SLAA996A June   2021  – June 2021 TPA6304-Q1

 

  1.   Trademarks
  2. 1Introduction
  3. 2Understanding the Thermal Flow
  4. 3Understanding the Test and System Conditions
    1. 3.1 Device Efficiency
    2. 3.2 Test Signals
      1. 3.2.1 Sinusoidal Signal
      2. 3.2.2 Pink Noise
      3. 3.2.3 Music File
    3. 3.3 Ambient Temperature
    4. 3.4 Junction Temperature
    5. 3.5 Thermal Interface Material and Heatsink
  5. 4Calculating Dynamic Thermal Dissipation
  6. 5Designing a Realistic Thermal Test
  7. 6Thermal Tests
    1. 6.1 Test Setup
    2. 6.2 5W 1kHz Sine Wave Test
      1. 6.2.1 Calculations
      2. 6.2.2 Dynamic Calculation Results
      3. 6.2.3 Tested Results
      4. 6.2.4 Summary of Results
    3. 6.3 10W 1kHz Sine Wave Test
      1. 6.3.1 Calculations
      2. 6.3.2 Dynamic Calculation Results
      3. 6.3.3 Tested Results
      4. 6.3.4 Summary of Results
    4. 6.4 5W Pink Noise Test
      1. 6.4.1 Calculations
      2. 6.4.2 Dynamic Calculation Results
      3. 6.4.3 Tested Results
      4. 6.4.4 Summary of Results
    5. 6.5 10W 1kHz 85°C Test
      1. 6.5.1 Calculations
      2. 6.5.2 Dynamic Calculation Results
      3. 6.5.3 Tested Results
      4. 6.5.4 Summary of Results
  8. 7Overall Summary
  9. 8References
  10. 9Revision History

1 Introduction

In semiconductors, power losses are the result of inherent impedances in the device. These power losses are converted into heat and cannot be ignored. The same is true for integrated Class-D amplifiers. To remove this heat either the PCB or a top-mounted heatsink attached to the device. If the thermal solution is not properly designed for the required conditions, the audio amplifier can experience reduced performance and potentially trigger the thermal protection.