SLVU944B October   2015  – October 2020 TPS7H1101-SP

 

  1.   Trademarks
  2. 1Introduction
    1. 1.1 Related Documentation
  3. 2Description
  4. 3Test Setup
    1. 3.1 Equipment
      1. 3.1.1 Power Supplies
      2. 3.1.2 Load Number 1
      3. 3.1.3 Meters
      4. 3.1.4 Oscilloscope
    2. 3.2 Bench Test Setup Conditions
      1. 3.2.1 Headers Description and Jumper Placement
      2. 3.2.2 Testing
    3. 3.3 Power-Up Procedure
      1. 3.3.1  IOUT and VOUT Measurements
      2. 3.3.2  Output Current Limiting
      3. 3.3.3  High-Side Current Sense
      4. 3.3.4  Current Foldback
      5. 3.3.5  Power Good
      6. 3.3.6  Dropout Voltage
      7. 3.3.7  Transient Response
      8. 3.3.8  Current Sharing
      9. 3.3.9  Soft-Start
      10. 3.3.10 Enable and Disable
      11. 3.3.11 Turn-Off
  5. 4Board Layout
    1. 4.1 EVM Layout Flexibility
  6. 5Schematic and Bill of Materials
  7.   Revision History

EVM Layout Flexibility

The EVM is layed out to provide flexibility for the customer evaluation thus providing test points and or cold nose probes to monitor various critical nodes of the design as highlighted in the schematic.

Additionally, placeholder is provided thus one can add esr in series with the output capacitor (R47 in series with C39) thus making it easier to evaluate performance with increased capacitor esr.

GUID-2CDF3C4F-82B7-4C05-9582-CBEE5F026E13-low.gifFigure 4-1 Component Placement (Top Side)
GUID-9F86F314-6FCE-4924-8673-F4E60DF9D75E-low.gifFigure 4-2 Component Placement (Bottom Side)
GUID-0AAEAB41-DE55-4E65-A776-B566B46DD989-low.pngFigure 4-3 PCB Layout (Top Layer)
GUID-32C760D7-8EBD-45D7-B2C8-DF05E049444C-low.gifFigure 4-4 Board Layout - Second Layer (Mid Layer 1)
GUID-3C9FBB68-5BA1-4969-B7F0-1CDE8BF8AACB-low.pngFigure 4-5 Board Layout - Third Layer (Mid Layer 2)
GUID-22B7343C-F56D-416D-860C-49AD3F868C8E-low.pngFigure 4-6 Board Layout - Fourth Layer (Bottom Layer)