SLAU358Q September   2011  – October 2019

 

  1.   Read This First
    1.     If You Need Assistance
    2.     Trademarks
    3.     Related Documentation From Texas Instruments
    4.     FCC and CE Compliance
  2. 1Introduction
    1. 1.1 Software Installation
    2. 1.2 Driver Installation
    3. 1.3 Hardware Installation
  3. 2Operation
    1. 2.1 Programming MSP Flash Devices Using the MSP Gang Programmer
      1. 2.1.1  Programming Using Interactive Mode
        1. 2.1.1.1 GO
        2. 2.1.1.2 Erase
        3. 2.1.1.3 Blank Check
        4. 2.1.1.4 Program
        5. 2.1.1.5 Verify
        6. 2.1.1.6 Read
      2. 2.1.2  Programming From Image
      3. 2.1.3  Programming From Script
        1. 2.1.3.1 Script Limitations
        2. 2.1.3.2 Command Syntax
        3. 2.1.3.3 Instructions
      4. 2.1.4  Programming in Standalone Mode
      5. 2.1.5  Memory Setup for GO, Erase, Program, Verify, and Read
        1. 2.1.5.1 Writing and Reading BSL Flash Sectors in the MSP430F5xx and MSP430F6xx MCUs
      6. 2.1.6  Secure Device Setup and Memory Protection
      7. 2.1.7  Programming MCU With IP Encapsulated Segment
      8. 2.1.8  Serialization
      9. 2.1.9  Creating and Using Images
      10. 2.1.10 Programming From Image File
      11. 2.1.11 Programming From SD Card
      12. 2.1.12 File Extensions
      13. 2.1.13 Checksum Calculation
      14. 2.1.14 Commands Combined With the Executable File
    2. 2.2 Data Viewers
    3. 2.3 Status Messages
    4. 2.4 Self Test
    5. 2.5 Label
    6. 2.6 Preferences
      1. 2.6.1 USB ID Number
      2. 2.6.2 COM Port
      3. 2.6.3 LCD Contrast
      4. 2.6.4 Checksum – Gang430 Standard
    7. 2.7 Benchmarks
      1. 2.7.1 Benchmarks for MSP430F5xx
      2. 2.7.2 Benchmarks for MSP430FR5xx
      3. 2.7.3 Benchmarks for MSP430F2xx
      4. 2.7.4 Benchmarks for MSP432P401R
  4. 3Firmware
    1. 3.1 Commands
    2. 3.2 Firmware Interface Protocol
    3. 3.3 Synchronization Sequence
    4. 3.4 Command Messages
      1. 3.4.1 Frame Structure
      2. 3.4.2 Checksum
    5. 3.5 Detailed Description of Commands
      1. 3.5.1 General
      2. 3.5.2 Commands Supported by the BOOT Loader
        1. 3.5.2.1  "Hello" Command
        2. 3.5.2.2  Boot Commands Disable
        3. 3.5.2.3  Boot Commands Enable
        4. 3.5.2.4  Get Diagnostic Command
        5. 3.5.2.5  Select Baud Rate Command
        6. 3.5.2.6  Erase Firmware Command
        7. 3.5.2.7  Load Firmware Command
        8. 3.5.2.8  Exit from Firmware Update Command
        9. 3.5.2.9  Get Label Command
        10. 3.5.2.10 Get Progress Status
      3. 3.5.3 Commands Supported by Application Firmware
        1. 3.5.3.1 Select Image Command
        2. 3.5.3.2 Main Process Command
        3. 3.5.3.3 Set Temporary Configuration in MSP-GANG Command
        4. 3.5.3.4 Get Selected Status Command
        5. 3.5.3.5 Read From Gang Data Buffer Command
        6. 3.5.3.6 Write to Gang Data Buffer Command
      4. 3.5.4 API Firmware Commands That Should Not be Used
        1. 3.5.4.1  Interactive Process Command
        2. 3.5.4.2  Erase Image Command
        3. 3.5.4.3  Read Info Memory From MSP-GANG Command
        4. 3.5.4.4  Write to MSP-GANG Info Memory Command
        5. 3.5.4.5  Verify Access Key Command
        6. 3.5.4.6  Write to Image Block Command
        7. 3.5.4.7  Verify Image Check Sum Command
        8. 3.5.4.8  Read Image Header Command
        9. 3.5.4.9  Disable API Interrupts Command
        10. 3.5.4.10 Display Message on LCD Display Command
        11. 3.5.4.11 Set IO State Command
  5. 4Dynamic Link Library for MSP-GANG Programmer
    1. 4.1 Gang430.dll Wrapper Description
    2. 4.2 MSP-GANG.dll Description
      1. 4.2.1  MSPGANG_GetDataBuffers_ptr
      2. 4.2.2  MSPGANG_SetGangBuffer, MSPGANG_GetGangBuffer
      3. 4.2.3  MSPGANG_GetDevice
      4. 4.2.4  MSPGANG_LoadFirmware
      5. 4.2.5  MSPGANG_InitCom
      6. 4.2.6  MSPGANG_ReleaseCom
      7. 4.2.7  MSPGANG_GetErrorString
      8. 4.2.8  MSPGANG_SelectBaudrate
      9. 4.2.9  MSPGANG_GetDiagnostic
      10. 4.2.10 MSPGANG_MainProcess
      11. 4.2.11 MSPGANG_InteractiveProcess
      12. 4.2.12 MSPGANG_Interactive_Open_Target_Device
      13. 4.2.13 MSPGANG_Interactive_Close_Target_Device
      14. 4.2.14 MSPGANG_Interactive_DefReadTargets
      15. 4.2.15 MSPGANG_Interactive_ReadTargets
      16. 4.2.16 MSPGANG_Interactive_ReadBytes
      17. 4.2.17 MSPGANG_Interactive_WriteWord_to_RAM
      18. 4.2.18 MSPGANG_Interactive_WriteByte_to_RAM
      19. 4.2.19 MSPGANG_Interactive_WriteBytes_to_RAM
      20. 4.2.20 MSPGANG_Interactive_WriteBytes_to_FLASH
      21. 4.2.21 MSPGANG_Interactive_Copy_Gang_Buffer_to_RAM
      22. 4.2.22 MSPGANG_Interactive_Copy_Gang_Buffer_to_FLASH
      23. 4.2.23 MSPGANG_Interactive_EraseSectors
      24. 4.2.24 MSPGANG_Interactive_BlankCheck
      25. 4.2.25 MSPGANG_Interactive_DCO_Test
      26. 4.2.26 MSPGANG_SelectImage
      27. 4.2.27 MSPGANG_EraseImage
      28. 4.2.28 MSPGANG_CreateGangImage
      29. 4.2.29 MSPGANG_LoadImageBlock
      30. 4.2.30 MSPGANG_VerifyPSAImageBlock
      31. 4.2.31 MSPGANG_ReadImageBlock
      32. 4.2.32 MSPGANG_Read_Code_File
      33. 4.2.33 MSPGANG_Save_Config, MSPGANG_Load_Config, MSPGANG_Default_Config
      34. 4.2.34 MSPGANG_SetConfig, MSPGANG_GetConfig
      35. 4.2.35 MSPGANG_GetNameConfig, MSPGANG_SetNameConfig
      36. 4.2.36 MSPGANG_SetTmpGANG_Config
      37. 4.2.37 MSPGANG_GetLabel
      38. 4.2.38 MSPGANG_GetInfoMemory, MSPGANG_SetInfoMemory
      39. 4.2.39 MSPGANG_Get_qty_MCU_Type, MSPGANG_Set_MCU_Type, MSPGANG_Get_MCU_TypeName, MSPGANG_Get_qty_MCU_Family, MSPGANG_Get_MCU_FamilyName, MSPGANG_Get_MCU_Name
      40. 4.2.40 MSPGANG_Set_MCU_Name
      41. 4.2.41 MSPGANG_HW_devices
      42. 4.2.42 MSPGANG_GetProgressStatus
      43. 4.2.43 MSPGANG_GetAPIStatus
      44. 4.2.44 MSPGANG_Set_IO_State
      45. 4.2.45 MSPGANG_Convert_Address
      46. 4.2.46 MSPGANG_Memory_Header_text
      47. 4.2.47 MSPGANG_Interactive_ClrLockedDevice
      48. 4.2.48 MSPGANG_Get_Code_Info
      49. 4.2.49 MSPGANG_MakeSound
      50. 4.2.50 MSPGANG_CallBack_ProgressBar
      51. 4.2.51 MSPGANG_GetPCHardwareFingerprint
      52. 4.2.52 MSPGANG_Flash_valid_addr
  6. 5Schematics
    1. 5.1 Schematics
  7. 6Frequently Asked Questions
    1. 6.1 Question: Why does device init, connect, or programming fail?
    2. 6.2 Question: Can I use single wires for connection between MSP-GANG and target device?
    3. 6.3 Question: How to serialize parts?
    4. 6.4 Question: How to have parts run after programming?
    5. 6.5 Question: What are possible reasons for the part to fail Verify step?
  8.   Revision History

