SNVU944 March   2026 TPS7H1301-SP

 

  1.   1
  2.   Description
  3.   Features
  4.   4
  5. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Device Information
    4. 1.4 Specification
  6. 2Hardware
    1. 2.1 Power Requirements
    2. 2.2 Jumper Information
    3. 2.3 Test Points
    4. 2.4 Best Practices
  7. 3Implementation Results
    1. 3.1 Startup
    2. 3.2 Shutdown
    3. 3.3 Charge Pump Operation
    4. 3.4 LDO Stability Plots
  8. 4Hardware Design Files
    1. 4.1 Schematics
    2. 4.2 PCB Layouts
    3. 4.3 Bill of Materials (BOM)
  9. 5Compliance Information
    1. 5.1 Compliance and Certifications
  10. 6Additional Information
    1. 6.1 Trademarks
  11. 7Related Documentation

4.2 PCB Layouts

TPS7H1301EVM-CVAL Top Silkscreen Figure 4-3 Top Silkscreen.
TPS7H1301EVM-CVAL Top Solder Mask Figure 4-4 Top Solder Mask.
TPS7H1301EVM-CVAL Top Layer Figure 4-5 Top Layer.
TPS7H1301EVM-CVAL Bottom Layer Figure 4-6 Bottom Layer.
TPS7H1301EVM-CVAL Bottom Solder Mask Figure 4-7 Bottom Solder Mask.
TPS7H1301EVM-CVAL Bottom Silkscreen Figure 4-8 Bottom Silkscreen.
TPS7H1301EVM-CVAL Drill Drawing Figure 4-9 Drill Drawing.