SLOK022 December 2024 TLV4H290-SEP
A step-stress (20k and 30k) test method was used to determine the TID hardness level.
That is, after a predetermined TID level was reached, an electrical test was performed on a given sample of parts to verify that the units are within specified data sheet electrical test limits. MIL-STD-883, Test Method 1019.9, Condition A was used in this case. If this passes, then the wafer lot can be certified as an RHA wafer lot.
Table 4-2 list the serialized samples that was used during the RHA characterization.
| HDR = 265rad(Si)/s | |
|---|---|
| Total Samples: 10/dose level (6 biased + 6 unbiased) | |
| Exposure Levels | |
| 20krad(Si) | 30krad(Si) |
| Biased | Biased |
03, 004, 005, 006, 007, 008 (Wafer 1) | 015, 016, 017, 018, 019, 020 (Wafer 1) |
| Unbiased | Unbiased |
| 09, 010, 011, 012, 013, 014 (Wafer 1) | 021, 022, 023, 024, 025, 026 (Wafer 1) |