SLVUBD4B January 2018 – October 2020 TPS27SA08
Texas Instruments' HSS-MOTHERBOARDEVM evaluation module has a central socket for the supporting daughtercard with the high side switch device to be populated. The EVM supports the entire single-channel and dual channel low Ron (≤ 50-mΩ) high-side driver applications. The purpose of this EVM is to facilitate evaluation of the low Ron high side switches for the diagnostic features and drive resistive, capacitive, and inductive loads.
The EVM is a combination of a central motherboard and a row of daughterboards. The mother board has all connectors, jumpers, and test points. The daughter board has different footprints to support the low Ron family of TI's high side switch portfolio. The daughter board also has limiting resistors for the channel devices (TPS2HBxx-Q1) and since the 1 channel device (TPS1HA08-Q1) has a NC pin in that location the daughtercards will work for all of the devices.
The daughterboards have 2 different footprints: 24-pin PWP and 16-pin PWP. For installation, a single board from the panel has to broken, a device soldered down onto the main footprint, and connected to the motherboard.
Caution must be taken when soldering down the device as the main power pad on the back needs to be soldered correctly as to not affect performance. Please see PowerPAD Thermally Enhanced Package app note for more details about the solder profile and techniques.
The current-limiting resistors are on the bottom side of the daughterboard. They are all 10-kΩ, 0805 package. For the desired current limit value, the resistor can be replaced with different value. Also for the single channel devices the second resistor should be depopulated.