SNVU944 March   2026 TPS7H1301-SP

 

  1.   1
  2.   Description
  3.   Features
  4.   4
  5. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Device Information
    4. 1.4 Specification
  6. 2Hardware
    1. 2.1 Power Requirements
    2. 2.2 Jumper Information
    3. 2.3 Test Points
    4. 2.4 Best Practices
  7. 3Implementation Results
    1. 3.1 Startup
    2. 3.2 Shutdown
    3. 3.3 Charge Pump Operation
    4. 3.4 LDO Stability Plots
  8. 4Hardware Design Files
    1. 4.1 Schematics
    2. 4.2 PCB Layouts
    3. 4.3 Bill of Materials (BOM)
  9. 5Compliance Information
    1. 5.1 Compliance and Certifications
  10. 6Additional Information
    1. 6.1 Trademarks
  11. 7Related Documentation

2.4 Best Practices

  • Calculate the expected VDroop and VDropout requirements for the expected load when selecting VIN and VOUT.

  • Ensure proper orientation of components on the negative rails (such as tantalum capacitors).

  • Determine VIN ripple requirements when selecting input capacitance.

  • Be aware of areas of the board that may heat up during operation.

CAUTION:
TPS7H1301EVM-CVAL
Hot surface. Contact can cause burns. Do Not Touch!