SPRUIM6A October   2018  – November 2020

 

  1. 1Introduction
    1. 1.1 Key Features
  2. 2AM65x IDK Overview
  3. 3Common Processor Board
    1. 3.1 Key Features
    2. 3.2 Functional Block Diagram
    3. 3.3 Overview of Common Processor Board
      1. 3.3.1  Clocking
        1. 3.3.1.1 RTC Clock
        2. 3.3.1.2 Maxwell SoC Clock
        3. 3.3.1.3 Ethernet PHY Clocks
        4. 3.3.1.4 SERDES Clock
      2. 3.3.2  Reset
      3. 3.3.3  Power Requirements
        1. 3.3.3.1 Power Input
        2. 3.3.3.2 Overvoltage and Undervoltage Protection Circuit
        3. 3.3.3.3 Voltage Supervisor
        4. 3.3.3.4 Current Monitoring
        5. 3.3.3.5 Power Supply
        6. 3.3.3.6 Power Sequencing
        7. 3.3.3.7 SoC Power
      4. 3.3.4  Configuration
        1. 3.3.4.1 Boot Modes
        2. 3.3.4.2 JTAG
          1. 3.3.4.2.1 Test Automation
        3. 3.3.4.3 UART Interface
      5. 3.3.5  Memory Interfaces
        1. 3.3.5.1 DDR4 Interface
        2. 3.3.5.2 MMC Interface
          1. 3.3.5.2.1 SDHC Interface
          2. 3.3.5.2.2 eMMC Interface
        3. 3.3.5.3 OSPI Interface
        4. 3.3.5.4 SPI NOR Flash Interface
        5. 3.3.5.5 Board ID EEPROM Interface
        6. 3.3.5.6 Boot EEPROM Interface
      6. 3.3.6  Ethernet Interface
        1. 3.3.6.1 Gigabit Ethernet PHY Default Configuration
        2. 3.3.6.2 Ethernet LEDs
      7. 3.3.7  LCD Display Interface
      8. 3.3.8  USB 2.0 Interface
      9. 3.3.9  CSI-2 Interface
      10. 3.3.10 Application Card Interface
      11. 3.3.11 SERDES Interface
      12. 3.3.12 GPMC/DSS Interface
      13. 3.3.13 I2C Interface
      14. 3.3.14 SPI Interface
      15. 3.3.15 Timer and Interrupt
        1. 3.3.15.1 Timer
        2. 3.3.15.2 Interrupt
      16. 3.3.16 Fan Connector
  4. 4IDK Application Card
    1. 4.1 Key Features
    2. 4.2 Overview of IDK Application Board
      1. 4.2.1 Application Card Connector
      2. 4.2.2 Profibus Interface
      3. 4.2.3 CAN Interface
      4. 4.2.4 Rotary Switch
      5. 4.2.5 Industrial I/O Terminal Connector
      6. 4.2.6 Ethernet Interface
      7. 4.2.7 Board ID Memory
      8. 4.2.8 Power Supply
  5. 5x2 Lane PCIe Personality Card
    1. 5.1 Key Features
    2. 5.2 Overview of PCIex2 Daughter Card
      1. 5.2.1 Personality Card Connectors
      2. 5.2.2 USB 2.0 Interface
      3. 5.2.3 PCIe Interface
      4. 5.2.4 x2 Lane PCIe Personality Card Clocking
      5. 5.2.5 Board ID EEPROM Interface
      6. 5.2.6 x2 Lane PCIe Personality Card Power
  6. 6Known Issues
    1. 6.1 Determining the Revision and Date Code for the EVM
    2. 6.2 Known Issues for the A, E4, and E3 Revision
      1. 6.2.1 Lack of Reset for I2C IO Expander
    3. 6.3 Known Issues for the E4 & E3 Revision
      1. 6.3.1 Changes Unique to the E4 Revision Modified for 2.0 Revision
    4. 6.4 Known Issues for the E3 Revision
      1. 6.4.1 Resonance Observed on the SoC Side of Some Filters Associated with VDDA_1V8
      2. 6.4.2 Additional LDO Power Supply Needed for VDDA_1P8_SERDES0
      3. 6.4.3 Length of the RESET Signal to the PCIE Connectors on the SERDES Daughter Card
      4. 6.4.4 The PORz_OUT and MCU_PORz_OUT Signals Go High During Power Sequencing
      5. 6.4.5 Orientation of the Current Monitoring Shunt Resistors
      6. 6.4.6 SD Card IO Supply Capacitance
      7. 6.4.7 PHY Resistor Strapping Changed to Disable EEE Mode
      8. 6.4.8 The I2C Address for the I2C Boot Memory changed to 0x52
  7. 7Configuring the PRG0 and PRG1 Ethernet Interface to MII
    1. 7.1 Ethernet PHY Initial Conditions and TX Clock Signal Change
      1. 7.1.1 Ethernet PHY0 Clock and Initial Condition for MII
      2. 7.1.2 Ethernet PHY1 Clock and Initial Condition for MII
      3. 7.1.3 Ethernet PHY2 Clock and Initial Condition for MII
      4. 7.1.4 Ethernet PHY3 Clock and Initial Condition for MII
    2. 7.2 Ethernet PHY and TX Data Signals Change
      1. 7.2.1 Ethernet PHY0 TX Data Signals for MII
      2. 7.2.2 Ethernet PHY1 TX Data Signals for MII
      3. 7.2.3 Ethernet PHY2 TX Data Signals for MII
      4. 7.2.4 Ethernet PHY3 TX Data Signals for MII
  8. 8Revision History

