SPRUIM6A October   2018  – November 2020

 

  1. 1Introduction
    1. 1.1 Key Features
  2. 2AM65x IDK Overview
  3. 3Common Processor Board
    1. 3.1 Key Features
    2. 3.2 Functional Block Diagram
    3. 3.3 Overview of Common Processor Board
      1. 3.3.1  Clocking
        1. 3.3.1.1 RTC Clock
        2. 3.3.1.2 Maxwell SoC Clock
        3. 3.3.1.3 Ethernet PHY Clocks
        4. 3.3.1.4 SERDES Clock
      2. 3.3.2  Reset
      3. 3.3.3  Power Requirements
        1. 3.3.3.1 Power Input
        2. 3.3.3.2 Overvoltage and Undervoltage Protection Circuit
        3. 3.3.3.3 Voltage Supervisor
        4. 3.3.3.4 Current Monitoring
        5. 3.3.3.5 Power Supply
        6. 3.3.3.6 Power Sequencing
        7. 3.3.3.7 SoC Power
      4. 3.3.4  Configuration
        1. 3.3.4.1 Boot Modes
        2. 3.3.4.2 JTAG
          1. 3.3.4.2.1 Test Automation
        3. 3.3.4.3 UART Interface
      5. 3.3.5  Memory Interfaces
        1. 3.3.5.1 DDR4 Interface
        2. 3.3.5.2 MMC Interface
          1. 3.3.5.2.1 SDHC Interface
          2. 3.3.5.2.2 eMMC Interface
        3. 3.3.5.3 OSPI Interface
        4. 3.3.5.4 SPI NOR Flash Interface
        5. 3.3.5.5 Board ID EEPROM Interface
        6. 3.3.5.6 Boot EEPROM Interface
      6. 3.3.6  Ethernet Interface
        1. 3.3.6.1 Gigabit Ethernet PHY Default Configuration
        2. 3.3.6.2 Ethernet LEDs
      7. 3.3.7  LCD Display Interface
      8. 3.3.8  USB 2.0 Interface
      9. 3.3.9  CSI-2 Interface
      10. 3.3.10 Application Card Interface
      11. 3.3.11 SERDES Interface
      12. 3.3.12 GPMC/DSS Interface
      13. 3.3.13 I2C Interface
      14. 3.3.14 SPI Interface
      15. 3.3.15 Timer and Interrupt
        1. 3.3.15.1 Timer
        2. 3.3.15.2 Interrupt
      16. 3.3.16 Fan Connector
  4. 4IDK Application Card
    1. 4.1 Key Features
    2. 4.2 Overview of IDK Application Board
      1. 4.2.1 Application Card Connector
      2. 4.2.2 Profibus Interface
      3. 4.2.3 CAN Interface
      4. 4.2.4 Rotary Switch
      5. 4.2.5 Industrial I/O Terminal Connector
      6. 4.2.6 Ethernet Interface
      7. 4.2.7 Board ID Memory
      8. 4.2.8 Power Supply
  5. 5x2 Lane PCIe Personality Card
    1. 5.1 Key Features
    2. 5.2 Overview of PCIex2 Daughter Card
      1. 5.2.1 Personality Card Connectors
      2. 5.2.2 USB 2.0 Interface
      3. 5.2.3 PCIe Interface
      4. 5.2.4 x2 Lane PCIe Personality Card Clocking
      5. 5.2.5 Board ID EEPROM Interface
      6. 5.2.6 x2 Lane PCIe Personality Card Power
  6. 6Known Issues
    1. 6.1 Determining the Revision and Date Code for the EVM
    2. 6.2 Known Issues for the A, E4, and E3 Revision
      1. 6.2.1 Lack of Reset for I2C IO Expander
    3. 6.3 Known Issues for the E4 & E3 Revision
      1. 6.3.1 Changes Unique to the E4 Revision Modified for 2.0 Revision
    4. 6.4 Known Issues for the E3 Revision
      1. 6.4.1 Resonance Observed on the SoC Side of Some Filters Associated with VDDA_1V8
      2. 6.4.2 Additional LDO Power Supply Needed for VDDA_1P8_SERDES0
      3. 6.4.3 Length of the RESET Signal to the PCIE Connectors on the SERDES Daughter Card
      4. 6.4.4 The PORz_OUT and MCU_PORz_OUT Signals Go High During Power Sequencing
      5. 6.4.5 Orientation of the Current Monitoring Shunt Resistors
      6. 6.4.6 SD Card IO Supply Capacitance
      7. 6.4.7 PHY Resistor Strapping Changed to Disable EEE Mode
      8. 6.4.8 The I2C Address for the I2C Boot Memory changed to 0x52
  7. 7Configuring the PRG0 and PRG1 Ethernet Interface to MII
    1. 7.1 Ethernet PHY Initial Conditions and TX Clock Signal Change
      1. 7.1.1 Ethernet PHY0 Clock and Initial Condition for MII
      2. 7.1.2 Ethernet PHY1 Clock and Initial Condition for MII
      3. 7.1.3 Ethernet PHY2 Clock and Initial Condition for MII
      4. 7.1.4 Ethernet PHY3 Clock and Initial Condition for MII
    2. 7.2 Ethernet PHY and TX Data Signals Change
      1. 7.2.1 Ethernet PHY0 TX Data Signals for MII
      2. 7.2.2 Ethernet PHY1 TX Data Signals for MII
      3. 7.2.3 Ethernet PHY2 TX Data Signals for MII
      4. 7.2.4 Ethernet PHY3 TX Data Signals for MII
  8. 8Revision History

6.4.1 Resonance Observed on the SoC Side of Some Filters Associated with VDDA_1V8

ISSUE: A resonance was observed between the filter and the SoC for the following power pins due to a lack of bulk capacitance after the filter.

  • FL16 VDDA_3P3_IOLDO_WKUP
  • FL22 VDDA_SRAM_CORE
  • FL23 VDDA_SRAM_MPU
  • FL25 VDDA_WKUP_LDO
  • FL27 VDDA_GP1
  • FL29 VDDA_GP9
  • FL30 VDDA_GP3

This has led to some noise on the internal power supply rails, resulting an increase in jitter on the Ethernet subsystem source clocks.

SOLUTION: A 4.7-uF capacitor was added from the SoC side of the above filters to ground to add sufficient bulk capacitance to dampen the resonance. Customers should include a footprint for a 4.7-uF capacitor in their designs to avoid this issue.

WORKAROUND: 4.7-uF capacitors can be added to the specified rails if problems are observed. Contact Texas Instruments for specific instructions if the change is needed.