ZHCY174A February   2018  – February 2019

 

  1. 1引言
  2. 2大功率半导体选型现状
  3. 3为何选择 SiC？
  4. 4SiC 生态系统中的栅极驱动器
  5. 5数字隔离需求
  6. 6系统级优势和挑战
  7. 7总结
  8. 8参考文献
  9. 9重要声明

参考文献

  1. Strategy Analytics, 2017. https://www.strategyanalytics.com/access-services/automotive/powertrain-body-chassis-and-safety/reports/report-detail/hev-ev-market-forecast-oct-2017?slid=353165&spg=1#.
  2. Z. Chen, Y. Yao, D. Boroyevich, K.D.Ngo, P. Mattavelli and K. Rajashekara, “A 1200-V, 60-A SiC MOSFET multichip phase-leg module for high-temperature, high-frequency applications,” IEEE Transactions on Power Electronics 29, No. 5 (2014), 2307-2320.
  3. Z. Liang, P. Ning and F. Wang, “Development of advanced all-SiC power modules,” IEEE Transactions on Power Electronics 29, No. 5 (2014), 2289-2295.