6.1 Question: Why does device init, connect, or programming fail?

Answer: Frequently the cause is a bad connection between the MSP-GANG Programmer and the target device. A 14-wire ribbon cable is provided for JTAG/SBW or BSL connection between MSP-GANG and target device. The ribbon cable has an impedance of approximately 100 Ω and has DC lines in the ribbon cable to provide good isolation between signal wires (TDI, TCK, TMS, TDO). Each signal wire is separated by a DC wire to minimize crosstalk between the signal wires. The following pinout used in the MSP-GANG on each JTAG connector:

1 - TDO (Signal wire) 2 - Vcc / Vcc sense (DC wire) 3 - TDI (Signal wire) 4 - Vcc sense (DC wire) 5 - TMS (Signal wire) 6 - n/c (DC wire) 7 - TCK (Signal wire) 8 - TEST (DC wire in JTAG) 9 - GND (DC wire) 10 - n/c (DC wire) 11 - RESET (DC wire in JTAG) 12 - BSL-Tx (Signal wire) 13 - n/c (DC wire) 14 - BSL-Rx (Signal wire)

The provided 14-pin connector might not be ideal for some customers who want to minimize the number of wires and pinout order. When using a custom cable, make sure to address the issue of crosstalk between signal cables. Unfortunately, in many cases the custom cable does not provide good isolation between signal wires. As an example of a bad connection, the following uses an 8-wire ribbon cable for JTAG communication:

1 - Vcc / Vcc sense (DC wire) 2 - TDO (Signal wire) 3 - TDI (Signal wire) 4 - TMS (Signal wire) 5 - TCK (Signal wire) 6 - TEST (DC wire in JTAG) 7 - GND (DC wire) 8 - RESET (DC wire in JTAG)

On this connection, the TMS signal is coupled with the TCK and TDI lines and can generate additional TCK pulses on the TCK wire (rise time on TMS line can be seen on the TCK line also and can be detected by the MSP MCU as an additional unexpected TCK pulse).