To protect the device from over-heating, thermal sensor is placed near the die to constatnly measure the die temperature. The sensor will trigger Thermal Foldback when the die temperature exceeds the programmable threshold. During Thermal Foldback event, the output power will attenutate relatively to the over-temperature until it reaches programmable Thermal Max Attenuation. This feature will release the attentuation automatically after the die temperature is below the threshold again and Hold Time period has passed. Combinig with the over-temperature fault, these two features can provide a comprehensive thermal protection mechanism. For more detailed explanation about Thermal Foldback, please refer to TAS2562, TAS2563 Thermal Foldback Feature on SmartAmps and the datasheet.

Figure 1-10 Thermal Foldback.