SWRA534A January   2017  – June 2017 CC2650MODA

 

  1.   Using TI Certified Bluetooth® low energy Module (CC2650MODA) as Single-Chip Wireless MCU
    1.     Trademarks
    2. 1 Introduction
    3. 2 Device Setup
      1. 2.1 Required Hardware and Software
      2. 2.2 Hardware Setup
    4. 3 Running Sample Applications on CC2650 Module
      1. 3.1 Downloading and Running Sample Applications
      2. 3.2 Required Board-File Changes
    5. 4 References
  2.   Revision History

1 Introduction

The TI SimpleLink™ Bluetooth® low energy CC2650 Module BoosterPack™ Plug-in Module
(BOOSTXL-CC2650MA) allows users to quickly and easily add Bluetooth low energy to a LaunchPad™ development kit for developing network processer-based BLE applications. The CC2650 module can also be used to function as a standalone, System-on-Chip (SoC) device that can run additional sample applications using TI’s royalty-free Bluetooth low energy software stack (BLE-Stack) software development kit (SDK). This application report details how to run these standalone applications on the CC2650 module BoosterPack™, or on any custom board that incorporates the CC2650 module.

The CC2650 module contains the CC2650 wireless microcontroller (MCU) with an integrated antenna, an ARM®Cortex®-M3 32-bit MCU, in-system flash memory, 15 I/Os, and is precertified for FCC/IC, CE, and ARIB radio standards. When used with TI’s BLE-Stack, the module also has a Bluetooth RF-PHY qualified component that reduces the Bluetooth qualification testing. In addition, the module is pretested and uses an optimized antenna layout, reducing the need for expensive board redesigns and performing time-consuming RF tests with expensive test equipment on the production line. See CC2650MODA SimpleLink™ Bluetooth® low energy Wireless MCU Module for details on precertification.

It is assumed that the reader has working knowledge of the Bluetooth core specification version 4.2 [2] and is familiar with the concepts and build procedure documented in TI's BLE software developer’s guide [3] provided with the BLE-Stack SDK [4]. This application report assumes usage of BLE-STACK 2.2.1 which supports all Bluetooth 4.2 LE features. This application report uses the simple BLE peripheral sample application that is provided with the BLE-STACK SDK as a functional example. Because all device firmware resides and executes internally on the CC2650 wireless MCU, other BLE sample applications can run on the CC2650 module if the project is configured to account for the correct mapping of external peripheral I/O connections. For example, button presses and LEDs (used for demonstration purposes in some of the sample applications provided with the BLE-STACK SDK) require a specific I/O configuration mapping that is development kit specific.

TI recommends that standalone BLE applications are developed on the CC2650 LaunchPad (LAUNCHXL-CC2650) [5], then this application report can be used to provide guidance on porting those applications to the CC2650 module for product deployment. The CC2650 LaunchPad is a complete development kit featuring an integrated XDS110 JTAG debugger and access to all device I/Os. In addition, the XDS110 on the LaunchPad can function as a JTAG programmer for external CC26xx wireless MCUs. The LaunchPad includes a CC2650 wireless MCU in a 7 × 7 QFN package with 31 I/Os, and the CC2650 module uses a 5 × 5 QFN package with 15 I/Os. Aside from the number of I/Os and the RF configuration, all software is compatible and exchangeable across all CC2650 and CC2640 package configurations.