费使用,包括业内超大的模型库之一,涵盖我们的模拟和电源产品系列以及精选的模拟行为模型。

借助 PSpice for TI 的设计和仿真环境及其内置的模型库,您可对复杂的混合信号设计进行仿真。创建完整的终端设备设计和原型解决方案,然后再进行布局和制造,可缩短产品上市时间并降低开发成本。

在 PSpice for TI 设计和仿真工具中,您可以搜索 TI (...)
封装 引脚数 下载
(KGD) 0 了解详情
CFP (HKY) 34 了解详情

订购和质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 认证摘要
  • 持续可靠性监测

支持与培训

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