SPRZ272N September   2007  – April 2022 SM320F28335-EP , SM320F28335-HT , TMS320F28232 , TMS320F28232-Q1 , TMS320F28234 , TMS320F28234-Q1 , TMS320F28235 , TMS320F28235-Q1 , TMS320F28332 , TMS320F28333 , TMS320F28334 , TMS320F28335 , TMS320F28335-Q1

 

  1. 1Usage Notes and Advisories Matrices
    1. 1.1 Usage Notes Matrix
    2. 1.2 Advisories Matrix
  2. 2Nomenclature, Package Symbolization, and Revision Identification
    1. 2.1 Device and Development Support Tool Nomenclature
    2. 2.2 Devices Supported
    3. 2.3 Package Symbolization and Revision Identification
    4. 2.4 Silicon Change Overview
  3. 3Silicon Revision A Usage Notes and Advisories
    1. 3.1 Silicon Revision A Usage Notes
      1. 3.1.1 PIE: Spurious Nested Interrupt After Back-to-Back PIEACK Write and Manual CPU Interrupt Mask Clear Usage Note
      2. 3.1.2 Caution While Using Nested Interrupts
      3. 3.1.3 Watchdog: Watchdog Issues Reset After Bad Key is Written
      4. 3.1.4 McBSP: XRDY Bit can Hold the Not-Ready Status (0) if New Data is Written to the DX1 Register Without First Verifying if the XRDY Bit is in its Ready State (1)
      5. 3.1.5 Maximum Flash Program Time and Erase Time in Revision O of the TMS320F2833x, TMS320F2823x Real-Time Microcontrollers Data Sheet
    2. 3.2 Silicon Revision A Advisories
      1.      Advisory
      2.      Advisory
      3.      Advisory
      4.      Advisory
      5.      Advisory
      6.      Advisory
      7.      Advisory
      8.      Advisory
      9.      Advisory
      10.      Advisory
      11.      Advisory
      12.      Advisory
      13.      Advisory
  4. 4Silicon Revision 0 Usage Notes and Advisories
    1. 4.1 Silicon Revision 0 Usage Notes
    2. 4.2 Silicon Revision 0 Advisories
      1.      Advisory
      2.      Advisory
      3.      Advisory
  5. 5Documentation Support
  6. 6Trademarks
  7. 7Revision History

2.3 Package Symbolization and Revision Identification

Figure 2-1 and Figure 2-2 provide examples of the F2833x and F2823x device markings and define each of the markings. The device revision can be determined by the symbols marked on the top of the package as shown in Figure 2-1 and Figure 2-2. Some prototype devices may have markings different from those illustrated. Figure 2-3 shows the device nomenclature.

GUID-F284959D-DF3F-4F0E-A9C6-3F3865EA6D2C-low.gifFigure 2-1 Example of Device Markings (PGF)
Figure 2-2 Example of Device Markings (ZAY)
Table 2-1 Determining Silicon Revision From Lot Trace Code (F2833x and F2823x)
SILICON REVISION CODESILICON REVISIONREVISION ID
Address: 0x0883		COMMENTS
Blank
(no second letter in prefix)		Indicates Revision 00x0000This silicon revision is available as TMX only.
AIndicates Revision A0x0001This silicon revision is TMS.
LQFP = Low-Profile Quad Flatpack
HLQFP = Thermally Enhanced Low Profile Quad Flat Package
BGA = Ball Grid Array
nFBGA = New Fine Pitch Ball Grid Array
Figure 2-3 Device Nomenclature