3.1 Key Features

SoC:

  • Based on the K3 architecture with Quad-Core Arm®Cortex®-A53 Microprocessor and Dual-Core Arm Cortex-R5F Arm
  • Heatsink and support for 12-V fan

Memory:

  • 4-GB DDR4 supporting data rate up to 1600 MT/s
  • 16-GB eMMC Flash which can support HS400 speed of operation
  • Full size SD card, up to 64-GB density with UHS-1 support
  • 128-Mbit SPI EEPROM
  • 512-Mbit OSPI EEPROM
  • 256-Kbit I2C EEPROM for Boot

I/O Interface:

  • One MCU Gigabit Ethernet port and two Industrial Ethernet ports based on the Gigabit Industrial Communication Subsystem (PRU-ICSS-Gb) paired with Texas Instruments Gigabit Ethernet PHYs
  • One USB2.0 interface with Micro AB connector
  • CSI-2 connector to interface camera card

Expansion Bus:

  • I-PEX EVAFLEX5-VS connector to interface with the LCD adapter card
  • GPMC/DSS interface expansion connector for secondary display
  • Application connector to expansion application cards
  • SERDES expansion connector to support various SERDES modules

Debug:

  • XDS110 on-board emulator
  • Supports 20-pin JTAG connection from external emulator
  • Automatic selection between on-board and external emulator (higher priority)
  • Quad port UART to USB circuit over microB USB connector
  • Two UART, one SPI, and I2C ports connected to test header for slave testing of the AM65x device
  • Four timer signals from Maxwell connected to test header
  • Two push buttons to generate Interrupts

Power Supply:

  • Wide range DC input: 11 V to 28 V
  • Status output: LEDs to indicate power status
  • INA devices for current monitoring
  • Over- and under-voltage protection circuit

Compliance:

  • RoHS-compliant
  • REACH-compliant

In compliance with the Article 33 provision of the EU REACH regulation, we are notifying you that this module includes crystals (ABM3-25.000MHZ-D2Y-T, ABM3-12.000MHZ-D2Y-T) from Abracon LLC that contains two Substance of Very High Concern (SVHC) above 0.1%. These uses from Texas Instruments do not exceed 1 ton per year. The SVHC’s are Diboron trioxide CAS#1303-86-2 and Lead Oxide CAS# 1317-36-8.