SLVK227 October   2025 TPS7H4012-SP , TPS7H4013-SP

 

  1.   1
  2.   TPS7H4012-SP and TPS7H4013-SP Single-Event Effects (SEE)
  3.   Trademarks
  4. Introduction
  5. Single-Event Effects (SEE)
  6. Device and Test Board Information
  7. Irradiation Facility and Setup
  8. Depth, Range, and LETEFF Calculation
  9. Test Setup and Procedures
  10. Destructive Single-Event Effects (DSEE)
    1. 7.1 Single-Event Latch-up (SEL) Results
    2. 7.2 Single-Event Burnout (SEB) and Single-Event Gate Rupture (SEGR) Results
  11. Single-Event Transients (SET)
  12. Event Rate Calculations
  13. 10Summary
  14.   A References

Device and Test Board Information

The TPS7H401x-SP is packaged in a 44-pin plastic package as shown in Figure 3-1. The TPS7H401x-SP evaluation module (EVM) was used to evaluate the performance and characteristics of the TPS7H401x-SP under heavy ion radiation. The TPS7H4012EVM is shown in Figure 3-2 and its schematic is shown in Figure 3-4. The TPS7H4013EVM is shown in Figure 3-3 and its schematic is shown in Figure 3-5. The TPS7H401xEVM was used for this test campaign with TPS7H410x-SP units populated onto U1.

 Photograph of Delidded TPS7H401x-SP (Left) and Pinout Diagram (Right)Figure 3-1 Photograph of Delidded TPS7H401x-SP (Left) and Pinout Diagram (Right)

The package was delidded to reveal the die face for all heavy-ion testing.

 TPS7H4012-SP EVM Top ViewFigure 3-2 TPS7H4012-SP EVM Top View.

Jumper on J6 was configured in the 2-3 position for all testing

 TPS7H4013-SP EVM Top ViewFigure 3-3 TPS7H4013-SP EVM Top View. Jumper on J6 was configured in the 2-3 position for all testing
 TPS7H4012EVM SchematicsFigure 3-4 TPS7H4012EVM Schematics
 TPS7H4013EVM SchematicsFigure 3-5 TPS7H4013EVM Schematics